JPS61102363U - - Google Patents

Info

Publication number
JPS61102363U
JPS61102363U JP1984185470U JP18547084U JPS61102363U JP S61102363 U JPS61102363 U JP S61102363U JP 1984185470 U JP1984185470 U JP 1984185470U JP 18547084 U JP18547084 U JP 18547084U JP S61102363 U JPS61102363 U JP S61102363U
Authority
JP
Japan
Prior art keywords
nozzle
chamber
tip
solder
nozzle tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984185470U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984185470U priority Critical patent/JPS61102363U/ja
Publication of JPS61102363U publication Critical patent/JPS61102363U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1984185470U 1984-12-05 1984-12-05 Pending JPS61102363U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984185470U JPS61102363U (enExample) 1984-12-05 1984-12-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984185470U JPS61102363U (enExample) 1984-12-05 1984-12-05

Publications (1)

Publication Number Publication Date
JPS61102363U true JPS61102363U (enExample) 1986-06-30

Family

ID=30742941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984185470U Pending JPS61102363U (enExample) 1984-12-05 1984-12-05

Country Status (1)

Country Link
JP (1) JPS61102363U (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5874276A (ja) * 1981-10-28 1983-05-04 Toshiba Corp 液状体の吐出装置
JPS5930370B2 (ja) * 1978-09-26 1984-07-26 株式会社クボタ 刈取機用強制分草装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5930370B2 (ja) * 1978-09-26 1984-07-26 株式会社クボタ 刈取機用強制分草装置
JPS5874276A (ja) * 1981-10-28 1983-05-04 Toshiba Corp 液状体の吐出装置

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