JPS6089988A - Led array light source for copying machine - Google Patents
Led array light source for copying machineInfo
- Publication number
- JPS6089988A JPS6089988A JP58198686A JP19868683A JPS6089988A JP S6089988 A JPS6089988 A JP S6089988A JP 58198686 A JP58198686 A JP 58198686A JP 19868683 A JP19868683 A JP 19868683A JP S6089988 A JPS6089988 A JP S6089988A
- Authority
- JP
- Japan
- Prior art keywords
- light source
- led array
- copying machine
- chips
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Dot-Matrix Printers And Others (AREA)
- Exposure Or Original Feeding In Electrophotography (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野］
本発明は、発光ダイオードチップをプリント配線基板上
に線状に配置搭載した複写機用光源に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a light source for a copying machine in which light emitting diode chips are arranged and mounted on a printed wiring board in a linear manner.
（発明の技術的背景及びその問題点〕
発光ダイオード（以下ＬＥＤと言う）は発光表示装置と
して広範な用途に用いられている他、複写機（Ｌ Ｅ
Ｄ ｐ ｒｉｎｔｅｒ）の光源としても用いられている
。この複写機用ＬＥＤ光源では、多数のＬＥＤチップを
プリン１−配線基板上に線状に配置搭載して用い、表面
の集光レンズを通して光を外部に取出す構成になってい
る。(Technical background of the invention and its problems) Light-emitting diodes (hereinafter referred to as LEDs) are used in a wide range of applications as light-emitting display devices, and also in copying machines (LEDs).
It is also used as a light source for printers. This LED light source for a copying machine uses a large number of LED chips arranged and mounted in a line on a printed wiring board, and is configured to take out light to the outside through a condensing lens on the front surface.
ところで、複写機用ＬＥＤ光源を製作するに際し、個々
のＬＥＤチップをプリンｌ−基板上に所定の線状配列で
搭載する為の位置確認は肉眼に頼って行われているから
、ＬＥＤチップの配列に乱れを生じ易い。チップ配列が
乱れたＬＥＤ光源では光漏れによる輝度のバラツキが生
じ、また表面での明るさが一様でない為に光の集束が困
難になる。By the way, when manufacturing LED light sources for copying machines, the positions of the individual LED chips to be mounted on the printed circuit board in a predetermined linear arrangement are confirmed by the naked eye, so the arrangement of the LED chips is tends to cause disturbances. In an LED light source with a disordered chip arrangement, variations in brightness occur due to light leakage, and the brightness on the surface is not uniform, making it difficult to focus the light.
この様な光源を複写機に用いると、全体の配光色が疎ら
である為に鮮明な複写ができないといった問題を生じる
こととなる。加えて、基板上に於けるしＥＤチップの間
隔は非常に狭い為、チップ配列が乱れるとワイヤポンデ
ィング工程でワイヤが相互に接触するといった問題が生
じ易くなる。If such a light source is used in a copying machine, a problem arises in that clear copies cannot be made because the overall light distribution color is sparse. In addition, since the spacing between the ED chips on the substrate is very narrow, if the chip arrangement is disturbed, problems such as wires coming into contact with each other during the wire bonding process are likely to occur.
上記の理由から、複写機用ＬＥＤ光源ではＬＥＤチップ
を基板上に正しく配列して搭載することが極めて重要と
なる。この点に於いて、１個のチップに多数のＬＥＤ素
子が形成されているＬＥＤアレイチップを用いればチッ
プの数はそれだけ減少することとなり、従って正しい配
列を１ｑる上で極めて有利である。For the above reasons, it is extremely important to correctly arrange and mount the LED chips on the substrate in the LED light source for a copying machine. In this regard, if an LED array chip in which a large number of LED elements are formed on one chip is used, the number of chips will be reduced accordingly, which is extremely advantageous in determining the correct arrangement.
然し乍ら、複数のチップを用いる限り、ＬＥＤアレイチ
ップを用いたどしても上記の問題が完全に解決される訳
ではない。例えば、第１図に示す様にプリント配線基板
１の中心線上に沿ってＬＥＤアレイチップ２・・・を搭
載する場合、図示の様に各チップ２・・・間にズレが生
じるのを完全に回避することは出来ず、従って程度の差
はあっても上記と同様の問題が発生することとなる。な
お、図中３・・・はＬＥＤアレイデツプ２に形成された
発光部（ＬＥＤ素子）、４は電極接続用のパッドである
。However, as long as a plurality of chips are used, the above problem cannot be completely solved even if an LED array chip is used. For example, when mounting LED array chips 2 along the center line of a printed wiring board 1 as shown in FIG. This cannot be avoided, and therefore the same problems as above will occur, albeit to a different degree. In the figure, 3 . . . is a light emitting part (LED element) formed in the LED array depth 2, and 4 is a pad for electrode connection.
（発明の目的〕
本発明は上記事情に鑑みて為されたもので、プリン１〜
配線基板上に所定の正しい配列で確実にＬＥＤチップを
搭載でき、以て光源輝度の向上、輝度のバラツキ防止、
更には製品組立て工程の簡略化を図ることが出来る複写
機用ＬＥＤアレイ光源を提供するものである。(Object of the invention) The present invention was made in view of the above circumstances, and includes puddings 1 to 1.
LED chips can be reliably mounted on the wiring board in the correct predetermined arrangement, improving light source brightness, preventing brightness variations,
Furthermore, the present invention provides an LED array light source for a copying machine that can simplify the product assembly process.
本発明による複写機用Ｌ Ｅ Ｄアレイ光源は、プリン
１〜配線基板表面に凹溝を設け、該凹溝内に発光ダイオ
ードチップを整列させて搭載したことを特徴とするもの
である。The LED array light source for a copying machine according to the present invention is characterized in that grooves are provided on the surface of the printer 1 to the wiring board, and light emitting diode chips are aligned and mounted in the grooves.
上記のＬＥＤアレイ光源では、その製作に当ってプリン
１〜配線基板の凹溝内にＬＥＤチップを搭載すれば良く
、この凹溝を所定の配列方向に設けておけばチップ搭載
時の配列の乱れは略完全に防止することができる。When manufacturing the above-mentioned LED array light source, it is sufficient to mount the LED chips in the concave grooves of the printer 1 to the wiring board.If the concave grooves are provided in a predetermined arrangement direction, the arrangement of the chips will be disturbed when the chips are mounted. can be almost completely prevented.
以下、第２図（Ａ）（Ｂ）を参照して本発明の一実施例
を説明する。An embodiment of the present invention will be described below with reference to FIGS. 2(A) and 2(B).
第２図（Ａ）は本発明の一実施例になる複写機用ＬＥＤ
アレイ光源に於けるＬＥＤアレイチップの搭載状態を示
す平面図であり、第２図（Ｂ）は同図（Ａ）の横断面図
である。これらの図に於いて、１１はプリント配線基板
である。該プリント基板１には電極接続用のパッド１２
・・・が設けられ、また中心線に沿って所定長さＬ１深
さＤの凹溝１３が設けられている。そして、この凹溝１
３内には３個のＬＥＤアレイチップ１４が一列に並べて
搭載されており、各ＬＥ、Ｄアレイチップ１４には多数
の発光素子部１５が形成されている。このＬＥＤアレイ
１４・・・としては、ダイシング工程で１チツプに切断
された後、明るさの良否を全数検査され、内部パターン
の形態チェック及び外観検査を終了したものが用いられ
ている。こうして搭載されたＬＥＤアレイチップ１４・
・・から発せられる光（図中矢印で示す）は表面の反射
集光レンズで集束される様になっている。なお、Ｌ Ｅ
Ｄアレイデツプ１４・・・が配列搭載される凹溝１３
の長さＬは複写機の設計上の要請から所定の値に定めら
れるが、みぞの深さＤはＬ Ｅ Ｄアレイチップ１４の
厚さと同等若しくはやや浅くするのが望ましい。FIG. 2(A) shows an LED for a copying machine which is an embodiment of the present invention.
FIG. 2B is a plan view showing the mounting state of the LED array chip in the array light source, and FIG. 2B is a cross-sectional view of FIG. 2A. In these figures, 11 is a printed wiring board. The printed circuit board 1 has pads 12 for electrode connection.
..., and a groove 13 having a predetermined length L1 and depth D is provided along the center line. And this groove 1
Three LED array chips 14 are mounted in a row in the LED array chip 3, and a large number of light emitting element sections 15 are formed in each LE and D array chip 14. The LED array 14 is one that has been cut into one chip in a dicing process, and then inspected for quality of brightness, and the internal pattern has been checked for form and appearance inspected. The LED array chip 14 mounted in this way
The light emitted from ... (indicated by arrows in the figure) is focused by a reflective condensing lens on the surface. In addition, L E
Concave groove 13 in which D array depths 14 are arranged and mounted.
Although the length L of the groove is set to a predetermined value based on the design requirements of the copying machine, it is desirable that the depth D of the groove be equal to or slightly shallower than the thickness of the LED array chip 14.
上記実施例の複写機用ＬＥＤアレイ光源は、プリント基
板１１に予め設けられた凹溝内にＬＥＤアレイチップ１
４を配列搭載することにより、チップの配列に何等の乱
れを生じることなく製作することが出来、またワイヤボ
ンディング等も良好な作業性で行なうことが出来る。そ
して、この光源を複写機に用いることにより、鮮明な複
写及び複写のスピードアップを可能とすることができる
５−
なお、上記実施例では１チップ当り多数のＬＥＤ素子が
形成されたＬＥＤアレイチップ１４を用いたが、この代
りに、１チップ当りＩ ＬＥＤ素子からなるＬＥＤチッ
プを用いても良い。The LED array light source for a copying machine of the above embodiment has an LED array chip 1 installed in a groove pre-provided on a printed circuit board 11.
By arranging and mounting the chips, the chips can be manufactured without any disturbance in the chip arrangement, and wire bonding and the like can be performed with good workability. By using this light source in a copying machine, it is possible to make clear copies and speed up the copying. However, instead of this, an LED chip consisting of I LED elements per chip may be used.
以上詳述した様に、本発明による複写機用ＬＥＤアレイ
光源は、プリント配線基板上に所定の正しい配列で確実
にＬＥＤチップを搭載して製作することが出来、以て光
源輝度の向上、輝度のバラツキ防止、更には製品組立て
工程の簡略化を図ると共に、複写機のスピードアップ及
び鮮明な複写を可能とする等、顕著な効果を奏するもの
である。As described in detail above, the LED array light source for copying machines according to the present invention can be manufactured by mounting LED chips reliably in a predetermined correct arrangement on a printed wiring board, thereby improving the light source brightness and increasing the brightness. This method has remarkable effects such as preventing variations in the number of images, simplifying the product assembly process, speeding up copying machines, and making clearer copies possible.
第１図は従来の複写機用ＬＥＤアレイ光源に於けるＬＥ
Ｄアレイチップの配列状態を示す平面図、第２図（Ａ）
は本発明の一実施例になる複写機用ＬＥＤアレイ光源に
於けるＬＥＤアレイチップの配列状態を示す平面図であ
り、第２図（Ｂ）はその横断面図である。
１１・・・プリント配線基板、１２・・・電極接続用パ
６−
ラド、１３・・・凹溝、１４・・何−Ｉ＝ Ｄア１ノイ
チップー７−
第２図Figure 1 shows the LE in a conventional LED array light source for copying machines.
Plan view showing the arrangement state of D array chips, Fig. 2 (A)
2 is a plan view showing the arrangement of LED array chips in an LED array light source for a copying machine according to an embodiment of the present invention, and FIG. 2(B) is a cross-sectional view thereof. DESCRIPTION OF SYMBOLS 11... Printed wiring board, 12... Pad for electrode connection, 13... Concave groove, 14... What-I=D A1 Noi chip-7- Fig. 2
Claims (1)
ダイオードチップを整列さ１！で搭載したことを特徴と
する複写機用Ｌ Ｅ Ｄアレイ光源。A concave groove is provided on the surface of the printed wiring board (), and the light emitting diode chips are aligned in the concave groove1! An LED array light source for copying machines, which is characterized by being equipped with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58198686A JPS6089988A (en) | 1983-10-24 | 1983-10-24 | Led array light source for copying machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58198686A JPS6089988A (en) | 1983-10-24 | 1983-10-24 | Led array light source for copying machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6089988A true JPS6089988A (en) | 1985-05-20 |
Family
ID=16395356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58198686A Pending JPS6089988A (en) | 1983-10-24 | 1983-10-24 | Led array light source for copying machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6089988A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63296284A (en) * | 1987-05-27 | 1988-12-02 | Nec Corp | Light emitting diode head |
| NL8901403A (en) * | 1988-12-12 | 1990-07-02 | Samsung Electronics Co Ltd | METHOD FOR MANUFACTURING A LED SERIES HEAD |
| EP1453110A2 (en) * | 2003-02-28 | 2004-09-01 | Noritsu Koki Co., Ltd. | Light-emitting diode light source unit |
-
1983
- 1983-10-24 JP JP58198686A patent/JPS6089988A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63296284A (en) * | 1987-05-27 | 1988-12-02 | Nec Corp | Light emitting diode head |
| NL8901403A (en) * | 1988-12-12 | 1990-07-02 | Samsung Electronics Co Ltd | METHOD FOR MANUFACTURING A LED SERIES HEAD |
| FR2641394A1 (en) * | 1988-12-12 | 1990-07-06 | Samsung Electronics Co Ltd | METHOD FOR MANUFACTURING A PRINTING HEAD FORMED OF A PHOTOEMISSIVE DIODE NETWORK |
| EP1453110A2 (en) * | 2003-02-28 | 2004-09-01 | Noritsu Koki Co., Ltd. | Light-emitting diode light source unit |
| EP1453110A3 (en) * | 2003-02-28 | 2009-05-27 | Noritsu Koki Co., Ltd. | Light-emitting diode light source unit |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7126159B2 (en) | Plural leds mounted within a central cutout of a surrounding circular reflective electrode | |
| JPH05304318A (en) | Led array board | |
| JPH1012915A (en) | Optical pattern read sensor | |
| US20190348582A1 (en) | Optoelectronic package | |
| JPS6089988A (en) | Led array light source for copying machine | |
| US10312285B2 (en) | LED illuminator and method of making the same | |
| JPH09246602A (en) | Light emitting diode array light source | |
| TWI828375B (en) | Direct-lit mini-led backlight module and manufacturing method thereof | |
| JP3138582U (en) | Light emitting diode chip package | |
| JPH06310763A (en) | Led lamp | |
| EP1482540A1 (en) | Method for forming thin film | |
| JPH07211937A (en) | Light emitting diode | |
| JPH08167780A (en) | Light leak preventing structure of surface mounted type light emitting element | |
| US6639251B1 (en) | Light emitting element array module and printer head and micro-display using the same | |
| US6228669B1 (en) | Planar mount LED element and method for manufacturing the same | |
| JPS6189683A (en) | Light emitting semiconductor device | |
| US11650458B2 (en) | Light emitting device with light emitting members on printed circuit board substrate | |
| KR100821222B1 (en) | Bar type led package and method for fabricatinng the same | |
| JP3568273B2 (en) | Linear light source | |
| JP2003255867A (en) | Backlight light source device using chip-shaped led | |
| CN110959199B (en) | Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component | |
| JPH08132673A (en) | Image apparatus | |
| JP2001118402A (en) | Signal lamp | |
| JPH07177304A (en) | Image device | |
| JPH06130878A (en) | Light emitting device |