JPS61100992A - Chip electronic component mounted circuit device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a chip electronic component mounting circuit device.
In particular, the electrical connection terminals of chip electronic components (hereinafter simply referred to as chip components) are arranged facing upward with respect to the substrate, thereby dramatically increasing the degree of integration.

(Configuration of conventional example and its problems) Figure 1 shows an example of an electronic circuit.
1-R3 is a resistor, C is a capacitor, and Q is a transistor. FIG. 2 is a perspective view showing a typical example of a chip component used in the circuit shown in FIG. 1. Figure 2 (- indicates chip resistors R1 to R3, in which a resistor R1 and an electrode Rc are formed by printing or vapor deposition on an insulating substrate Ra.The electrode Rc is attached only to the printed surface of the resistor, and the chip resistor Rc is attached only to the printed surface of the resistor. It may be attached to the entire surface of the edge as shown in the figure.

Figure 2 (B) shows the chip capacitor cl, and the dielectric Ca
Electrodes Cb are formed at both ends. FIG. 2(C) shows a transistor Q, which is sealed with resin QM and used as a paste.

Emitter and collector are each lead terminal QB t QE
It is taken out as eQc. As shown in Fig. 2, chip electronic components such as a chip resistor R1 and a chip capacitor C have a rectangular parallelepiped structure, and the top and bottom surfaces have the same area.
And the area is the largest among the six faces. When mounting and fixing such a 7" electronic component on a board, it is most convenient and stable to arrange the surface of the rectangular parallelepiped with the largest area parallel to the board. A conventional chip electronic component mounting circuit device is mounted with the configuration shown in Figure 3, where S is a substrate, L is a wiring conductor, and G is a chip component that is bonded to a designated position on the substrate S. After being fixed with adhesive or adhesive material, the chip components and the wiring conductor LH on the board are immersed together with the board S in a soldering bath.
electrically connected. In such conventional devices, in order to electrically connect each chip component to the wiring conductor provided on the substrate S, the electrical connection terminals of each chip component are placed facing downward with respect to the substrate and are not fixed. Ta. Figure 2 (B)
Chip capacitors with strip-shaped electrical connection terminals can be electrically connected in the same way whether they are facing upwards or downwards with respect to the substrate, but molded transistors Q and flat Hall cage ICs All electrical connection terminals were placed and fixed facing downwards on the board.

Furthermore, in the conventional device, all chip components such as the chip resistors R1 to R3 and the chip capacitor C, which have a rectangular parallelepiped structure, are arranged with their surfaces having the maximum area parallel to the substrate S. Therefore, in these conventional examples, the area occupied by the chip components and the area of the electrodes for obtaining electrical connection between the chip components and the wiring conductor of the board are large, and a major drawback is that the chip components cannot be mounted at high density. It had

(Object of the Invention) An object of the present invention is to eliminate the above-mentioned drawbacks and provide a chip electronic component mounting circuit device capable of high-density mounting of chip components. The electrical connection terminals are arranged and fixed upwards on the board, and the surface with the largest area is arranged perpendicularly to the board and fixedly mounted (hereinafter simply referred to as vertical arrangement).

Therefore, it is possible to arrange the chip components in a stacked manner, and the occupied area can be significantly reduced, making it possible to implement high-density mounting of the chip components.

(Description of Examples) Examples of the present invention will be described with reference to FIGS. 5 and 6. FIG. 5 is a perspective view showing the basic structure of the present invention, and FIG. 6 is a top view thereof. First, in contrast to the conventional device shown in FIG. 3, the transistor Q has electrical connection terminals facing upward with respect to the substrate.

Next, chip components such as chip resistors R1 to R3 and a chip capacitor C are fixedly mounted so that two of the six surfaces having the largest area are arranged perpendicularly to the substrate S.

Furthermore, in the present embodiment shown in FIG. 5, there is no wiring conductor on the substrate S, as shown in FIG. 5 and FIG.

Here, electrical connections between chip components in an embodiment of the present invention that does not have wiring conductors will be explained. As shown in FIG. 5, when a molded transistor Q, a flat circuit board, or a tockage IC is fixedly mounted on a substrate S with its electrical connection terminal facing upward with respect to the substrate, other chip components, ie, a chip resistor, R1~R3, chip capacitor ct
, the heights of the electrical connection terminals are approximately the same as when they are vertically arranged, making it easy to make electrical connections. In this case, it is also possible to use a substrate S having a wiring conductor It-, and when the terminals of the transistor Q and the terminals of a chip resistor or chip capacitor are connected, the terminals of this chip resistor or chip capacitor are connected. The terminal of Tran Nostar Q and the wiring conductor are electrically connected through the terminal.

When the transistor Q and chip components such as the chip resistors R1 to R3 and the chip capacitor C are not directly connected, it is also possible to connect them separately using a jumper element or the like.

On the other hand, when there is no wiring conductor Li as in the embodiment shown in FIG. It's more convenient to do so.

(1) It is easy to supply solder to the electrical connection terminal section (by printing solder (-solder) or supplying it with a dis-inser).

(2) It is easy to check the soldering condition of the electrical connection terminal portion.

(3) As will be described later, another chip component can be connected and mounted on top of the chip component.

In the embodiment shown in FIG. 5, the electrical connection between the chip components is made by placing the electrode portions at both ends in contact with each other, or by arranging them close to each other and soldering the electrodes that are close to each other or in contact with each other. Electrically connected by yeast or other conductive material. In the embodiment of FIG. 5, the pace Q of the transistor Q,
And the connection with resistor R2 is Jeannot J? - Although the connection is made through the element Ji, it is also possible to eliminate the need for the champer element depending on the arrangement and connection of the chip components. Next, other features of the present invention are shown in FIGS. 5 and 6.
This will be explained using figures. A resistor R1 connected between the collector Q of the transistor Q and the pace Q is further placed over the transistor Q and connected thereto.

As can be seen from Figure 6, by selecting the shape and two dimensions of chip components such as the chip resistor t and the chip capacitor, it is possible to overlap the terminals of the transistor Q and the terminals of the chip resistor R1. Therefore, the terminal portions can be easily connected by supplying paste solder to the overlapping portion of both terminals and heating with a reflow oven or the like.

(Effects of the Invention) In this way, by arranging the electrical connection terminals of the chip components upward with respect to the substrate and firmly mounting them, the chip components can be arranged and connected in close proximity or in contact with each other, and It is also possible to mount parts one on top of the other, making it possible to significantly improve the degree of integration.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a path device in a conventional example and an embodiment of the present invention, and FIG. 6 is a top view thereof. C...Chip capacitor, Q...Transistor, R
1 to R3 Stomach resistance, S... board, L... wiring conductor. 11th! r Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 BR2QE

Claims (3)

[Claims] (1) A chip electronic component mounted circuit device in which a plurality of chip electronic components are fixedly mounted on a substrate, characterized in that the chip electronic components are fixedly mounted with the electrical connection terminals facing upward with respect to the substrate. Chip electronic component mounting circuit device. (2) In the chip electronic component mounted circuit device according to claim (1), the chip electronic components are fixedly mounted with the surface having the largest area arranged perpendicularly to the substrate, and A circuit device mounted with a chip electronic component, characterized in that the chip electronic component is fixed by a conductive material such as solder with the electrodes of the chip electronic component touching or coming close to each other. (3) In the chip electronic component mounted circuit device according to claim (1), the electrical connection terminals are arranged upward with respect to the substrate and other electronic components are connected on top of the fixed chip electronic component. A chip electronic component mounting circuit device characterized by being equipped with a chip electronic component.