JPS6089576A - 無電解メツキ方法 - Google Patents

無電解メツキ方法

Info

Publication number
JPS6089576A
JPS6089576A JP19787683A JP19787683A JPS6089576A JP S6089576 A JPS6089576 A JP S6089576A JP 19787683 A JP19787683 A JP 19787683A JP 19787683 A JP19787683 A JP 19787683A JP S6089576 A JPS6089576 A JP S6089576A
Authority
JP
Japan
Prior art keywords
plating
water
minutes
bath
electroless plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19787683A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62231B2 (enExample
Inventor
Kenji Harada
賢二 原田
Keiichi Tanaka
啓一 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP19787683A priority Critical patent/JPS6089576A/ja
Publication of JPS6089576A publication Critical patent/JPS6089576A/ja
Publication of JPS62231B2 publication Critical patent/JPS62231B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemically Coating (AREA)
JP19787683A 1983-10-22 1983-10-22 無電解メツキ方法 Granted JPS6089576A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19787683A JPS6089576A (ja) 1983-10-22 1983-10-22 無電解メツキ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19787683A JPS6089576A (ja) 1983-10-22 1983-10-22 無電解メツキ方法

Publications (2)

Publication Number Publication Date
JPS6089576A true JPS6089576A (ja) 1985-05-20
JPS62231B2 JPS62231B2 (enExample) 1987-01-06

Family

ID=16381784

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19787683A Granted JPS6089576A (ja) 1983-10-22 1983-10-22 無電解メツキ方法

Country Status (1)

Country Link
JP (1) JPS6089576A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6222707U (enExample) * 1985-07-24 1987-02-12

Also Published As

Publication number Publication date
JPS62231B2 (enExample) 1987-01-06

Similar Documents

Publication Publication Date Title
US4248633A (en) Universal copper-plating solution
US3994727A (en) Formation of metal images using reducible non-noble metal salts and light sensitive reducing agents
JP2004510885A (ja) 金属表面上へ銀を無電解めっきするための浴と方法
US5518760A (en) Composition and method for selective plating
JPH01149971A (ja) 無電解めっき処理用触媒
TW583349B (en) Method for enhancing the solderability of a surface
JP2010526205A (ja) 不導性基質へ金属被覆を施す方法
US5468515A (en) Composition and method for selective plating
SE440440B (sv) Sett att framstella metallmonster pa fotokemisk veg
JPH0261073A (ja) 無電解錫めっき浴及び無電解錫めっき方法
GB2293020A (en) Succinic acid derivative degradable chelants, uses and compositions thereof
JPS60184683A (ja) 金属付着方法
JPH09111463A (ja) 無電解めっきのための活性化触媒液および無電解めっき方法
JP2881871B2 (ja) 光ディスクの原盤作成方法
JPH10195667A (ja) 無電解めっき用の触媒液
JPS62231B2 (enExample)
US5165971A (en) Activating composition for plating of electrically insulative substrates and method for plating of such substrates using said composition
US4693907A (en) Process or non-electrolytic copper plating for printed circuit board
US3637386A (en) Metallizing solution for intensifying layers of metallic, imaged nuclei
ES291595A1 (es) Metodo de fabricaciën de imagenes metalicas internas y o externas o imagenes coloreadas internas
CA1052162A (en) Universal copper-plating solution
JPH09510411A (ja) 銅のビスマスコーティング保護
JPH05295558A (ja) 高速置換型無電解金めっき液
JPS62114294A (ja) 絶縁基板上の金属パタ−ンの製造方法
JP3336535B2 (ja) 選択的めっき用組成物及び方法