JPS61102830U - - Google Patents

Info

Publication number
JPS61102830U
JPS61102830U JP1985187919U JP18791985U JPS61102830U JP S61102830 U JPS61102830 U JP S61102830U JP 1985187919 U JP1985187919 U JP 1985187919U JP 18791985 U JP18791985 U JP 18791985U JP S61102830 U JPS61102830 U JP S61102830U
Authority
JP
Japan
Prior art keywords
infrared detector
detection element
printed wiring
wiring board
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985187919U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS61102830U publication Critical patent/JPS61102830U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/34—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using capacitors, e.g. pyroelectric capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)

Description

【図面の簡単な説明】
第１図は本考案の第１の実施例の概略斜視図、
第２図は本考案の第２の実施例の概略分解斜視図
、第３図ないし第５図はそれらの実施例における
要部の種々異なる変形例を示す概略断面図、第６
図は従来の赤外線検出器の概略斜視図である。 １……基板、２，３，４，２２，２３，２３ａ
，２４……接続ピン、６……検出素子、１０……
高抵抗体、１１……電界効果トランジスタ、１２
，１２ａ……プリント配線板、２５……貫通孔、
２６……窪み、２７……間隔片。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) ケース内にて基板上１上に設けられた少く
    とも１つの検出素子６を備え、この検出素子がそ
    の基板上で他のデバイス１０，１１と接続され、
    かつその基板からは接続ピン２，３，４，２２，
    ２３，２３ａ，２４が下方に向けて突出させられ
    ている赤外線検出器において、前記基板１の内面
    上に直接にプリント配線板１２，１２ａが固定さ
    れ、このプリント配線板によつて前記検出素子６
    が前記他のデバイス１０，１１に電気的に接続さ
    れ、前記検出素子６は少なくともその中央領域が
    その下に置かれる部材１２，１２ａからある間隔
    を有することを特徴とする赤外線検出器。 (2) 前記間隔は少なくとも０．１mmの大きさで
    あることを特徴とする実用新案登録請求の範囲第
    １項記載の赤外線検出器。 (3) 前記プリント配線板１２，１２ａ前記検出
    素子６の中央領域の下方に位置する部分に空所が
    形成されていることを特徴とする実用新案登録請
    求の範囲第１項記載の赤外線検出器。 (4) 前記空所は前記プリント配線板１２，１２
    ａに貫通孔２５の形態にて形成されていることを
    特徴とする実用新案登録請求の範囲第３項記載の
    赤外線検出器。 (5) 前記空所は前記プリント配線板１２，１２
    ａに窪み２６の形態にて形成されていることを特
    徴とする実用新案登録請求の範囲第３項記載の赤
    外線検出器。 (6) 前記検出素子６は前記プリント配線板１２
    ，１２ａからある間隔を持たされていることを特
    徴とする実用新案登録請求の範囲第１項または第
    ２項記載の赤外線検出器。
JP1985187919U 1984-12-13 1985-12-04 Pending JPS61102830U (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE8436542 1984-12-13
DE3528557 1985-08-08

Publications (1)

Publication Number Publication Date
JPS61102830U true JPS61102830U (ja) 1986-06-30

Family

ID=25834872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985187919U Pending JPS61102830U (ja) 1984-12-13 1985-12-04

Country Status (2)

Country Link
EP (1) EP0184747A1 (ja)
JP (1) JPS61102830U (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8705296U1 (de) * 1987-04-09 1988-08-04 Heimann Gmbh, 6200 Wiesbaden Infrarotdetektor
EP0308749A3 (de) * 1987-09-25 1990-07-11 Siemens Aktiengesellschaft Elektrooptische Baugruppe
EP0308748A3 (de) * 1987-09-25 1990-07-04 Siemens Aktiengesellschaft Elektrooptische Baugruppe
DE8808815U1 (de) * 1988-06-23 1988-09-15 Heimann Optoelectronics Gmbh, 65199 Wiesbaden Infrarotdetektor
JPH0258008A (ja) * 1988-08-24 1990-02-27 Sumitomo Electric Ind Ltd 光モジュール
JPH0682073B2 (ja) * 1988-08-30 1994-10-19 株式会社村田製作所 焦電型赤外線センサ
US5323025A (en) * 1989-05-18 1994-06-21 Murata Mfg. Co., Ltd. Pyroelectric IR-sensor having a low thermal conductive ceramic substrate
EP0398725B1 (en) * 1989-05-18 1994-08-03 Murata Manufacturing Co., Ltd. Pyroelectric IR - sensor
DE4111135A1 (de) * 1991-04-06 1992-10-08 Diehl Gmbh & Co Sensor
JP3680303B2 (ja) * 1994-11-08 2005-08-10 住友電気工業株式会社 光電変換モジュール
JPH08148702A (ja) * 1994-11-18 1996-06-07 Sumitomo Metal Mining Co Ltd 赤外線検知器
CN107990979B (zh) * 2017-11-25 2020-07-28 贵阳永青仪电科技有限公司 一种防电涌光敏传感器
CN108007487B (zh) * 2017-11-25 2020-08-28 贵阳永青仪电科技有限公司 一种光敏传感器
CN109738075A (zh) * 2019-02-15 2019-05-10 东莞传晟光电有限公司 一种to基座热释电传感器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3757127A (en) * 1970-08-10 1973-09-04 Cogar Corp Photodetector packing assembly
DE2211699A1 (de) * 1972-03-10 1973-09-13 Sensors Inc Filmfoermiger strahlungsdetektor und verfahren zur herstellung desselben
IT1209844B (it) * 1981-02-09 1989-08-30 Selenia Ind Elettroniche Dispositivo per rivelazione dell'infrarosso a molti elementi ad elevata densita' di passanti a bassa per dita termica
JPS57193094A (en) * 1981-05-18 1982-11-27 Matsushita Electric Ind Co Ltd Electronic circuit part and method of mounting same
GB2126795B (en) * 1982-09-09 1986-12-03 Plessey Co Plc Optical device

Also Published As

Publication number Publication date
EP0184747A1 (de) 1986-06-18

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