JPS61182036U - - Google Patents
Info
- Publication number
- JPS61182036U JPS61182036U JP6635685U JP6635685U JPS61182036U JP S61182036 U JPS61182036 U JP S61182036U JP 6635685 U JP6635685 U JP 6635685U JP 6635685 U JP6635685 U JP 6635685U JP S61182036 U JPS61182036 U JP S61182036U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- lead frame
- view
- sectional
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6635685U JPS61182036U (es) | 1985-05-02 | 1985-05-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6635685U JPS61182036U (es) | 1985-05-02 | 1985-05-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61182036U true JPS61182036U (es) | 1986-11-13 |
Family
ID=30599185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6635685U Pending JPS61182036U (es) | 1985-05-02 | 1985-05-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61182036U (es) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02158159A (ja) * | 1988-12-12 | 1990-06-18 | Mitsubishi Electric Corp | 半導体集積回路装置及びその製造方法 |
| JP2003068958A (ja) * | 2001-08-28 | 2003-03-07 | Dainippon Printing Co Ltd | ディスクリート用パッケージ及びその製造方法 |
-
1985
- 1985-05-02 JP JP6635685U patent/JPS61182036U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02158159A (ja) * | 1988-12-12 | 1990-06-18 | Mitsubishi Electric Corp | 半導体集積回路装置及びその製造方法 |
| JP2003068958A (ja) * | 2001-08-28 | 2003-03-07 | Dainippon Printing Co Ltd | ディスクリート用パッケージ及びその製造方法 |