JPS6110304Y2 - - Google Patents

Info

Publication number

JPS6110304Y2

JPS6110304Y2 JP9195678U JP9195678U JPS6110304Y2 JP S6110304 Y2 JPS6110304 Y2 JP S6110304Y2 JP 9195678 U JP9195678 U JP 9195678U JP 9195678 U JP9195678 U JP 9195678U JP S6110304 Y2 JPS6110304 Y2 JP S6110304Y2

Authority

JP

Japan

Prior art keywords

terminal

lead

lead wire

synthetic resin

lead portion

Prior art date

1978-07-04

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 14
• 229920003002 synthetic resin Polymers 0.000 claims description 6
• 239000000057 synthetic resin Substances 0.000 claims description 6
• 239000002184 metal Substances 0.000 claims description 3
• 229910052751 metal Inorganic materials 0.000 claims description 3
• 238000003825 pressing Methods 0.000 claims description 3
• 239000011248 coating agent Substances 0.000 claims 1
• 238000000576 coating method Methods 0.000 claims 1
• 239000004020 conductor Substances 0.000 description 4
• PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
• 238000000034 method Methods 0.000 description 2
• 238000005476 soldering Methods 0.000 description 2
• 229910000906 Bronze Inorganic materials 0.000 description 1
• OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
• BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
• 239000010974 bronze Substances 0.000 description 1
• 238000007796 conventional method Methods 0.000 description 1
• KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
• 238000002788 crimping Methods 0.000 description 1
• PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
• 229910052737 gold Inorganic materials 0.000 description 1
• 239000010931 gold Substances 0.000 description 1
• 238000005304 joining Methods 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 229910052759 nickel Inorganic materials 0.000 description 1
• 229920005989 resin Polymers 0.000 description 1
• 239000011347 resin Substances 0.000 description 1
• 229920002379 silicone rubber Polymers 0.000 description 1
• 239000004945 silicone rubber Substances 0.000 description 1