JPS6085862A - Method and device for polishing workpiece - Google Patents

Abstract

PURPOSE:To prevent deflection in polishing to enhance the safety, by providing such an arrangement that a predetermined number of workpiece are successively set on a stool, being pressed by a holding fixture, and center and guide rollers are rotated to revolute the workpieces on the stool while the stool is rotated for polishing the workpieces. CONSTITUTION:When a stool 11 is rotated in the E direction while a center roller 12 is rotated in the F direction, a workpiece 21A moves along the peripheral section of the stool 11, and is held between the center roller 12 and a guide roller 22a at the innermost part of the stool 11 in the rotational direction thereof. After a guide roller 22b is lowered and set on the stool 11 at a position next to the roller 22a in the clockwise direction, a workpiece 21B is set on the stool 11 under operation of an arm 34, and is held between the center and guide rollers 12, 22b, similarly. When workpieces 21A-21D are subjected to polishing by means of top rings 20, the workpieces 21A-21D may be rotated at the same speed under the same condition so that no uneveness in polishing takes place for the workpieces 21A-21D, and further, since the workpieces may be automatically supplied and taken out, no accident may be prevented even if the workpieces are large and heavy.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a polishing method and an apparatus thereof, and more particularly, it is capable of automatically supplying a plurality of workpieces to be placed on a surface plate, and also polishing each workpiece while pressing the workpieces onto the surface plate. The present invention relates to a polishing method and apparatus capable of uniformly polishing a workpiece by rotating it at the same speed.

Conventional polishing devices are used as lapping devices, boring devices, etc. by changing the polishing surface of the surface plate and the thickness of the abrasive grains. For example, in a polishing device, as shown in FIG. 1, a plurality of workpieces (not shown) are placed on a rotating surface plate 1, and a plurality of top rings 2 serving as holders hold the workpieces on the surface plate 1. It is held so as to be in pressure contact with the boring surface which is the polishing surface. The workpiece may be directly pressed against the polishing surface by the top ring 2, or it may be pasted on the bottom surface of a disc-shaped holder (not shown), and this holder may be fitted onto the top ring 2, or the holder may be brought into contact with the polishing surface. The polishing surface is held in pressure contact with the polishing surface by appropriate means such as being sandwiched between the polishing surface.

Further, the top ring 2 is supported by a pair of idlers 5.5 that are rotatably attached to the ends of a guide 4 fixed to the surface plate main body 3. Reference numeral 6 denotes a pipe for supplying abrasive to the boring surface of the surface plate 1. When the surface plate 1 of the polishing apparatus configured as described above is rotated, each top ring 2 supported by the idlers 5, 5 is rotated.
It rotates together with the workpiece due to the difference in peripheral speed between the center side and the outer peripheral side of the surface plate 1, and polishes the workpiece.

Conventionally, in order to supply workpieces to be polished onto the surface plate 1 of such a boring machine, an operator had to hold each workpiece by hand and place it on the surface plate.

For this reason, not only is the work complicated, but if the work is large or heavy, it is extremely difficult to place the work on the surface plate, which requires a great deal of effort and time. There were drawbacks such as the ease with which falling accidents could occur, so automation was desperately needed.

On the other hand, in the conventional apparatus, each top ring is held independently by an idler, so that the polishing conditions such as the rotational speed of each workpiece to be polished differ, resulting in uneven polishing.

The present invention has been made to solve the above problems,
The purpose is to provide a polishing method and device that automatically supplies workpieces onto a surface plate and polishes multiple workpieces under the same polishing conditions. In the polishing method, a workpiece to be polished is placed, and the workpiece is pressed onto a surface plate by a holder, and the surface plate is rotated to polish the workpiece. Around the board,
Guide rollers that hold each of the above-mentioned holders in contact with the center roller are provided at a predetermined interval, and facing one section of the surface plate, sequentially feed the workpieces onto the surface plate at fixed positions on the surface plate. A work supply device is provided, and in order to place the work on the surface plate, first, a first guide roller located at the innermost part in the rotational direction of the surface plate with respect to the work supply position is set at a predetermined position around the surface plate. At the same time, one work is supplied from the work supply device to a fixed position on the surface plate, and by rotating the surface plate, the work is placed between the first guide roller and the center roller. The workpiece is conveyed to a position where it is held in contact with the workpiece, and then a second guide roller adjacent to the surface plate in the counter-rotation direction is set at a predetermined position, and one workpiece is supplied from the workpiece feeding device to a fixed position on the surface plate. Then, by rotating the surface plate, the supplied workpiece is conveyed to a position where it is held in contact between the second guide roller and the center roller. A predetermined number of individual workpieces are placed on the surface plate sequentially from the innermost part in the rotational direction of the disk, and at an appropriate time during the arrangement work, each workpiece is pressed onto the surface plate by the holder, and the sencooler roller and/or guide are pressed. The polishing is performed by rotating the rollers to rotate each workpiece together with each holder on the surface plate, and rotating the surface plate while rotating each workpiece together with each holder on the surface plate.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIGS. 2(a) and 2(fb) show a plan view and a sectional view of a main part of a boring device according to the present invention, and FIG. 3 shows a perspective view thereof. 11 is a surface plate rotated by a drive shaft (not shown), and 12 is a center roller, which is installed in the center of the surface plate 11 so as to be rotatable by the drive shaft.

20.20... is a top ring placed on the surface plate 11, which is in contact with the center roller 12 by friction or by a gear, and is used to hold the workpieces 21, 21... in pressure contact with the boring surface. It is.

22.22... is a guide roller, and the top ring 20
A number corresponding to .degree.20... are installed around the surface plate 11 so as to be freely rotatable. Each guide roller 22, 22... is for holding the corresponding top ring 20, 20... in contact with the center roller 12,
By fixing the top rings 20, 20... in a predetermined position so that they do not rotate along the periphery of the surface plate ll, the rotational speed of each top ring 20, 20... is maintained constant. I can do it.

Further, each of the top rings 20, 20, . . . is provided so as to be movable in the vertical direction by appropriate means. The guide roller 22 is supported by a guide shaft 23 on a bracket 25, as shown in FIG. Therefore, the guide roller 22 can be reversed rearward about the shaft 28. Further, the guide roller 22 can be moved up and down by a cylinder 24 mounted on a bracket 25 via a guide shaft 23.

Note that instead of driving the center roller 12, a drive source may be connected to the guide roller 22, and this may be used as a drive shaft, and the top ring 20 may be configured to rotate by rotating the guide roller 22. .

The overall reference numeral 33 is a work supply device, and this work supply device 33 includes a belt conveyor 42 for conveying the work 21 to a predetermined position, and a workpiece conveyed by the belt conveyor 42 is placed on a surface plate ll. It consists of an arm 34 for

21 is a disk-shaped workpiece, 34 is a workpiece 21° 21
... onto the surface plate 11. A chuck 35 for gripping and supplying the workpieces 21, 21, . . . is provided at the tip of the arm 34. The chuck 35 is formed by two claws 35a, 35a fixed to the arm body 36, and a claw 35b that opens and closes the chuck 35 in conjunction with a chuck opening/closing cylinder 37 provided on the arm body 36. has been done. On the other hand, an attachment part 39 for attaching a weight 38 is formed at the other end of the arm 34, and the weight of the weight 38 is adjusted according to the weight of the workpiece 21 to maintain the balance of the arm 34. The arm 34 moves up and down along the four pillars 4 (l) of the holding stand 40 by means of a lifting cylinder 43 provided on the upper surface of the holding stand 40.

42 is linked to the movement of the arm 34 to move the workpieces 21°21.
A belt conveyor for transporting...

A sliding portion 41 to which a holding table 4o is fixed is movably mounted on a rail 44 extending longitudinally along the belt conveyor 42.

Next, the method of the present invention using the above-mentioned apparatus will be explained based on FIGS. 2 to 5 together with the operation of the apparatus.

Four works 21 are placed on the belt conveyor 42 (FIG. 5(a)). On the other hand, set the guide roller 22a,
The other guide rollers 22b to 22d are moved upward by the cylinder 24 so that they do not interfere with the workpiece moving on the surface plate 11. Next, the sliding portion 41 of the arm 34
After moving the arm 34 backward, the lifting cylinder 43 lowers the arm 34 to the gripping position of the first workpiece 21A, and the chuck opening/closing cylinder 37 is moved to open the chuck 35 linked to the cylinder 37. The claw portion 35b moves, the chuck 35 closes, and the workpiece 21A
grasp. Then, the arm 3j is raised by the lifting cylinder 43, and the sliding portion 41 of the end arm 34 is moved forward again to position the workpiece 21A above the surface plate 11. Furthermore, the arm 34 is lowered by the lifting cylinder 43, and the chuck 3 is lowered by the chuck opening/closing cylinder 37.
5 and place the workpiece 21A on the surface plate 11 (FIG. 5(b)).

The surface plate 11 is moved in the direction of arrow E, and the center roller 12 is moved in the direction of arrow F.
Since the workpiece 21A rotates in the direction, the workpiece 21A moves along the peripheral part of the surface plate 11 and is held between the center roller 12 and the guide roller 22a at the innermost part of the surface plate 11 in the rotational direction (
5th itC)).

Next, the second guide roller 22b adjacent to the surface plate 11 in the counterclockwise direction is lowered and set, and then the second workpiece 21B being conveyed to a predetermined position is moved by operating the arm 34 in the same manner as described above. Place it on the surface plate 11.
Figure (dl), similarly to the above, the workpiece 21B rotates around the surface plate 11, and the center roller 12 and guide roller 2
2b (FIG. 5(e)). In this way, as shown in FIG. is placed on the surface plate by the arm 34, and then each of the works 21A to 21D is placed on the top ring 2.
0.20... is held in pressure contact with the polishing surface, and polishing is started. At this time, each top ring 20.20
... is the center roller 12 and each guide roller 22.2
Since the workpieces 21 and 2 rotate and are held between
No uneven polishing occurs in A to 21D.

After the boring is completed, by reversing the feeding order of the arm 34, each of the works 21A to 21D can be automatically taken out. Further, as shown in FIG. 5(i), after each top ring 20, 20... is raised, each work 21A to 2
1D may also be taken out.

The preferred embodiment of the present invention has been described above using a boring machine as an example, but it goes without saying that it can also be used as a lapping machine by changing the polishing surface of the surface plate and the size of the abrasive grains. Note that a carrier ring having the same structure as the top ring is used as a workpiece holder.

As described above, according to the present invention, the workpiece and the ring-shaped holder are held in contact with each other between the center roller and each guide roller and rotated. The workpieces can be polished under the same conditions, and uneven polishing does not occur. In addition, each guide roller is provided so that it can freely move toward and away from the workpiece and the holder, so the workpiece can be automatically fed onto and removed from the surface plate. Even if the system is large, it does not require much manpower and can be very effective in preventing accidents.

Although the present invention has been variously explained above with reference to preferred embodiments, the present invention is not limited to these embodiments (it goes without saying that many modifications can be made without departing from the spirit of the invention). That's true.

[Brief explanation of drawings]

Figure 1 is a plan view of a conventional boring machine, Figures 2 to 4
The figure shows an embodiment of the present invention, and Figure 2 +a), t
FIG. 3 is a perspective view, FIG. 4 is a side view of a guide roller, and FIG. 5 is an explanatory diagram showing a procedure for arranging a workpiece. 1...Surface plate, 2...Top ring. 3... Surface plate body, 4... Guide, 5... Idler, 6... Pipe, 11... Surface plate, 12... Center roller, 20... Top ring, 21... - Workpiece, 22... Guide roller, 23... Guide shaft. 24...Cylinder, 25.26...Bracket,
28... Axis, 33... Work supply device, 34...
・Arm, 35...Chuck, 35a, 35b...
Claw portion, 3.6...-Arm body, 37... Cylinder for chuck opening/closing, 38... Weight 39... Mounting part. 40... Holding stand, 401... Support column, 41... Sliding s, 42... Belt conveyor. 43... Cylinder for lifting and lowering, 44... Rail. Patent applicant Fujikoshi Machine Industry Co., Ltd. Representative Tomomi Ichikawa Figure 1 Figure 3 Figure 4 Figure 5 Figure 1A Figure 5 1A

Claims (1)

[Claims] 1. A polishing method in which an appropriate number of workpieces to be polished are placed on a surface plate, and the workpieces are pressed onto the surface plate by a holder while rotating the surface plate to polish the workpieces. A center roller is arranged in the center of the fixed plate, and guide rollers are provided around the fixed plate at predetermined intervals for holding each of the holders in contact with the center roller, and A work supply device facing one area of the surface plate and sequentially feeding workpieces onto the surface plate is provided at a certain position on the surface plate. The first guide roller located at the innermost part in the rotational direction is set at a predetermined position around the surface plate, and one workpiece is supplied from the work supply device to a fixed position on the surface plate, and this supplied workpiece is By rotating the surface plate, the workpiece is conveyed to a position where it is held in contact with the first guide roller and the center roller, and then the second guide roller adjacent to the surface plate in the counter-rotation direction is moved to a predetermined position. At the same time, one workpiece is supplied from the workpiece supply device to a fixed position on the surface plate, and by rotating the surface plate, the workpiece is placed in the second position.
A predetermined number of workpieces are sequentially placed on the surface plate from the innermost part in the direction of rotation of the surface plate with respect to the work supply position, such that the workpieces are transported to a position where they are held in contact between the guide roller and the center roller. , At an appropriate time during the arrangement work, each workpiece is pressed onto the surface plate by the holder, and the center roller and/or guide roller is rotated to rotate each workpiece together with each holder on the surface plate to hold each workpiece. A polishing method characterized by polishing by rotating each workpiece together with the tool on a surface plate while rotating the surface plate. 2. A polishing device in which a plurality of holders for setting a workpiece are arranged on a surface plate, and the workpiece is pressed against the surface plate by the holders, and the surface plate is rotated to polish the workpiece. a center roller which is rotatably installed in the center and which each of the holders abuts; a work supply device which faces one section of the surface plate and sequentially supplies the workpieces onto the surface plate at a fixed position on the surface plate; a number of guide rollers corresponding to the holders, each of which is rotatably held between the holders and the center roller, and provided around the surface plate so as to be movable toward and away from the holders; A polishing device characterized by: