JPS6087994A - アルミニウム及びアルミニウム合金材のろう付け用フラツクス - Google Patents

アルミニウム及びアルミニウム合金材のろう付け用フラツクス

Info

Publication number
JPS6087994A
JPS6087994A JP19406783A JP19406783A JPS6087994A JP S6087994 A JPS6087994 A JP S6087994A JP 19406783 A JP19406783 A JP 19406783A JP 19406783 A JP19406783 A JP 19406783A JP S6087994 A JPS6087994 A JP S6087994A
Authority
JP
Japan
Prior art keywords
flux
brazing
aluminum
alloy material
melting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19406783A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0355236B2 (cs
Inventor
Katsuhisa Ito
伊藤　勝久
Masayasu Toyoshima
豊嶋　雅康
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Sumitomo Light Metal Industries Ltd
Original Assignee
Sumitomo Light Metal Industries Ltd
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Light Metal Industries Ltd, Sumitomo Metal Industries Ltd filed Critical Sumitomo Light Metal Industries Ltd
Priority to JP19406783A priority Critical patent/JPS6087994A/ja
Publication of JPS6087994A publication Critical patent/JPS6087994A/ja
Publication of JPH0355236B2 publication Critical patent/JPH0355236B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • B23K35/3603—Halide salts
    • B23K35/3605—Fluorides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Nonmetallic Welding Materials (AREA)
JP19406783A 1983-10-19 1983-10-19 アルミニウム及びアルミニウム合金材のろう付け用フラツクス Granted JPS6087994A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19406783A JPS6087994A (ja) 1983-10-19 1983-10-19 アルミニウム及びアルミニウム合金材のろう付け用フラツクス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19406783A JPS6087994A (ja) 1983-10-19 1983-10-19 アルミニウム及びアルミニウム合金材のろう付け用フラツクス

Publications (2)

Publication Number Publication Date
JPS6087994A true JPS6087994A (ja) 1985-05-17
JPH0355236B2 JPH0355236B2 (cs) 1991-08-22

Family

ID=16318402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19406783A Granted JPS6087994A (ja) 1983-10-19 1983-10-19 アルミニウム及びアルミニウム合金材のろう付け用フラツクス

Country Status (1)

Country Link
JP (1) JPS6087994A (cs)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5517038A (en) * 1992-08-11 1996-05-14 Mitsubishi Denki Kabushiki Kaisha Semiconductor device including three-dimensionally disposed logic elements for improving degree of integration
JP2008254071A (ja) * 2007-04-04 2008-10-23 General Electric Co <Ge> ろう付け用配合物及びその製造法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5517038A (en) * 1992-08-11 1996-05-14 Mitsubishi Denki Kabushiki Kaisha Semiconductor device including three-dimensionally disposed logic elements for improving degree of integration
JP2008254071A (ja) * 2007-04-04 2008-10-23 General Electric Co <Ge> ろう付け用配合物及びその製造法

Also Published As

Publication number Publication date
JPH0355236B2 (cs) 1991-08-22

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