JPS6078710A - Cutter for semiconductor wafer - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] This invention provides a method for immediately stopping the operation of the rotary cutting teeth and the stage when the rotating cutting teeth vibrate abnormally for some reason when cutting a semiconductor wafer, and This relates to a device for cutting semiconductor sea urchins that operates at 5tC to notify the operator of abnormalities.

[Prior art]

Fig. 1 is a diagram showing cutting locations of a conventional semiconductor wafer cutting device, in which Fig. 1<a) is a front view and Fig. 1 (kl is a side view).In these figures, 1 is a rotary cutting tooth. , 2 is a semiconductor wafer to be cut, and 3 is a stage for setting the semiconductor wafer 2.

FIG. 2 is a block diagram showing a control circuit of a conventional semiconductor wafer cutting apparatus. In this figure, 4 is a control circuit, stage control circuit 5. The cent stage 3 is moved by controlling the stage operation motor 6. Further, the control circuit 4 controls the rotary cutting tooth control circuit T2 and the rotary cutting tooth operation motor 8 to drive the rotary cutting tooth 1 and cut the semiconductor wafer 2 on the stage moved by the setting stage 3.

In this way, when cutting the semiconductor wafer 2, the semiconductor wafer 2 is cut while moving the cent stage 3 of the semiconductor wafer 2 while rotating the rotary cutting teeth 1 at high speed. However, if the shape of the surface of the semiconductor urchin 1120 is abnormal or the stage i for resetting the semiconductor urchin 2 malfunctions due to noise etc., the entire semiconductor urchin 2 may be damaged or the rotary cutting tooth 1 may be damaged. This will result in material loss and a negative impact on quality.

[Summary of the invention]

This invention was made in consideration of the above point K, and is designed to stop the cutting operation of the semiconductor que/1 and notify the abnormal state when the surface shape of the semiconductor wafer is abnormal or when the setting stage malfunctions. This is what I did.

[Embodiments of the invention]

FIGS. 3(a) and 3(b) are a front view and a side view of a semiconductor wafer cutting apparatus showing an embodiment of the present invention;
3 are the same as those in FIG. 1, 9 is a light emitter, and 10 is a light receiver that receives light from the light emitter 9. These constitute a detection means for detecting an abnormal state.

Figure 4 is a block diagram showing the control circuit of this invention.
4 to B are the same as those in the wL2 diagram, 11 is a stop circuit that issues a stop signal based on the signal from the photoreceptor 10, 12
is a notification device, which includes a display device 13 that displays an abnormal state by a signal from a stop circuit 11, and an alarm device [1] that notifies an abnormal state.
It consists of 14. Further, 15 is a reset switch.

Next, the operation will be explained. For example, if the surface of the semiconductor wafer 2 is abnormal or the setting stage 3 of the semiconductor wafer/X2 malfunctions due to noise or the like, vibration will occur in the entire rotary cutting tooth 1, so that the wafer is not supplied to the photoreceptor 10 under normal conditions. Since the light emitted from the light emitter 9 that had been in use is blocked by the rotational cut #ilK, no light is supplied to the light receiver 1θ. Therefore, the stop circuit 11 is activated by the signal from the photoreceptor 10.

A stop signal is supplied to the control circuit 4, a stop signal is supplied to the stage control circuit 5, and the stage operation motor 6 is stopped. Similarly, 1 rotation cutting tooth control time WII
? A stop signal is also supplied to the rotary cutting tooth motor 8, and the rotary cutting tooth operation motor 8 is stopped. On the other hand, the display device 13. The alarm device 14 is also activated by a signal from the stop circuit 11, and displays and notifies the abnormal state. Therefore, damage to the rotary cutting teeth 1 and adverse effects on the quality of the semiconductor wafer 2 can be avoided.

In addition, in the above embodiment, the light emitter 9, the photoreceptor 10, and the K
Although the present invention uses light other than the above-mentioned light, such as ultraviolet light*, laser light, or infrared light, or an electromagnetic detection element can also be used to obtain the same effect. moreover,
The notification device 12 may include at least one of a display device 13 and an alarm device 14.

〔Effect of the invention〕

As explained above, the cutting device for semiconductor chips according to the present invention is provided with a detection means for detecting abnormal vibrations of the rotating cutting teeth, and automatically stops the rotating cutting teeth in response to a signal detecting the abnormal state. In addition, since the 51CL stops the stage for setting the semiconductor wafer to be cut, it is possible to prevent damage to the rotary cutting teeth and damage to the semiconductor wafer, and at the same time, it is possible to quickly find and deal with abnormalities in the equipment. can do. Further, a detection means using a light emitting body and a light receiving body has the advantage that abnormal vibration of the rotary cutting tooth can be detected with a simple and inexpensive structure.

[Brief Description of the Drawings] Figures 1 (a) and (b) are front and side views of a conventional semiconductor wafer cutting device, and Figure 2 is a control circuit of a conventional semiconductor wafer cutting device. Block diagram, Figure 3 (a
) and (b) are a front view and a side view of a semiconductor wafer cutting apparatus showing an embodiment of the present invention, and FIG. 4 is a block diagram of a control circuit of the present invention. In the figure, 1 is a rotary cutting tooth, 2 is a semiconductor wafer, 3 is a setting stage, 4 is a control circuit, 5 is a stage control circuit, 6 is a stage operation motor, 1 is a rotary cutting tooth control circuit, and 8 is a rotary cutting Motor for tooth movement, 9 is a light emitter, 10
1 is a photoreceptor, 11 is a stop circuit, 12 is a notification device, 13 is a display device, 14 is an alarm device, and 15 is a reset switch. Note that the same reference numerals in the figures indicate the same or corresponding parts. Agent Masuo Oiwa (and 2 others) Figure 1 (a) (b) Figure 24 Figure 3 (a) (b) Absolute Figure 4 1-go: +1

Claims (2)

[Claims] (1) The setting stage on which the semiconductor wafer to be cut is mounted is moved by driving a stage operation motor via a control circuit, and the rotary cutting teeth for cutting the semiconductor wafer are moved by the rotating cutting tooth operation motor. A semiconductor wafer cutting apparatus that cuts the semiconductor wafer by being driven by a motor for operating the stage, further comprising a detection means for detecting abnormal vibration of the rotary cutting teeth, and when the abnormal vibration is detected by the detection means, the stage operation motor A cutting device for semiconductor wafer 1, comprising: a stop circuit for stopping a rotary cutting tooth operation motor via the control circuit; and a notification device for notifying the abnormal vibration by a signal from the stop circuit. (2) The detection means for detecting abnormal vibrations of the rotary cutting teeth includes a light emitter and a light receiver, and detects that light between the light emitter and the light receiver is blocked by the abnormal vibration. A semiconductor wafer cutting device according to claim 11.