JPS609828Y2 - 発光ダイオ−ド表示器 - Google Patents

発光ダイオ−ド表示器

Info

Publication number
JPS609828Y2
JPS609828Y2 JP9844080U JP9844080U JPS609828Y2 JP S609828 Y2 JPS609828 Y2 JP S609828Y2 JP 9844080 U JP9844080 U JP 9844080U JP 9844080 U JP9844080 U JP 9844080U JP S609828 Y2 JPS609828 Y2 JP S609828Y2
Authority
JP
Japan
Prior art keywords
emitting diode
light
light emitting
display
diode display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9844080U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5723576U (enrdf_load_stackoverflow
Inventor
真 山根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Tottori Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tottori Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tottori Sanyo Electric Co Ltd
Priority to JP9844080U priority Critical patent/JPS609828Y2/ja
Publication of JPS5723576U publication Critical patent/JPS5723576U/ja
Application granted granted Critical
Publication of JPS609828Y2 publication Critical patent/JPS609828Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
JP9844080U 1980-07-10 1980-07-10 発光ダイオ−ド表示器 Expired JPS609828Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9844080U JPS609828Y2 (ja) 1980-07-10 1980-07-10 発光ダイオ−ド表示器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9844080U JPS609828Y2 (ja) 1980-07-10 1980-07-10 発光ダイオ−ド表示器

Publications (2)

Publication Number Publication Date
JPS5723576U JPS5723576U (enrdf_load_stackoverflow) 1982-02-06
JPS609828Y2 true JPS609828Y2 (ja) 1985-04-05

Family

ID=29460160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9844080U Expired JPS609828Y2 (ja) 1980-07-10 1980-07-10 発光ダイオ−ド表示器

Country Status (1)

Country Link
JP (1) JPS609828Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60129912U (ja) * 1984-02-09 1985-08-31 アルボ−ス薬粧株式会社 凍結防止型自動うがい装置

Also Published As

Publication number Publication date
JPS5723576U (enrdf_load_stackoverflow) 1982-02-06

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