JPS6086299A - Electrolytic polishing cell - Google Patents

Abstract

PURPOSE:To prevent the contamination of a plating jig caused by bubbles generated from a cathode, in the titled cell of a lead piece for a reed switch wherein an article to be plated is arranged to an upper part and a cathode to a lower part, by providing a bubble inducing film above the cathode. CONSTITUTION:An electrolytic polishing cell 7 having a cathode 8 provided to the bottom part thereof, an overflow receiving tank 9 provided to the outside thereof and an inner tank 11 supported by legs 10 provided therein is filled with a polishing solution. A large number of lead pieces 1 are held by a jig 12 and immersed in the solution 6 while voltage is applied between the pieces 1 and the cathode 8. Herein, polypropylene cloth 13, which is fixed to the inner tank 11 at both sides thereof and provided under tension in a V-shape formed by pressing the center part of the cloth by a support rod 14, is provided. By this cloth, a large amount of bubbles generated from the cathode 8 reach the surface of the cloth 13 and, whereupon, they rise along the inclination of left and right cloth pieces and are floated to both sides in the outside of the inner tank 11. In addition, the polishing cell 7 is set so as to be lower than the inner tank 11 and bub bles on the liquid surface can not be penetrated into the inner tank 11 and overflowed out of the polishing cell 7 to be accumulated in the receiving tank 9 and periodically returned to the polishing cell 7.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electrolytic polisher used in electrolytic polishing as a pre-plating treatment in the plating process of the armature surface of a lead piece used in a +)-13 switch. .

Since then, in the commercial polishing process of reed pieces used in reed switches, a jig 2 with lead pieces 1 to be plated arranged in a row is placed in a polishing tank 3 as shown in FIG. Cathode 4
They were installed facing each other to conduct electrolysis.

However, this method has a drawback in that there is a limit to the main attributes.

Therefore, we manufactured a plating jig 11,5 that can arrange the lead pieces 1 vertically and horizontally as shown in Fig. 2, and placed it on the top of the plate 3 as shown in Fig. 3. cathode 4
We have developed a method for electrolytic polishing by arranging and polishing.

However, according to this method, long bubbles are generated from the cathode 4 during electrolysis and are deposited on the surface of the electrolyte 6, so that the length of the outer plating material, such as the reed piece 1 of a reed switch, is only 15 mm or more. In the case of about 20wx, Osamu, El, 5
The lower surface of ′! d Since the clearance with the melting liquid surface is /J\, the air bubbles generated in the above-mentioned force 7 will adhere to the jig 5,
When the jig 5 was fed with JN, the electrolysis 1/Jll solution was brought into the next plating and 7-process processes, which contaminated the plating solution and risked the occurrence of plating stains.

Therefore, the present invention has developed an electrolytic research tool that does not have such problems.
It is an attempt to provide the following information.

That is, in the present invention, the object to be plated is placed in the upper part and the cathode is placed in the lower part.
In the electrolytic polishing tank prepared by M1, a chemical-resistant bubble-inducing membrane is installed above the cathode at an angle, and the bubbles generated from the left electrode are guided to the side to prevent contamination of the plating jig by the bubbles. It is designed to prevent this.

Embodiments of the present invention will be described below based on the drawings.

FIG. 4 is a partially cut-away side view of an embodiment of the present invention, in which a stainless steel cathode 8 is provided at the bottom, an autocooled flow receiving tank 9 is provided externally, and an inner tank 11 is supported internally by legs 10. ′Electrolysis IυF! Cypress, 12 is a jig holding a large number of reed pieces 1 to be polished, 13 is fixed on both sides to the inner tank 11;
It is a polypropylene cloth stretched in a V-shape with the center part hung over a support rod 14. Note that during electropolishing, the electrolytic polishing tank 7 is filled with the IJ liquid 6.

Therefore, when the large amount of air bubbles generated in the 1st pole 8 reaches the cloth surface, it rises along the slope of the left and right cloth, and the inner tank 1
It floats on the liquid surface on both sides outside of 1. In addition, electrolytic polishing tank 7
The flat part of the inner tank 11 is set slightly lower to prevent air bubbles on the liquid surface from penetrating into the inner tank 11, so the bubbles will not overflow outside the tank 7. becomes.

The overflowing water is collected in an autocooler flow receiving tank 9 and periodically returned to the electrolytic polishing tank 7 by an electric pump (not shown).

The tanks used here are all made of resin that is easily affected by Kenreki liquid.

FIG. 5 shows a different embodiment of the present invention, in which the fabric 13 is stretched in a V-shape in the previous embodiment, but is stretched in the inner tank 11 so as to be inclined in one direction. .

Although polypropylene cloth was used as the bubble-inducing membrane in the embodiments exemplified above, the same effect can be obtained by using a plastic sheet or film with a large number of holes.

As described above, the electrolytic polishing M bath of the present invention has a small 1. In the mass production of plated parts, it is suitable for preventing the deposition of air bubbles on the jig by electrolytic polishing and preventing contamination of plating ice in the next process and corrosion of the jig.

[Brief explanation of the drawing]

Figure 1 is a cross-sectional view of a general electrolytic polishing tank, Figure 2 is a perspective view of a jig that holds a large amount of lead pieces, Figure 3 is a cross-sectional view of a cathode-bottom type electrolytic polisher, Figures 4 and 2 are FIG. 5 is an illustration of an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Lead piece, 6... Electrolyte, 7... Electrolytic polishing tank, 8... Cathode, 9... Overflow receiving tank, 10
...Legs, 11...Inner tank, 12...Jig, 13...
・Cloth, 14...Supported Patent Applicant Yaskawa Electric Manufacturing Co., Ltd. Assimilation 31 Hattori [34 Figure 1. Figure 2 No. 3

Claims (1)

[Claims] An electrolytic polishing tank in which an object to be plated is placed at the top and a cathode is placed at the bottom, characterized in that a chemical-resistant bubble-inducing membrane is stretched obliquely above the cathode.