JPS6079826U - Filter package - Google Patents

Filter package

Info

Publication number
JPS6079826U
JPS6079826U JP17008583U JP17008583U JPS6079826U JP S6079826 U JPS6079826 U JP S6079826U JP 17008583 U JP17008583 U JP 17008583U JP 17008583 U JP17008583 U JP 17008583U JP S6079826 U JPS6079826 U JP S6079826U
Authority
JP
Japan
Prior art keywords
filter package
thin plate
filter
cap
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17008583U
Other languages
Japanese (ja)
Inventor
猪原 淳一
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP17008583U priority Critical patent/JPS6079826U/en
Publication of JPS6079826U publication Critical patent/JPS6079826U/en
Pending legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、従来例の基板の構成図、第2図は、同フィル
タの断面図、第3図は、本考案の一実施例の基板の構成
図、第4図は、同実施例のフィルタの断面図である。 3・・・・・・キャップ、4・・・・・・フィルタチッ
プ、6・・・・・・ワイヤ、8・・・・・・絶縁層、9
・・・・・・電極、10・・・・・・アルミニウム薄板
FIG. 1 is a block diagram of a conventional substrate, FIG. 2 is a sectional view of the same filter, FIG. 3 is a block diagram of a substrate of an embodiment of the present invention, and FIG. 4 is a block diagram of the same filter. It is a sectional view of a filter. 3... Cap, 4... Filter chip, 6... Wire, 8... Insulating layer, 9
... Electrode, 10 ... Aluminum thin plate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] アルミニウム等の軟質の薄板の一主面に絶縁層と電極と
を順次形成し、前記薄板の前記電極を設けた一対の端部
を裏面側に折り返してなる基板上゛に、フィルタチップ
を搭載し1、その上をキャップで覆って密封したことを
特徴とするフィルタパッケージ。
An insulating layer and an electrode are sequentially formed on one main surface of a soft thin plate made of aluminum or the like, and a filter chip is mounted on a substrate formed by folding back a pair of ends of the thin plate on which the electrodes are provided. 1. A filter package characterized by covering and sealing the top with a cap.
JP17008583U 1983-11-04 1983-11-04 Filter package Pending JPS6079826U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17008583U JPS6079826U (en) 1983-11-04 1983-11-04 Filter package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17008583U JPS6079826U (en) 1983-11-04 1983-11-04 Filter package

Publications (1)

Publication Number Publication Date
JPS6079826U true JPS6079826U (en) 1985-06-03

Family

ID=30371398

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17008583U Pending JPS6079826U (en) 1983-11-04 1983-11-04 Filter package

Country Status (1)

Country Link
JP (1) JPS6079826U (en)

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