JPS6072751A - Thermal head - Google Patents

Thermal head

Info

Publication number
JPS6072751A
JPS6072751A JP58182148A JP18214883A JPS6072751A JP S6072751 A JPS6072751 A JP S6072751A JP 58182148 A JP58182148 A JP 58182148A JP 18214883 A JP18214883 A JP 18214883A JP S6072751 A JPS6072751 A JP S6072751A
Authority
JP
Japan
Prior art keywords
heat generating
layer
resistor
generating resistor
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58182148A
Other languages
Japanese (ja)
Inventor
Haruo Tanmachi
東夫 反町
Toshio Matsuzaki
松崎 壽夫
Kiyoshi Sato
清 佐藤
Takumi Suzuki
工 鈴木
Takeshi Sugii
岳史 椙井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58182148A priority Critical patent/JPS6072751A/en
Publication of JPS6072751A publication Critical patent/JPS6072751A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00Electric solid-state thin-film or thick-film devices, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electronic Switches (AREA)

Abstract

PURPOSE:To enable the adhesion of a heat generating resistor to a recording medium though preparing a thin film by providing a hump part on an insulation substrate to form a heat generating resistor made of a thin film thereon while an electrode conductor is made of a thick film. CONSTITUTION:A conductor layer 8 is formed on an insulation layer 7a partially protruding conically made of an insulating material with a low heat conductivity provided on an insulation substrate 1. Then, the conductor layer is etched to partially remove it on the insulation layer 7a humped conically and electrode patterns 81 and 82 are formed. If necessary, a thick film multi-layer circuit is formed on the electrode conductors 81 and 82. Then, a resistor is sputtered by several thousands A. The resistor layer thus obtained is etched to form a heat generating resistor 9a leaving it between electrodes 81... and 82... and then, a protective layer 10 is formed. Thus, the protruded part provided on the substrate ensures an accurate adhesion of the protective layer on the heat generating section to a recording medium thereby enabling a high-speed printing. This also permits the use of a thin film as heat generating resistor to reduce the cost by constructing the electrode conductor of copper in a thick film.

Description

【発明の詳細な説明】 〔発明の技術分野〕 プリンタには、レーザプリンタなどのように感光ドラム
に静電潜像を形成し、それを現像して印字媒体に転写す
る静電式ないし電子写真式のものと、印字媒体をインク
リボンの上からワイヤで選択的に加圧して印字するイン
パクト式のものと、サーマルヘッド−で熱転写リボンを
選択的に加熱しインクを溶融させて転写する熱転写式あ
るいはサーマルヘット′で感熱紙を選択的に加熱し発色
させる感熱プリンタとがある。本発明は、後者の熱転写
リボンを選択的に加熱して熱転写したり、感熱紙を選択
的に加熱して印字するサーマルへ71.′に関する。
[Detailed Description of the Invention] [Technical Field of the Invention] Printers include electrostatic or electrophotographic printers that form an electrostatic latent image on a photosensitive drum, develop it, and transfer it to a printing medium, such as a laser printer. There are two types: one is an impact type, which prints by selectively applying pressure to the printing medium with a wire from above the ink ribbon, and the other is a thermal transfer type, which selectively heats the thermal transfer ribbon with a thermal head to melt the ink and transfer it. Alternatively, there is a thermal printer that selectively heats thermal paper with a thermal head to develop color. The present invention is directed to thermal transfer by selectively heating a thermal transfer ribbon for thermal transfer, or thermal printing by selectively heating thermal paper. Regarding ′.

〔技術の背景〕[Technology background]

第1図はシリアルプリンタ用のサーマルヘットの正面図
、第2図は第1図のn−n断面図である。
FIG. 1 is a front view of a thermal head for a serial printer, and FIG. 2 is a sectional view taken along line nn in FIG.

1はアルミナを焼結して成る基板で、その上にTaN(
窒化タンタル)から成る抵抗体をスパツクし、発熱用抵
抗膜2を形成しである。そして該抵抗膜2の両側に、N
jCr、Au+Crを順次蒸着し、ホ1−リソグラフィ
技法によりバターニングを行なって個別電極31・・・
とコモン電極32を形成する。第3図は、このように基
板1」二で抵抗膜2の両側に個別電極31・・・とコモ
ン電極32を設りた状態の斜視図である。この図から明
らかなように、両側に個別電極31・・・とコモン電極
32を備えた抵抗膜2・・・が1列に配設されている。
1 is a substrate made of sintered alumina, on which TaN (
A heat generating resistive film 2 is formed by sprocketing a resistor made of tantalum nitride. Then, on both sides of the resistive film 2, N
jCr, Au+Cr are sequentially deposited, and patterning is performed using a photolithography technique to form individual electrodes 31...
and a common electrode 32 is formed. FIG. 3 is a perspective view of the substrate 1'' in which the individual electrodes 31... and the common electrode 32 are provided on both sides of the resistive film 2 in this manner. As is clear from this figure, the resistive films 2 each having individual electrodes 31 and a common electrode 32 on both sides are arranged in one row.

そして個別電極31・・・とコモン電極32との間に通
電して所望の抵抗膜2を発熱させることで、プラテン5
に巻回された感熱紙6を選択的に加熱し発色さ・口て記
録を行なう。
Then, by applying current between the individual electrodes 31... and the common electrode 32 to generate heat in the desired resistance film 2, the platen 5
The thermal paper 6 wound around the paper is selectively heated to produce color and record.

第1図や第3図のような複数の抵抗膜2・・・と個別電
極31・・・およびコモン電極32の上に、Taz05
 (酸化タンタル)などをスパッタして耐摩耗性に優れ
た保護層4を形成し、感熱紙あるいは熱転写リボンとの
摺動による摩耗を防止している。
Taz05 is placed on the plurality of resistive films 2..., individual electrodes 31... and common electrode 32 as shown in FIGS. 1 and 3.
A protective layer 4 having excellent abrasion resistance is formed by sputtering tantalum oxide (tantalum oxide) or the like to prevent abrasion caused by sliding with thermal paper or thermal transfer ribbon.

〔従来技術とその問題点〕[Prior art and its problems]

ところが第2図に示すように、発熱用抵抗体2ば薄膜で
形成されているのに対し電極導体31.32は厚膜で形
成されているので2、発熱用抵抗体2の発熱部の上方の
み保護層4が窪んでしまい、肝心な発熱部と記録媒体で
ある感熱紙6との密着が悪くなり、印字品質が低下する
However, as shown in FIG. 2, while the heat generating resistor 2 is formed of a thin film, the electrode conductors 31 and 32 are formed of thick films. However, the protective layer 4 is depressed, and the adhesion between the important heat-generating portion and the recording medium, ie, the thermal paper 6, deteriorates, resulting in a decrease in print quality.

発熱用抵抗体を厚膜で形成すれば、保護層4の窪みを防
止することもできるが、厚膜型の抵抗体は、安価な設備
で量産できまた多階配線も容易な反面、抵抗体の精度が
悪い。これに対し薄膜型の場合は、微細で高精度の発熱
用抵抗体を得ることができるか、真空装置などの高価な
設備を要し、また多層配線が困難である。従って電極導
体は安価な厚膜で形成し、発熱用抵抗体は精度の良い薄
膜で形成するのが有効であるが、そうすると前記のよう
に発熱部と記録媒体との密着性が低下する。
If the heat-generating resistor is made of a thick film, it is possible to prevent the protective layer 4 from denting, but thick-film resistors can be mass-produced with inexpensive equipment and can be easily wired in multiple levels. accuracy is poor. On the other hand, in the case of a thin film type, it is difficult to obtain a fine and highly accurate heating resistor, it requires expensive equipment such as a vacuum device, and multilayer wiring is difficult. Therefore, it is effective to form the electrode conductor with an inexpensive thick film and to form the heat generating resistor with a thin film with high precision, but if this is done, the adhesion between the heat generating part and the recording medium will deteriorate as described above.

薄膜の発熱用抵抗体2は通常厚さが1μm以下で、薄膜
部の幅りが150〜200μm程度であるのに対し、厚
膜の電極導体31.32の膜圧ば数十μm以」二である
。そのため発熱用抵抗体の」二側の窪みをなくすことは
極めて娃しい。
The thin film heating resistor 2 usually has a thickness of 1 μm or less, and the width of the thin film portion is about 150 to 200 μm, whereas the thickness of the thick film electrode conductor 31 and 32 is several tens of μm or more. It is. Therefore, it is extremely difficult to eliminate the recess on the two sides of the heating resistor.

更に従来の厚膜型のサーマルヘッドでは、金ペーストを
マスクの上から印刷したり、全面印刷してポトリソグラ
フィ手法で電極導体を形成しているが、主導体に金を使
用するため、コスト高となっている。金を他の安価な材
料に置き換えることも考えられるが、金に代って銀パラ
ジウムを使用すると、銀パラジウムは比抵抗が高いため
に大電流を流すことができない。厚膜の銅を使用するこ
とも難しい。即ち銅の焼付けは、酸化防止のために窒素
雰囲気中で行なわなければならないが、窒素雰囲気中で
焼イ]けできる高精度の厚膜抵抗体が存在しない。従っ
て発熱用抵抗体を薄膜で構成できれば、電極導体を安価
な銅で構成できるという効果もある。
Furthermore, in conventional thick-film thermal heads, electrode conductors are formed by printing gold paste over the mask or printing it all over the mask using potlithography, but since gold is used as the main conductor, the cost is high. It becomes. It is possible to replace gold with other inexpensive materials, but if silver-palladium is used instead of gold, silver-palladium has a high resistivity and cannot conduct a large current. It is also difficult to use thick film copper. That is, baking copper must be done in a nitrogen atmosphere to prevent oxidation, but there is no high-precision thick film resistor that can be baked in a nitrogen atmosphere. Therefore, if the heating resistor can be made of a thin film, there is also the advantage that the electrode conductor can be made of inexpensive copper.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、従来のサーマルヘッドにおけるこのよ
うな問題を解消し、発熱用抵抗体を精度の出し易い薄膜
で構成しても記録媒体との密着が可能になるようにする
ことにある。
SUMMARY OF THE INVENTION An object of the present invention is to eliminate such problems in conventional thermal heads, and to enable close contact with a recording medium even if the heat generating resistor is formed of a thin film that is easy to achieve accuracy.

〔発明の構成〕[Structure of the invention]

この目的を達成するために講した本発明による技術的手
段は、絶縁基板」二において、発熱用抵抗体と、該発熱
用抵抗体に通電するための電極導体と、発熱用抵抗体上
に設けた保護層とを有するサーマルヘッドにおいて、絶
縁基板に熱伝導率の低い絶縁材料からなる隆起部を設け
てその上側に薄膜の発熱用抵抗体を形成し、かつ電極導
体は厚膜で形成した構成を採っている。
The technical means according to the present invention taken to achieve this object is that an insulating substrate is provided with a heat generating resistor, an electrode conductor for supplying current to the heat generating resistor, and a heat generating resistor provided on the heat generating resistor. In a thermal head having a protective layer, an insulating substrate is provided with a raised part made of an insulating material with low thermal conductivity, a thin film heat generating resistor is formed on the upper side of the raised part, and the electrode conductor is formed of a thick film. are taken.

〔発明の実施例〕[Embodiments of the invention]

次に本発明によるサーマルヘットが実際上どの5− ように具体化されるかを実施例で説明する。第4図は本
発明によるサーマルヘッドの製造工程と構成を示す断面
図と平面図である。まず(イ)に示すように、例えばア
ルミナなどのような機械的強度と絶縁性に優れた材料か
ら成る基板1の上に、ガラスペースト7を帯状に塗布す
る。そして焼成すると、ガラスペースト7が溶融して流
れ、(ロ)のように山形に変形する。次に山形に隆起し
た絶縁層7aの上から銅ペース?・8を全面に塗布し窒
素雰囲気中で焼成し、導体層を形成する。次いで該導体
層をエツチングして、(ニ)のように山伏に隆起した絶
縁層7aの上側を除去すると共に、電極パターン81.
82を形成する。そして必要に応じてこの電極導体81
.82の上に厚膜多層回路を形成する。次に抵抗体とし
て、例えばTa−N−Al2O3を数1000人スパッ
タする。この抵抗体は、^1203 とTaを混合した
ターゲットを窒素の存在下でスパッタして得られる。そ
してこの抵抗体層をエツチングして、(へ)のように各
電極導体81・・・と82・・・間のみを残し、発熱用
抵抗体96一 aを形成した後、(1・)のように上にガラスを塗布し
て、窒素雰囲気中で焼成し、保護層10を形成する。こ
の焼成時に、電極導体81.82の端部が軟化するごと
で、電極導体81.82と隆起層7aとの間の段差がな
くなる。なの銅ペーストの酸化を防止するために、保護
N10は、窒素雰囲気などで焼成できる材料を用いる。
Next, examples will be used to explain how the thermal head according to the present invention is actually implemented. FIG. 4 is a sectional view and a plan view showing the manufacturing process and structure of the thermal head according to the present invention. First, as shown in (A), a glass paste 7 is applied in a band shape onto a substrate 1 made of a material with excellent mechanical strength and insulation properties, such as alumina. When fired, the glass paste 7 melts and flows, deforming into a mountain shape as shown in (b). Next is the copper paste on top of the mountain-shaped insulating layer 7a?・Coat No. 8 on the entire surface and bake in a nitrogen atmosphere to form a conductor layer. Next, the conductor layer is etched to remove the upper part of the insulating layer 7a which is ridged as shown in (d), and the electrode pattern 81.
Form 82. Then, if necessary, this electrode conductor 81
.. A thick film multilayer circuit is formed on top of 82. Next, as a resistor, for example, Ta-N-Al2O3 is sputtered several thousand times. This resistor is obtained by sputtering a target containing a mixture of ^1203 and Ta in the presence of nitrogen. Then, this resistor layer is etched, leaving only the space between each electrode conductor 81... and 82... as shown in (f), and after forming the heat generating resistor 961a, as shown in (1). Glass is applied thereon and fired in a nitrogen atmosphere to form the protective layer 10. During this firing, the ends of the electrode conductors 81.82 are softened, so that the level difference between the electrode conductors 81.82 and the raised layer 7a disappears. In order to prevent oxidation of the copper paste, a material that can be fired in a nitrogen atmosphere or the like is used for the protection N10.

なお隆起層7aとしては、記録媒体との密着性を増すう
えでは、厚い方がよいが、そうすると隆起層7aの熱伝
導率が低く、放熱性が悪くなる。
Note that it is better for the raised layer 7a to be thicker in order to increase the adhesion with the recording medium, but if this is done, the raised layer 7a has low thermal conductivity and poor heat dissipation.

そのため高速で印字するには、発熱用抵抗体や保護層が
高温となり、良好な印字が得られないばかりか、ザーマ
ルヘソドの劣化を早めてしまう。従って隆起層7aの厚
さは、50μm以下、できれば30〜40μm程度が望
ましい。
Therefore, when printing at high speed, the heating resistor and the protective layer become hot, which not only makes it impossible to obtain good printing, but also accelerates the deterioration of the thermal head. Therefore, the thickness of the raised layer 7a is preferably 50 μm or less, preferably about 30 to 40 μm.

〔発明の効果〕〔Effect of the invention〕

以」二のように本発明によれば、絶縁基板上に熱伝導率
の低い絶縁材料からなる隆起部を設けてその上側に薄膜
の発熱用抵抗体を形成し、印字ヘッドの記録媒体と当接
する部分が窪まないよ・うにしている。そのため発熱用
抵抗体の発熱部の上の保護層が確実に記録媒体と密着し
、効率的に記録媒体を加熱することができる。また隆起
部はガラスなどのような熱伝導率の低い材料でできてい
るので、発熱用抵抗体で発生した熱が他に逃げてしまい
、所定の温度まで」二昇しなくなるといったこともなく
、高速印字が可能となる。さらに発熱用抵抗体として薄
膜を使用できるので、電極導体を厚膜の銅で構成するこ
とが可能で、従来のように金を使用する必要がなく、材
料のコストダウンが可能となる。
As described above, according to the present invention, a raised part made of an insulating material with low thermal conductivity is provided on an insulating substrate, and a thin film heat generating resistor is formed on the upper side of the raised part, and the raised part is formed on the upper side of the raised part, and the raised part is formed on the raised part made of an insulating material with low thermal conductivity. I make sure that the parts that touch do not get depressed. Therefore, the protective layer on the heat generating part of the heat generating resistor comes into close contact with the recording medium, and the recording medium can be efficiently heated. In addition, since the raised part is made of a material with low thermal conductivity such as glass, the heat generated by the heating resistor will not escape to other places and will not reach the specified temperature. High-speed printing is possible. Furthermore, since a thin film can be used as the heating resistor, the electrode conductor can be made of a thick copper film, eliminating the need to use gold as in the past, and reducing the cost of materials.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はシリアルプリンタ用す−マルヘソ1の全容を示
す正面図、第2図は第1図のn−n断面図、第3図は電
極部の斜視図、第4図は本発明によるサーマルヘソIこ
の製造工程と完成状態を例示する断面図と平面図である
。 図において、1は基板、2は発熱用抵抗体、31ば個別
電極、32はコモン電極、4.10は保護層、6は記録
媒体、7aは隆起層、81.82は電極導体、9aは発
熱用抵抗体をそれぞれ示す。 特許出願人 富士通株式会社 代理人 弁理士 青 柳 稔 9− 第1図 第2図 第3図 第4図
Fig. 1 is a front view showing the entire structure of a thermal heel 1 for use in a serial printer, Fig. 2 is a sectional view taken along line nn in Fig. 1, Fig. 3 is a perspective view of the electrode section, and Fig. 4 is a thermal heel according to the present invention. FIG. 1 is a cross-sectional view and a plan view illustrating the manufacturing process and the completed state. In the figure, 1 is a substrate, 2 is a heating resistor, 31 is an individual electrode, 32 is a common electrode, 4.10 is a protective layer, 6 is a recording medium, 7a is a raised layer, 81.82 is an electrode conductor, and 9a is Each heat generating resistor is shown. Patent Applicant Fujitsu Limited Agent Patent Attorney Minoru Aoyagi 9- Figure 1 Figure 2 Figure 3 Figure 4

Claims (1)

【特許請求の範囲】[Claims] 絶縁基板上において、発熱用抵抗体と、該発熱用抵抗体
に通電するだめの電極導体と、発熱用抵抗体上に設&j
た保護層とを有するサーマルヘットにおいて、絶縁基板
に熱伝導率の低い絶縁+A料からなる隆起部を設けてそ
の上側に薄膜の発熱用抵抗体を形成し、かつ電極導体は
厚膜で形成したことを特徴とするサーマルヘット゛。
On an insulating substrate, a heat generating resistor, a temporary electrode conductor for energizing the heat generating resistor, and a heat generating resistor installed on the heat generating resistor.
In a thermal head having a protective layer, a raised part made of insulation + A material with low thermal conductivity is provided on an insulating substrate, a thin film heat generating resistor is formed on the upper side, and the electrode conductor is formed of a thick film. A thermal head characterized by:
JP58182148A 1983-09-29 1983-09-29 Thermal head Pending JPS6072751A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58182148A JPS6072751A (en) 1983-09-29 1983-09-29 Thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58182148A JPS6072751A (en) 1983-09-29 1983-09-29 Thermal head

Publications (1)

Publication Number Publication Date
JPS6072751A true JPS6072751A (en) 1985-04-24

Family

ID=16113195

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58182148A Pending JPS6072751A (en) 1983-09-29 1983-09-29 Thermal head

Country Status (1)

Country Link
JP (1) JPS6072751A (en)

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