JPS6073254U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS6073254U
JPS6073254U JP16588383U JP16588383U JPS6073254U JP S6073254 U JPS6073254 U JP S6073254U JP 16588383 U JP16588383 U JP 16588383U JP 16588383 U JP16588383 U JP 16588383U JP S6073254 U JPS6073254 U JP S6073254U
Authority
JP
Japan
Prior art keywords
conductor
wafer
diode
electrode post
flat package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16588383U
Other languages
Japanese (ja)
Inventor
公裕 村岡
Original Assignee
東洋電機製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東洋電機製造株式会社 filed Critical 東洋電機製造株式会社
Priority to JP16588383U priority Critical patent/JPS6073254U/en
Publication of JPS6073254U publication Critical patent/JPS6073254U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は公知例の半導体装置を示す縦断面説明図、第2
図は本考案の一実施例の要部構成を示す縦断面説明図で
ある。   − 12−・・・・・サイリスタペレット、12a・・・・
・・サイリスタウェファ、12b・・・・・・支持電極
、13−−−−−−ダイオードペレット、13a・・・
・・・ダイオードウェファ、13b・・・・・・支持電
極、17.17’・・・・・・導電板、19・・・・・
・絶縁板、20.20’・・・・・・電極ポスト、21
′・・・・・・補助電極ポスト。
FIG. 1 is a vertical cross-sectional explanatory diagram showing a known example of a semiconductor device, and FIG.
The figure is an explanatory longitudinal cross-sectional view showing the main part configuration of an embodiment of the present invention. - 12-... Thyristor pellet, 12a...
...Thyristor wafer, 12b...Support electrode, 13---Diode pellet, 13a...
...Diode wafer, 13b... Support electrode, 17.17'... Conductive plate, 19...
・Insulating plate, 20.20'... Electrode post, 21
'...Auxiliary electrode post.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 平形パッケージのアノード・カソード間を加圧してサイ
リスタウェファとダイオードウェファを固着させ該サイ
リスタウェファとダイオードウェファとの逆並列接続構
成をなす半導体装置において、サイリスタペレットのサ
イリスタウェファに着設された第1の支持電極とダイオ
ードペレットのダイオードウェファに着設された第2の
支持電極の間に第1の導電体を介在させ、かつ該第1の
導電体を平形パッケージのアノード電極ポストの内側へ
導き固着させるとともに、平形パッケージのカソード電
極ポストと該カソード電極ポス〜トの内側に具設された
補助カソード電極ポストとの間に第2の導電体を介在さ
せ、かつ該第1の導電体を前記ダイオードペレットのア
ノード電極に導き固着させ、前記第1の導電体と第2の
導電体の間に絶縁体を挿設させるようにしたことを特徴
とする半導体装置。
In a semiconductor device in which a thyristor wafer and a diode wafer are fixed by applying pressure between an anode and a cathode of a flat package, and the thyristor wafer and the diode wafer are connected in antiparallel, a first A first conductor is interposed between the support electrode and a second support electrode attached to the diode wafer of the diode pellet, and the first conductor is guided and fixed to the inside of the anode electrode post of the flat package. At the same time, a second conductor is interposed between the cathode electrode post of the flat package and an auxiliary cathode electrode post provided inside the cathode electrode post, and the first conductor is connected to the diode pellet. A semiconductor device, characterized in that an insulator is inserted between the first conductor and the second conductor.
JP16588383U 1983-10-26 1983-10-26 semiconductor equipment Pending JPS6073254U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16588383U JPS6073254U (en) 1983-10-26 1983-10-26 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16588383U JPS6073254U (en) 1983-10-26 1983-10-26 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS6073254U true JPS6073254U (en) 1985-05-23

Family

ID=30363302

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16588383U Pending JPS6073254U (en) 1983-10-26 1983-10-26 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6073254U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55148460A (en) * 1979-05-08 1980-11-19 Toyo Electric Mfg Co Ltd Semiconcutor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55148460A (en) * 1979-05-08 1980-11-19 Toyo Electric Mfg Co Ltd Semiconcutor device

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