JPS611032A - ボンデイング装置 - Google Patents

ボンデイング装置

Info

Publication number
JPS611032A
JPS611032A JP60019685A JP1968585A JPS611032A JP S611032 A JPS611032 A JP S611032A JP 60019685 A JP60019685 A JP 60019685A JP 1968585 A JP1968585 A JP 1968585A JP S611032 A JPS611032 A JP S611032A
Authority
JP
Japan
Prior art keywords
chip
bonding
tool
semiconductor integrated
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60019685A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6120137B2 (enExample
Inventor
Katsuyuki Kawase
川瀬　勝之
Yuji Kanda
神田　祐治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Kaijo Denki Co Ltd
Marine Instr Co Ltd
Original Assignee
NEC Corp
Kaijo Denki Co Ltd
Nippon Electric Co Ltd
Marine Instr Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Kaijo Denki Co Ltd, Nippon Electric Co Ltd, Marine Instr Co Ltd filed Critical NEC Corp
Priority to JP60019685A priority Critical patent/JPS611032A/ja
Publication of JPS611032A publication Critical patent/JPS611032A/ja
Publication of JPS6120137B2 publication Critical patent/JPS6120137B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/07141—

Landscapes

  • Wire Bonding (AREA)
JP60019685A 1985-02-04 1985-02-04 ボンデイング装置 Granted JPS611032A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60019685A JPS611032A (ja) 1985-02-04 1985-02-04 ボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60019685A JPS611032A (ja) 1985-02-04 1985-02-04 ボンデイング装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP12673676A Division JPS5351968A (en) 1976-10-21 1976-10-21 Bonding unit

Publications (2)

Publication Number Publication Date
JPS611032A true JPS611032A (ja) 1986-01-07
JPS6120137B2 JPS6120137B2 (enExample) 1986-05-21

Family

ID=12006088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60019685A Granted JPS611032A (ja) 1985-02-04 1985-02-04 ボンデイング装置

Country Status (1)

Country Link
JP (1) JPS611032A (enExample)

Also Published As

Publication number Publication date
JPS6120137B2 (enExample) 1986-05-21

Similar Documents

Publication Publication Date Title
TWI702660B (zh) 黏晶裝置及半導體裝置的製造方法
US9452492B2 (en) Systems and methods for forming apertures in microfeature workpieces
US5768759A (en) Method and apparatus for reflective in-flight component registration
US9579825B2 (en) Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces
US5500502A (en) Bonding method and apparatus
US20170213774A1 (en) Package wafer processing method
US20090223942A1 (en) Lead Frame Isolation Using Laser Technology
US5156320A (en) Wire bonder and wire bonding method
JP2000150970A (ja) 発光素子のボンディング方法および装置
JPS611032A (ja) ボンデイング装置
CN101165707B (zh) 用于电子器件模式识别的图像捕获
US6738504B1 (en) Inspection apparatus for semiconductor device and parts mounter using same
KR102652796B1 (ko) 반도체 소자 본딩 장치 및 반도체 소자 본딩 방법
JPH06283819A (ja) 光素子のダイボンディング方法及びそのダイボンディング装置
JPS611033A (ja) ボンデイングの方法
JP5010975B2 (ja) コプラナリティ検査装置検査方法および装置
JPH0482243A (ja) 半導体素子実装装置
JP2000294573A (ja) ボンディング装置
JP2854481B2 (ja) ボンディング装置及びその方法
JPS605057B2 (ja) ワイヤボンデイング装置
JPH08335603A (ja) 半導体装置の製造方法
JPH0582741B2 (enExample)
KR20250163771A (ko) 다이 본딩 장치 및 이를 이용한 다이 본딩 방법
JPH0810188Y2 (ja) ボンディング装置
JPH0743112A (ja) 発光素子の発光点検出方法および位置決め装置