JPS6079753U - 半導体リ−ドフレ−ムのリ−ド折曲装置 - Google Patents

半導体リ−ドフレ−ムのリ−ド折曲装置

Info

Publication number
JPS6079753U
JPS6079753U JP17357883U JP17357883U JPS6079753U JP S6079753 U JPS6079753 U JP S6079753U JP 17357883 U JP17357883 U JP 17357883U JP 17357883 U JP17357883 U JP 17357883U JP S6079753 U JPS6079753 U JP S6079753U
Authority
JP
Japan
Prior art keywords
molded product
lead
bending
support mechanism
bending device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17357883U
Other languages
English (en)
Japanese (ja)
Other versions
JPS633165Y2 (cg-RX-API-DMAC7.html
Inventor
剛 天川
Original Assignee
長田　道男
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 長田　道男 filed Critical 長田　道男
Priority to JP17357883U priority Critical patent/JPS6079753U/ja
Publication of JPS6079753U publication Critical patent/JPS6079753U/ja
Application granted granted Critical
Publication of JPS633165Y2 publication Critical patent/JPS633165Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP17357883U 1983-11-08 1983-11-08 半導体リ−ドフレ−ムのリ−ド折曲装置 Granted JPS6079753U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17357883U JPS6079753U (ja) 1983-11-08 1983-11-08 半導体リ−ドフレ−ムのリ−ド折曲装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17357883U JPS6079753U (ja) 1983-11-08 1983-11-08 半導体リ−ドフレ−ムのリ−ド折曲装置

Publications (2)

Publication Number Publication Date
JPS6079753U true JPS6079753U (ja) 1985-06-03
JPS633165Y2 JPS633165Y2 (cg-RX-API-DMAC7.html) 1988-01-26

Family

ID=30378098

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17357883U Granted JPS6079753U (ja) 1983-11-08 1983-11-08 半導体リ−ドフレ−ムのリ−ド折曲装置

Country Status (1)

Country Link
JP (1) JPS6079753U (cg-RX-API-DMAC7.html)

Also Published As

Publication number Publication date
JPS633165Y2 (cg-RX-API-DMAC7.html) 1988-01-26

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