JPS6098631A - 終点検出装置 - Google Patents
終点検出装置Info
- Publication number
- JPS6098631A JPS6098631A JP20481683A JP20481683A JPS6098631A JP S6098631 A JPS6098631 A JP S6098631A JP 20481683 A JP20481683 A JP 20481683A JP 20481683 A JP20481683 A JP 20481683A JP S6098631 A JPS6098631 A JP S6098631A
- Authority
- JP
- Japan
- Prior art keywords
- end point
- intensity
- change
- detected
- point detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20481683A JPS6098631A (ja) | 1983-11-02 | 1983-11-02 | 終点検出装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20481683A JPS6098631A (ja) | 1983-11-02 | 1983-11-02 | 終点検出装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5284596A Division JP2790111B2 (ja) | 1996-03-11 | 1996-03-11 | プラズマ処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6098631A true JPS6098631A (ja) | 1985-06-01 |
JPH0564455B2 JPH0564455B2 (enrdf_load_html_response) | 1993-09-14 |
Family
ID=16496850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20481683A Granted JPS6098631A (ja) | 1983-11-02 | 1983-11-02 | 終点検出装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6098631A (enrdf_load_html_response) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63239819A (ja) * | 1987-03-27 | 1988-10-05 | Hitachi Ltd | プラズマ処理終点判定方法及び装置 |
JPS6448420A (en) * | 1987-08-19 | 1989-02-22 | Hitachi Ltd | Plasma treater and decision method of end point of plasma treatment |
JP2001007084A (ja) * | 1999-06-21 | 2001-01-12 | Nec Corp | エッチング終点判定方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4208240A (en) * | 1979-01-26 | 1980-06-17 | Gould Inc. | Method and apparatus for controlling plasma etching |
JPS56114329A (en) * | 1980-02-15 | 1981-09-08 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Method for sensing time of completion of dry etching |
-
1983
- 1983-11-02 JP JP20481683A patent/JPS6098631A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4208240A (en) * | 1979-01-26 | 1980-06-17 | Gould Inc. | Method and apparatus for controlling plasma etching |
JPS56114329A (en) * | 1980-02-15 | 1981-09-08 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Method for sensing time of completion of dry etching |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63239819A (ja) * | 1987-03-27 | 1988-10-05 | Hitachi Ltd | プラズマ処理終点判定方法及び装置 |
JPS6448420A (en) * | 1987-08-19 | 1989-02-22 | Hitachi Ltd | Plasma treater and decision method of end point of plasma treatment |
JP2001007084A (ja) * | 1999-06-21 | 2001-01-12 | Nec Corp | エッチング終点判定方法 |
US6537460B1 (en) | 1999-06-21 | 2003-03-25 | Nec Corporation | Method for detecting an end point of etching in a plasma-enhanced etching process |
Also Published As
Publication number | Publication date |
---|---|
JPH0564455B2 (enrdf_load_html_response) | 1993-09-14 |
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