JPS61102048U - - Google Patents

Info

Publication number
JPS61102048U
JPS61102048U JP1984187130U JP18713084U JPS61102048U JP S61102048 U JPS61102048 U JP S61102048U JP 1984187130 U JP1984187130 U JP 1984187130U JP 18713084 U JP18713084 U JP 18713084U JP S61102048 U JPS61102048 U JP S61102048U
Authority
JP
Japan
Prior art keywords
semiconductor chip
heat sink
resin
thin
partially
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984187130U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0334913Y2 (es
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984187130U priority Critical patent/JPH0334913Y2/ja
Publication of JPS61102048U publication Critical patent/JPS61102048U/ja
Application granted granted Critical
Publication of JPH0334913Y2 publication Critical patent/JPH0334913Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • H01L2924/1815Shape

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1984187130U 1984-12-10 1984-12-10 Expired JPH0334913Y2 (es)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984187130U JPH0334913Y2 (es) 1984-12-10 1984-12-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984187130U JPH0334913Y2 (es) 1984-12-10 1984-12-10

Publications (2)

Publication Number Publication Date
JPS61102048U true JPS61102048U (es) 1986-06-28
JPH0334913Y2 JPH0334913Y2 (es) 1991-07-24

Family

ID=30744595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984187130U Expired JPH0334913Y2 (es) 1984-12-10 1984-12-10

Country Status (1)

Country Link
JP (1) JPH0334913Y2 (es)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57175448U (es) * 1981-04-30 1982-11-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57175448U (es) * 1981-04-30 1982-11-05

Also Published As

Publication number Publication date
JPH0334913Y2 (es) 1991-07-24

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