JPS6081832A - Masking process - Google Patents

Masking process

Info

Publication number
JPS6081832A
JPS6081832A JP19182383A JP19182383A JPS6081832A JP S6081832 A JPS6081832 A JP S6081832A JP 19182383 A JP19182383 A JP 19182383A JP 19182383 A JP19182383 A JP 19182383A JP S6081832 A JPS6081832 A JP S6081832A
Authority
JP
Japan
Prior art keywords
coated
guide
masking tape
masking
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19182383A
Other languages
Japanese (ja)
Inventor
Masaaki Sadamori
貞森　將昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP19182383A priority Critical patent/JPS6081832A/en
Publication of JPS6081832A publication Critical patent/JPS6081832A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To simplify the specific part on the surface assuring masking process by a method wherein a masking tape whereon paste is spread only on the part for marking while the part with no paste spread on may be easily peeled off after spreading is utilized. CONSTITUTION:A substrate 1 is inserted from lower surface of a guide 5 while a masking tape 6 is inserted from upper surface of the guide 5 and then a weight 7 is placed on the guide 5 to press the masking tape down to the substrate 1 so that the central part 6a of the masking tape 6 may be temporarily sticked on the substrate 1 by the paste spread on the central part 6a. Later if the guide 5 is pulled out upward, the peripheral part 6b of the masking tape 6 is removed together with the upper weight 7 by the projection 5a provided on the inner wall surface of the guide 5 simultaneously with the guide 5. Through these procedures, the central part 6a only of the masking tape 6 is sticked on the upper surface of the substrate 1. Next the peripheral part of the upper surface of the substrate 1 is coated with RTV rubber 2 in such a status. Later after vulcanizing the RTV rubber 2 at room temperature, the central part 6a of the masking tape 6 may be peeled off.

Description

【発明の詳細な説明】 〔発明の技術分野〕 この発明は例えば半導体基板のような比較的小面積の平
表面を有する被塗布体のその表面の周縁部に流動性を有
する硬化性塗布物を塗布する際のマスキング方法に関す
るものである。Detailed Description of the Invention [Technical Field of the Invention] The present invention applies a curable coating material having fluidity to the periphery of the surface of an object to be coated, such as a semiconductor substrate, which has a flat surface with a relatively small area. This relates to a masking method during coating.

以下、半導体基板の表面の周縁部に室温加硫形ゴム（Ｒ
ＴＶゴム）を塗布する場合を例にとって説明する。Hereinafter, a room-temperature vulcanized rubber (R
The case of applying TV rubber) will be explained as an example.

〔従来技術〕[Prior art]

第１図は従来の電力用半導体装置の基板を一部破断して
示す斜視図で基板（１）は概ねその主面は乎坦面をなし
、その周縁部は極めて清浄にした上でＲＴＶゴム（２）
を塗布して電気的絶縁耐性を高めるように々されてｂる
が、その基板（１）の主面の中央部（３）＃″ｌ：ｌ：
電極部位であるからＲＴＶゴムのような絶縁物の付着は
許されない。Figure 1 is a partially cutaway perspective view of a board of a conventional power semiconductor device. (2)
The central part (3) of the main surface of the substrate (1) is
Since this is an electrode site, adhesion of insulating materials such as RTV rubber is not allowed.

ところが、従来のマスクを用い々−塗布方法では、第１
図に示すようにＲＴＶゴム（２）の中央部（３）への溢
流部（４）を生じ、ＲＴＶゴム（２）が加硫硬化したの
ちに、この溢流部（４）を切除する必要があり、手数が
かかる上に、切除作業中に周縁部のＲＴＶゴムを切除し
てしまったり、中央部（３）の電極を傷つけたりするお
それがあった。However, in the conventional coating method using a mask, the first
As shown in the figure, an overflow part (4) is formed in the center part (3) of the RTV rubber (2), and after the RTV rubber (2) is vulcanized and hardened, this overflow part (4) is cut off. This is necessary and time-consuming, and there is a risk that the RTV rubber at the peripheral edge may be cut off during the cutting operation or the electrode at the center (3) may be damaged.

〔発明の概要〕[Summary of the invention]

この発明は以上のような点に鑑みてなされたもので、被
塗布体表面にマスキングテープを貼るに当って、マスキ
ングすべき部分に対応する部分にのみ糊剤が施され他の
部分には糊剤が施されて居らず、かつ、貼布後糊剤が施
されていない部分を簡単に除去できるように構成された
マスキングテープを用することによって、被塗布体の表
面の所要部分を簡単に、しかも確実にマスキングする方
法を提供するものである。This invention was made in view of the above points, and when applying masking tape to the surface of an object to be coated, adhesive is applied only to the part corresponding to the part to be masked, and the other parts are left with glue. By using a masking tape that is not coated with adhesive and is structured so that the unattached areas can be easily removed after application, the desired area of the surface of the object to be coated can be easily removed. Moreover, it provides a reliable method of masking.

〔発明の実施例〕[Embodiments of the invention]

簗２図はこの発明の一実施例に用いる各部品を示す斜視
図で、（５）は基板（１）の外径と略等しい内径を有し
、内壁面には斜め上方を向いた数個の突起部（５ａ）を
有するガイド、（６）は下面に糊剤が施された中央部（
第２の部分）　（６ａ　）と糊剤が施されてｂない周縁
部（第１の部分）（６１：＋）とにあらかじめ分断され
てはいるが、中央部（６ａ）は周縁部（６ｂ）に嵌め込
まれ相互の弾力によって一体形状を保持しているマスキ
ングテープ、（７）は錘りである。Figure 2 is a perspective view showing each component used in an embodiment of the present invention, in which (5) has an inner diameter approximately equal to the outer diameter of the substrate (1), and on the inner wall surface are several parts facing diagonally upward. The guide has a protrusion (5a), and (6) has a central part (6) with adhesive applied to the lower surface.
Although the central part (6a) is divided in advance into the peripheral part (first part) (61:+) which is not coated with adhesive, the central part (6a) is separated from the peripheral part (6b). ) is fitted into the masking tape and held in one piece by mutual elasticity, and (7) is a weight.

第３図はこの発明の一実施例の実施状況を示す断面図で
、まず、図Ａに示すように、ガイド（５）の下面から基
板（１）を挿入し、上面からマスキングテープ（６）を
挿入し、その上から錘り（７）を入れてマスキングテー
プ（６）を軽く基板（１）に押圧することによって、マ
スキングテープ（６）の中央部（６ａ）をそこに施され
ている糊剤によって、基板（１）に一時的に貼りつける
。その後に、図Ｂに矢印で示されるようにガイド（５）
を上方に抜き去ると、ガイド（５）の内壁面に設けられ
た突起部（５ａ）によってマスキングテープ周縁部（６
ｂ）はその上の錘り（７）とともにガイド（５）と同時
に除去される。このようにして、基板（１）の上面には
マスキングテープ中央部（６ａ）のみが貼りつけられた
状態となる。次に、図Ｃに示すように、その状態でＲＴ
Ｖゴム（２）を例えばヘラ、注射器などで、基板（１）
の上面周縁部に塗布する。その後、ＲＴＶゴム（２）が
室温加硫したのち、マスキングテープ中央部（６ａ）を
削ぎ取ると、図りに示すように、基板（１）の電極形成
部である中央部（３）を所望の形に残してＲＴＶゴム（
２）の形成が完了する。FIG. 3 is a sectional view showing the implementation status of one embodiment of the present invention. First, as shown in FIG. A, the substrate (1) is inserted from the bottom surface of the guide (5), and the masking tape (6) is By inserting the weight (7) from above and lightly pressing the masking tape (6) against the board (1), the center part (6a) of the masking tape (6) is applied there. It is temporarily attached to the substrate (1) using adhesive. Then guide (5) as indicated by the arrow in Figure B.
When the masking tape is pulled upward, the peripheral edge of the masking tape (6
b) is removed simultaneously with the guide (5) together with the weight (7) above it. In this way, only the center portion (6a) of the masking tape is attached to the upper surface of the substrate (1). Next, as shown in Figure C, RT
Using a spatula, syringe, etc., apply the V-rubber (2) to the substrate (1).
Apply to the periphery of the top surface. After that, after the RTV rubber (2) is cured at room temperature, the center part (6a) of the masking tape is scraped off, and as shown in the diagram, the center part (3), which is the electrode forming part, of the substrate (1) is shaped into the desired shape. Leave it in shape and use RTV rubber (
Formation of step 2) is completed.

なお、この発明の実施に用いるガイド（５）、錘り（７
）はステンレス鋼などの通常の材料でよく、マスキング
テープ（６）もスポンジ状のネオプレンフオームなどの
通常の材料でよく、特殊な材料を必要としな−。Note that the guide (5) and weight (7) used in carrying out this invention are
) can be made of ordinary materials such as stainless steel, and the masking tape (6) can also be made of ordinary materials such as sponge-like neoprene foam, and does not require any special materials.

上記説明は半導体基板の表面の周縁部にＲＴＶゴムを塗
布する場合を例にとって行ったが、この発明はこれ以外
の一般の被塗布体の表面に流動性物質を選択塗布する際
のマスキングにも広く適用できる。Although the above explanation has been made using the example of applying RTV rubber to the peripheral edge of the surface of a semiconductor substrate, the present invention can also be applied to masking when selectively applying a fluid substance to the surface of other general objects to be coated. Widely applicable.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、この発明では被塗布体主面にマス
キングテープを貼るに当って被塗布体の外周形状と等し
い外周形状を有しマスキングすべき部分に対応する部分
にのみ糊剤が被着されており、かつ貼布後は糊剤が被着
されていない部分を簡単に分離除去できるように構成さ
れたマスキングテープを用いるので、被塗布体の主面所
要部分を簡単にかつ確実にマスキングできる。As explained above, in the present invention, when applying a masking tape to the main surface of an object to be coated, the adhesive adheres only to the portion that has the same outer circumferential shape as the outer circumferential shape of the object to be coated and corresponds to the portion to be masked. Since the masking tape is constructed so that the parts that are not coated with glue can be easily separated and removed after application, the desired parts of the main surface of the object to be coated can be easily and reliably masked. can.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の電力用半導体装置の基板を一部破断して
示す斜視図、第２図はこの発明の一実施例に用いる各部
品を示す斜視図、第３図はこの発明の一実施例の実施状
況を示す断面図である。 図において、（１）は被塗布体（基板）、（２）は塗布
物質（ＲＴＶゴム１　、（５）はガイド、（５ａ）は小
突起部、（６）はマスキングシー）　、（６ａ）は第２
の部分（中央部）、（ａｂ）Ｖｉ第１の部分（周縁部）
、（７）　Ｖｉ錘りである。 なお、図中同一符号は同一または相当部分を示す。 代理人　大岩増雄 （Ｑ 喝１ 手続補正書（自発） １．事件の表示　特願昭５８−１９１８２３号２、発明
の名称　ｆｆニヤ、グ方法 ３、補正をする者 ５、補正の対象 明細書の発明の詳細な説明の欄 ６、補正の内容 （２）FIG. 1 is a partially cutaway perspective view of a board of a conventional power semiconductor device, FIG. 2 is a perspective view showing each component used in an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. FIG. 3 is a cross-sectional view showing an implementation situation of an example. In the figure, (1) is the object to be coated (substrate), (2) is the coating material (RTV rubber 1, (5) is the guide, (5a) is the small protrusion, (6) is the masking sheet), (6a) is the second
(center), (ab)Vi first part (periphery)
, (7) is a Vi weight. Note that the same reference numerals in the figures indicate the same or corresponding parts. Agent Masuo Oiwa (Q) Written amendment (voluntary) 1. Indication of the case Japanese Patent Application No. 58-191823 2, Title of the invention ff. Detailed Description of the Invention Column 6, Contents of Amendment (2)

Claims (2)

【特許請求の範囲】[Claims] （１）実質的に平坦な主面を有しこの主面の周縁部に流
動性塗布物質を選択塗布すべき被塗布体の上記主面上に
、この主面の外周形状と実質的に等しい外周形状をなし
上記周縁部に対応する第１の部分とその他の第２の部分
とが互いに容易に分割できるように一体に構成されると
ともに上記第２の部分にのみ糊剤が被着されたマスキン
グシートを載置し、所要の圧力を印加して上記マスキン
グシートの第２の部分を上記被塗布体の上記主面上に貼
りつけた後、上記主面の周縁部上の上記マスクシートの
第１の部分を除去することを特徴とするマスキング方法
。(1) On the main surface of the object to be coated, which has a substantially flat main surface and is to be selectively coated with a fluid coating substance on the periphery of this main surface, the shape is substantially equal to the outer peripheral shape of this main surface. A first portion having an outer peripheral shape and corresponding to the peripheral edge portion and the other second portion are integrally constructed so as to be easily separated from each other, and adhesive is applied only to the second portion. After placing a masking sheet and applying a required pressure to adhere the second part of the masking sheet onto the main surface of the object to be coated, the second part of the masking sheet is placed on the peripheral edge of the main surface. A masking method comprising removing a first portion. （２）被塗布体の外周形状とほぼ等しＡ内周形状の筒状
体をなし、その内部を上記被塗布体を摺動可能であると
ともにその内壁面に斜上方に向う小突起部がその筒状体
の軸に垂直な一平面内に複数個設けられたガイドの下面
から上記被塗布体を、上面からマスキングシートとこれ
を上記被塗布体に押圧する錘りを挿入して上記マスキン
グシートの第２の部分が上記被塗布体の主面に貼りつｂ
た後、上記ガイドを上記小突起部によって上記マスキン
グシートの第１の部分とともに離脱させることを特徴と
する特許請求の範囲第１項記載のマスキング方法。(2) Forms a cylindrical body with an inner circumference shape that is approximately equal to the outer circumference of the object to be coated, and allows the object to be coated to slide inside the body, and has a small protrusion facing obliquely upward on its inner wall surface. The object to be coated is masked by inserting a masking sheet and a weight that presses the masking sheet onto the object from the upper surface from the upper surface of the guide, which is provided in a plane perpendicular to the axis of the cylindrical body. The second portion of the sheet is attached to the main surface of the object to be coated.
2. The masking method according to claim 1, wherein the guide is removed together with the first portion of the masking sheet by the small protrusion.
JP19182383A 1983-10-12 1983-10-12 Masking process Pending JPS6081832A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19182383A JPS6081832A (en) 1983-10-12 1983-10-12 Masking process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19182383A JPS6081832A (en) 1983-10-12 1983-10-12 Masking process

Publications (1)

Publication Number Publication Date
JPS6081832A true JPS6081832A (en) 1985-05-09

Family

ID=16281112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19182383A Pending JPS6081832A (en) 1983-10-12 1983-10-12 Masking process

Country Status (1)

Country Link
JP (1) JPS6081832A (en)

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