JPS6074447A - ワイヤボンデイング装置 - Google Patents

ワイヤボンデイング装置

Info

Publication number
JPS6074447A
JPS6074447A JP18261984A JP18261984A JPS6074447A JP S6074447 A JPS6074447 A JP S6074447A JP 18261984 A JP18261984 A JP 18261984A JP 18261984 A JP18261984 A JP 18261984A JP S6074447 A JPS6074447 A JP S6074447A
Authority
JP
Japan
Prior art keywords
bonding
arm
movement
tool
vertical movement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18261984A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6216017B2 (enrdf_load_stackoverflow
Inventor
Shunichiro Fujioka
俊一郎 藤岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP18261984A priority Critical patent/JPS6074447A/ja
Publication of JPS6074447A publication Critical patent/JPS6074447A/ja
Publication of JPS6216017B2 publication Critical patent/JPS6216017B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Manipulator (AREA)
JP18261984A 1984-09-03 1984-09-03 ワイヤボンデイング装置 Granted JPS6074447A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18261984A JPS6074447A (ja) 1984-09-03 1984-09-03 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18261984A JPS6074447A (ja) 1984-09-03 1984-09-03 ワイヤボンデイング装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP6002276A Division JPS52143946A (en) 1976-05-26 1976-05-26 Mechanism for elevationally moving bonding arm

Publications (2)

Publication Number Publication Date
JPS6074447A true JPS6074447A (ja) 1985-04-26
JPS6216017B2 JPS6216017B2 (enrdf_load_stackoverflow) 1987-04-10

Family

ID=16121453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18261984A Granted JPS6074447A (ja) 1984-09-03 1984-09-03 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS6074447A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6255947A (ja) * 1985-09-05 1987-03-11 Matsushita Electric Ind Co Ltd チツプ部品移載装着装置
JPS62213263A (ja) * 1986-03-14 1987-09-19 Toshiba Seiki Kk ペレット突き上げ方法
US5060841A (en) * 1985-12-25 1991-10-29 Hitachi, Ltd. wire bonding method and apparatus and method of producing semiconductor device by use of wire bonding apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6255947A (ja) * 1985-09-05 1987-03-11 Matsushita Electric Ind Co Ltd チツプ部品移載装着装置
US5060841A (en) * 1985-12-25 1991-10-29 Hitachi, Ltd. wire bonding method and apparatus and method of producing semiconductor device by use of wire bonding apparatus
JPS62213263A (ja) * 1986-03-14 1987-09-19 Toshiba Seiki Kk ペレット突き上げ方法

Also Published As

Publication number Publication date
JPS6216017B2 (enrdf_load_stackoverflow) 1987-04-10

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