JPS6083329A - Exposure device for pattern - Google Patents

Abstract

PURPOSE:To position substrates automatically and mutually by mounting a plurality of cameras having means compensating optical path difference among positional marks put to each substrate. CONSTITUTION:The lower sections of cameras 10, 11 constitute objectives and their upper sections position detecting sections. Lighting lamps 12 are fitted to the objectives. Lamps 13 illuminate the back of a pattern forming substrate 2 to be exposed. Glass plates 14 focus each positional marks of a mask substrate 6 and the substrate 2 to be exposed positioned at the lower section of the substrate 6 by the lamps 12. Patterns are formed previously at the corner side sections of each substrate regarding the positional marks 15. The carried-in substrate 2 to be exposed placed on a base is positioned roughly through a three- point collision system. The glass plate 14 eliminates the blooming of the reading of the marks on the substrate side to be exposed by a clearance (d) by using the optical refractive index of glass, and compensates the optical path difference of the cameras of the clearance (d).

Description

[Detailed description of the invention] <a>Technical field of invention The present invention relates to a pattern exposure apparatus.

(b) Background of the Technology The present invention uses an industrial camera (so-called ITV camera), reads the coordinates of a substrate position mark projected on the camera, and forms an exposed pattern on an exposed mask substrate. IL
An automatic positioning method for an exposure apparatus that aligns a plate with a plate in a short time and with a predetermined accuracy is shown in 1.

(C) Problems with the Prior Art Conventional 1 For example, it is necessary to accurately align a pattern-formed substrate to be processed and an exposed resist mask substrate before pattern exposure.

FIG. 1 is a perspective view illustrating a method of positioning a pattern-formed substrate on the exposed side on an apparatus base using a three-point abutting method.

In the figure, l is the base of the exposure device, 2 is the semi-transparent (milky white) ceramic substrate on the exposed side that forms the circuit pattern formed by 111 people on the base, and 3 is the exposed substrate 2, for example, X Coordinate side positioning river base 1 installation pillar.

4 and 5 are pillars for positioning the Y coordinate side with respect to the substrate 2;
and 6 are transparent mask bases tM (temporary glass of 1!X 1 to 1.6 mm) for forming resist patterns for exposure. The peripheral edge of the mask substrate 6 is mechanically fixed to a mask substrate mounting section of an exposure apparatus. Arrows P1 and P2 in the figure indicate positioning abutments against the substrate 2 placed on the base.

The substrate 2 that has been positioned at the abutment Pl and P2 is
The base 1 is lifted in the direction of the bold arrow, brought into close contact with the mask substrate 6, and then the pattern is exposed and printed by irradiating ultraviolet light from above the substrate 6.

When the exposure and printing is completed, the base is lowered, and the exposed pattern-forming substrate is sent to an etching process for pattern generation by a belt mechanism or the like, and the primary substrate 2 is carried into the base 1.

However, in the conventional substrate butting method before ultraviolet light irradiation, the mask substrate 6 fixed to the apparatus side and the patterned substrate 2 to be exposed are positioned visually, so the accuracy is low.

Also, there is a problem in that positioning takes time.

(d) Purpose of the invention An object of the present invention is to solve the above problems.

The present invention is to automatically perform positioning by projecting the alignment between the substrates in the pattern exposure apparatus onto an industrial camera.

(e) Structure of the Invention The object is to compensate for the optical path difference between the position marks made on each of the substrates in a pattern exposure apparatus in which an exposure mask substrate and a pattern-formed substrate to be exposed are superimposed. This is achieved by providing a plurality of cameras equipped with means.

(f) Embodiments of the Invention Below, an embodiment of positioning between substrates using a plurality of cameras of the present invention will be described with reference to two drawings. FIG. 2 is a perspective view of an embodiment of the pattern exposure apparatus, and FIG. 3 is a diagram illustrating an outline of a method for aligning substrates using a plurality of cameras in FIG. 2.

The configuration of the main parts of the exposure apparatus of the present invention will be explained in detail from the perspective view of FIG.

In the figure, reference numerals 10 and 11 are both cameras, the one on the other side is the objective lens, and the upper side is the field of view of the camera constituting the position detection section. 12 is an illumination lamp attached to the objective lens; 13 is a lamp that illuminates the back surface of the pattern-forming substrate 2 to be exposed;
4 is a glass plate for focusing the camera-side illumination lamp 12 on each position mark of the mask substrate 6 and the exposed substrate 2 located further below; and 1!5.
are the position marks patterned in advance on the corners of each substrate.

The position mark 15 may be a black square mark as shown in the figure, or a black gradation rectangular mark from which the camera viewing angle mark can be easily read.

The glass plate 14 located at the solid line position in the figure is used to detect marks 15 on the mask substrate. On the other hand, the lower part of the mask substrate 2
When detecting the position mark 15 of the two exposed substrates having the gap shown in the figure d, the substrate is slid to the dotted line position shown in the figure.

The gap between the substrates is a gap for preventing the substrates from sliding against each other when the substrate to be exposed is carried in and out of the mask substrate 6 fixed on the exposure apparatus side, thereby protecting the mask from scratches.

However, the substrate 2 to be exposed, which is carried in and placed on a base, is roughly positioned using the conventional three-point abutment method (see FIG. 1).

The lamp 13 illuminates from the back side of the substrate to be exposed.

The position mark is irradiated using the translucency of the ceramic substrate 2 to illuminate its silhouette. Also, lamp I3.

The camera field of view self-position mark by the vertical illumination lamp 12 is
It is also effective when sharpness is lacking due to decreased contrast.

The glass plate 14 attached to the camera side uses the optical refractive index of the glass to eliminate out-of-focus when reading marks on the exposed substrate due to the gap d, and compensates for the camera optical path difference due to the gap d, so that the glass can be taken in and out. This enables clear position mark detection.

Incidentally, the mask substrate thickness is 1.6 mm, and the gap d is 0.95 m.
m, the focusing glass plate 14 has a thickness of about 3.2++ m.

However, when the mutual positioning of the plurality of cameras between the substrates, which will be described below, is completed, the gap d is closed (-L'i\ of the base 1) and exposure for pattern transfer is performed.

Next, an overview of the substrate positioning method using the camera 1o and the camera 11 before the pattern exposure will be explained with reference to FIG.

In FIG. 3, 16 is the field of view of the mutual board position mark image taken from the camera 11 side, and 17 is the field of view of the mutual board position mark image taken from the camera 11 side. The orthogonal solid lines are the coordinate axes (X-Y) on the mask substrate side fixed to the exposure device
, orthogonal dotted lines are the coordinate axes (X' and Y') of the substrate to be exposed that has been carried into the base l.

The figure shows that rough positioning has been performed using the three-point abutting method (see FIG. 1) and that the temporary coordinate origin deviation ΔX, deviation ΔY, and the offset Δθ are detected.

The positional deviation ΔX detected by the camera is automatically calculated from the position mark coordinate values of χ and χ1' and x2 and xJ in the two left and right visual fields 16 and 17 by reading 3. Regarding the positional deviation ΔY between the substrates, yl and y1
', and the two position mark reading data of y-work and yl.

The exposure apparatus of the present invention has positional deviations ΔX and ΔY between the substrates,
Detecting each data amount of and slope Δθ by a prior pattern recognition means, converting the detected data from analog to digital,
This is input to the servo motor on the base 1 side to automatically position the mutual boards.

However, when installing multiple cameras, a single camera must be moved to read the marks attached to fixed positions on the left and right.

That is, Ia mechanical i! that occurs when the camera moves horizontally. Since there is no '4 difference, both the positioning accuracy and the position matching speed (time until positioning) are improved.

(g) Effects of the Invention According to the pattern exposure apparatus of the present invention described in detail above, which performs optical mark detection and mutual positioning of substrates using detection marks, one positioning can be performed with an accuracy of 20 μm or less. Further, there is an advantage that the working time for positional alignment between substrates is significantly shortened. From this point of view, if this is applied to the pattern exposure process of IC manufacturing, it is expected to have great industrial effects, such as significantly improving productivity.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the positioning of the patterned substrate to be exposed using the three-point abutment method, FIG. 2 is a perspective view showing an example of positioning the pattern exposure apparatus of the present invention, and FIG. FIG. 2 is a diagram illustrating an overview of a method for aligning mutual substrates. In the figure, 1 is the base of the device, 2 is the exposed object (turn formation & temporary, 6 is the mask & plate, 10 and 11 are the turtles, 12 is the lamp,
13 is an illumination lamp on the back side of the substrate 2, 14 is a glass plate for focusing, 15 is a position mark, and 16 and 17 are camera field of view for photographing the position mark. Agent Patent Attorney Examination Hiroshi Part 1 Figure/'P2 Part 3 閤

Claims (3)

[Claims] (1) In a pattern exposure apparatus that overlaps and mounts an exposure mask substrate and a pattern-formed substrate to be exposed, the pattern exposure apparatus includes means for idi compensating for optical path differences between position marks attached to each of the substrates. A pattern exposure apparatus characterized by comprising a plurality of cameras. (2) A position mark on the semi-transparent patterned substrate is illuminated from the back side of the substrate to align and align it with the exposure mask substrate.
The pattern exposure apparatus described in . (3) Is the camera optical path difference with respect to the position arc of each board handled by the glass? 11. A patterned light-emitting device according to claim 1.