JPS6076067U - Connection structure of flexible circuit board - Google Patents

Connection structure of flexible circuit board

Info

Publication number
JPS6076067U
JPS6076067U JP16950083U JP16950083U JPS6076067U JP S6076067 U JPS6076067 U JP S6076067U JP 16950083 U JP16950083 U JP 16950083U JP 16950083 U JP16950083 U JP 16950083U JP S6076067 U JPS6076067 U JP S6076067U
Authority
JP
Japan
Prior art keywords
circuit board
flexible circuit
connection structure
land portion
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16950083U
Other languages
Japanese (ja)
Other versions
JPH0126120Y2 (en
Inventor
和夫 井上
Original Assignee
日本メクトロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本メクトロン株式会社 filed Critical 日本メクトロン株式会社
Priority to JP16950083U priority Critical patent/JPS6076067U/en
Publication of JPS6076067U publication Critical patent/JPS6076067U/en
Application granted granted Critical
Publication of JPH0126120Y2 publication Critical patent/JPH0126120Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はフレキシブル回路板と他の回路板との相互のラ
ンド部を半田接続する従来例の接続構造を概念的に示す
要部断面構成図、第２図１，２は本考案に従ったフレキ
シブル回路板と他の回路板とのランド部形状を概念的に
示す図、第３図は本考案によるフレキシブル回路板の接
続構造を概念的に示す要部断面構成図、第４図は本考案
の他の実施例による概念的な平面構成図である。 １・・・フレキシブル回路板、３・・・他の回路板、８
．１０・・・ランド部、９・・・透孔、１１・・・半田
。Fig. 1 is a cross-sectional configuration diagram of main parts conceptually showing a conventional connection structure in which mutual land portions of a flexible circuit board and another circuit board are soldered together, and Fig. 2 1 and 2 are diagrams showing the structure according to the present invention. A diagram conceptually showing the shape of a land between a flexible circuit board and another circuit board, FIG. 3 is a cross-sectional configuration diagram of main parts conceptually showing a connection structure of a flexible circuit board according to the present invention, and FIG. 4 is a diagram conceptually showing the connection structure of a flexible circuit board according to the present invention. FIG. 3 is a conceptual plan configuration diagram according to another embodiment. 1...Flexible circuit board, 3...Other circuit board, 8
．． 10...Land portion, 9...Through hole, 11...Solder.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）フレキシブル回路板における配線パターンのラン
ド部を他の回路板の配線パターンのランド部に半田接続
するような接続構造において、フレキシブル回路板の上
記ランド部を切欠してこの部分に扇状又は半円状の透孔
を設け、該透孔の下に位置する上記能の回路板のランド
部とフレキシブル回路板の上記ランド部とを上記透孔に
半田を充填することにより接続するように構成してなる
フレキシブル回路板の接続構造。(1) In a connection structure in which a land portion of a wiring pattern on a flexible circuit board is soldered to a land portion of a wiring pattern on another circuit board, the above-mentioned land portion of the flexible circuit board is cut out and this portion is shaped like a fan or half-shaped. A circular through hole is provided, and the land portion of the flexible circuit board located below the through hole is connected to the land portion of the flexible circuit board by filling the through hole with solder. Connection structure of flexible circuit board. （２）前記能の回路板のランド部が上記フレキシブル回
路板の透孔より大きく形成されてなる実用新案登録請求
の範囲（１）のフレキシブル回路板の接続構造。(2) The flexible circuit board connection structure according to claim (1), wherein the land portion of the flexible circuit board is formed larger than the through hole of the flexible circuit board.
JP16950083U 1983-10-31 1983-10-31 Connection structure of flexible circuit board Granted JPS6076067U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16950083U JPS6076067U (en) 1983-10-31 1983-10-31 Connection structure of flexible circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16950083U JPS6076067U (en) 1983-10-31 1983-10-31 Connection structure of flexible circuit board

Publications (2)

Publication Number Publication Date
JPS6076067U true JPS6076067U (en) 1985-05-28
JPH0126120Y2 JPH0126120Y2 (en) 1989-08-04

Family

ID=30370287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16950083U Granted JPS6076067U (en) 1983-10-31 1983-10-31 Connection structure of flexible circuit board

Country Status (1)

Country Link
JP (1) JPS6076067U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006044199A (en) * 2004-08-09 2006-02-16 Brother Ind Ltd Inkjet head
JP4723431B2 (en) * 2006-07-28 2011-07-13 シャープ株式会社 Circuit board manufacturing method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5226773U (en) * 1975-08-18 1977-02-24
JPS5640684U (en) * 1979-09-03 1981-04-15

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3839241A (en) * 1973-06-22 1974-10-01 Du Pont Isocyanate-modified neoprene foam process
JPS5640684B2 (en) * 1973-09-28 1981-09-22

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5226773U (en) * 1975-08-18 1977-02-24
JPS5640684U (en) * 1979-09-03 1981-04-15

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006044199A (en) * 2004-08-09 2006-02-16 Brother Ind Ltd Inkjet head
JP4622376B2 (en) * 2004-08-09 2011-02-02 ブラザー工業株式会社 Inkjet head
JP4723431B2 (en) * 2006-07-28 2011-07-13 シャープ株式会社 Circuit board manufacturing method

Also Published As

Publication number Publication date
JPH0126120Y2 (en) 1989-08-04

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