JPS607034B2 - Plating method and device - Google Patents

Description

[Detailed description of the invention] The present invention relates to a novel plating method and apparatus.

Specifically, this is a new plating method that prevents the metal band from being worn out or the abrasion powder mixed into the plating solution when plating is applied to a metal band that is fed in a substantially horizontal direction. and its equipment. A conventional plating method and plating apparatus for plating a metal strip that is fed in a horizontal direction will be explained with reference to FIG.

A is a conductive metal band, which is fed horizontally in a predetermined direction indicated by an arrow. b is a plating tank containing plating solution c therein, and the metal strip a is conveyed across this plating tank b. d is a cathode disposed in the plating tank b, and has a flat lower surface e extending substantially horizontally. Preliminary metal band a
is fed into the plating tank b while contacting the lower surface of the cathode d, thereby converting the metal band a into a cathode. Reference numeral f denotes a non-fusible anode disposed within the plating tank b, and is disposed such that an appropriate gap h is formed between its upper surface g and the lower surface of the metal strip. However,
A plating solution c is supplied into the gap h between the electrodes by an appropriate means (not shown), and the lower surface of the metal strip a is plated. However, in such a secondary plating method and apparatus, since the metal band a is brought into contact with the lower surface of the cathode d, a considerably large resistance is generated between the metal band a and the cathode d, and the metal band a or the cathode d is worn out. The disadvantage is that they are subject to rapid wear and tear.

Also, the wear of the lower surface of the cathode d makes it difficult to maintain the correct interpolar gap h, necessitating its readjustment very often. Furthermore, the cathode d
Since the sliding contact between the metal band a and the metal band a is performed in the plating tank b, particles generated by the above-mentioned abrasion are likely to be mixed into the plating solution c, causing a problem that adversely affects the plating.
SUMMARY OF THE INVENTION The present invention has been made to overcome the above-mentioned drawbacks in the related methods and apparatuses. In a method of plating the surface of a conductive strip fed in a fixed direction within a plating tank, the conductive strip is brought into contact with a means for cathodizing it outside the plating tank. In addition to
The device is characterized in that the conductive strip traveling in the plating zone is shielded from dew due to leakage current, and the device includes a plating tank containing a plating solution;
a conductive strip that is fed in a substantially horizontal direction across the inside of the plating tank in a predetermined direction;
means for cathodizing the conductive strip outside the plating tank;
a non-fusible anode disposed in the plating tank and forming a suitable inter-electrode gap extending in a substantially horizontal direction with the conductive strip; and an anode for forcibly flowing the plating solution into the inter-electrode gap. and a shield made of an electrically insulating material between the means and the cathodized conductive strip in front of the supply port for supplying the plating solution and shielding the conductive strip from electrodeposition due to leakage current. It is characterized by comprising a block.

The details of the plating method and plating apparatus of the present invention will be explained below according to illustrated embodiments.

Although the illustrated plating apparatus will be described as being used for manufacturing copper foil, it goes without saying that the present invention is not limited thereto. This plating apparatus includes a plating tank or container 2 containing, for example, an acidic copper lacquer 1.

The plating tank 2 is made of steel and, since it is used for acidic solutions, is coated 3 on the inside with an acid-resistant synthetic material such as polyvinyl chloride. A strip 4 of a conductive material, for example stainless steel, is adapted to pass horizontally through the tank 2 by entering the tank 2 through an inlet 5 and exiting through an outlet 6;
Steel foil or a circuit pattern is sprayed onto the surface of this strip 4. Incidentally, the conductive strip 4 is formed from a suitable reel to a reel (none of the reels are shown).
) in the direction shown by the arrow in FIG. 7,
A cathode contact 7 is placed in front of the inlet 5 of the plating tank 2 so as to be in contact with both the upper and lower surfaces of the strip 4.

The cathode contact 7 consists of a rotating shaft 8 and conductive fin rolls 9, 9 made of a conductive material such as copper that are fixed near both ends of the rotating shaft 8, and the conductive rolls 9, 9 are connected to each other by suitable means. It is considered a cathode by Therefore, the conductive rolls 9, 9 and 9 of such cathode contacts 7, 7,
By contacting the side edges of the strip 4 from above and below, the strip 4 is cathodized. In the plating tank 2, unfishable anodes 10u, 1 are placed above and below with the strip 4 in between.
01 is placed.

Since the insoluble anodes 10u, 101 and related members are the same on the upper and lower sides, only the lower one will be explained, and the upper one will be given the same number as the lower one. Illustrated with the additional symbol “u”,
The explanation will be omitted. The non-portable anode 101 has a flat top surface 1
11, and this upper surface 111 and the lower surface of the strip-shaped body 4 are made parallel to each other with an appropriate distance therebetween, and an appropriate inter-electrode gap 121 is maintained here.

Such an amorphous anode 101 can be formed of lead, a tin-tin alloy, or titanium or copper whose surface is coated with platinum. A plating solution supply block 131 made of an electrically insulating material such as polyvinyl chloride serves as an insoluble anode.
The plating solution 1 is supplied to the inter-electrode gap 121 through the plating solution supply port.
Then, it passes through there in a turbulent state.

Here, one end of the insoluble anode 101 refers to the end on the near side in the feeding direction of the conductive strip 4, and will be used hereinafter with the same meaning. The plating solution supply block 131 is provided with a notch, and a groove 141 extending in the width direction of the crab-conducting strip 4 is formed between the notch and one end surface of the permanent anode 101.

Further, in the plating solution supply block 131, another groove 151 which extends in the width direction of the conductive strip 4 and whose width is narrower than that of the groove 141 is continuously provided below the groove 141. These two grooves 141 and 151 constitute the above-mentioned supply port through which the plating solution 1 is fed to the inter-electrode gap 121. The block 131 is further formed with a plating liquid passage 161 extending downward from the longitudinal center of the groove 151, and this passage 161G is also formed with a conduit 17.
1 to a delivery pipe 191 of a pump 181 provided outside the tank 2.

The pump 181 is connected to the inside of the tank 2 at a portion below the level of the plating solution 1 stored in the plating tank 2 via a suction pipe 20 (only one is provided at the bottom). ing. Thus, the plating solution 1 is constantly supplied to the plating solution supply block 131. The diffusion plate 211 is connected to the plating solution supply block 13 by appropriate means.
1, thereby dividing the first groove 141 and the second groove 151.

This diffusion plate 211 has numerous small holes formed and arranged for passing the plating solution. The sealing unit 221 is arranged between the conductive strip 4 and the anode 101. The sealing unit 221 has a substantially U-shape in plan view, and includes a pair of sealing units 231.
231, and a shielding block 241 installed between the upper ends (meaning the front side with respect to the feeding direction of the strip 4; the same applies hereinafter) of the sealing punches 231, 231. The sealing unit 221 is preferably integrally molded from an electrically insulating material that is slippery, abrasion resistant, and chemical resistant, such as "Teflon" (trademark for fluoropolymer). The upper surfaces 251, 251 of the pair of sealing villages 231, 231 of the sea IJ unit 221 have a convexly curved cross-sectional shape, so that they can be slid onto the lower surfaces of both sides of the conductive strip 4 and are watertight. be contacted.

The shielding block 241 of the sealing unit 221 has a precisely flat upper surface 261 which is always slightly below the top of the curved upper surface 251, 251 of the sealing punch 231, 231. . shield block 2
41 lower hand (meaning the advancing side with respect to the feeding direction of the strip 4).
same as below. ) side end surface 271 is a downward concave curved surface, as best shown in FIG. The width of the upper surface of the non-flammable anode 101 is made narrower than the other portions, and a pair of horizontally extending support racks 281, 281 are formed on both sides. As can be seen from FIG. 2, these support racks 281, 281 are arranged to be in the same plane as the U-shaped upper surface of the plating solution supply block 131. A push-up tube 291 made of an elastic material such as synthetic rubber is arranged on the pair of support racks 281, 281 of the anode 101 and on the U-shaped upper surface of the plating solution supply block 131.
This push-up tube 291 is bent into a U-shape as shown in FIG. 5, and a U-shaped sealing unit 221 is placed on top of this push-up tube 291. As can be clearly seen in Figure 4, the sealing unit 221
The pair of sealing villages 231, 231 are connected to the insoluble anode 10.
1 is arranged so as to be in sliding contact with both side surfaces 301, 301 of the narrowed top part.

The shielding block 241 of the sealing unit 221 is arranged so as to almost cover the upper part of the plating solution supply block 131. The push-up pipe 291 is connected to the compressor 321 via an air conduit 311.

Compressed air from the compressor 321 pushes up the pipe 291
When the sealing unit 221 is fed upward, the diameter of the push-up tube 291 becomes larger, and as a result, the sealing unit 221 is pushed up. A pair of square plates 331, 331 are the cap screws 3
41 to both sides of the anode 101 and the plating solution supply block 131, and thereby the push-up tube 2
91, 291 in a predetermined position and guides the vertical movement of the sealing unit 221. When the sealing unit 221 is pushed up by the push-up tube 291, the curved upper surfaces 251, 251 of the sealing villages 231, 231 come into contact with both sides of the lower surface of the conductive strip 4.

In this way, the pair of sealing punches 231, 231 limit and seal both sides of the inter-electrode gap 121 in the width direction, so that the plating solution passes through the inter-electrode gap 121 only along the longitudinal direction of the conductive strip 4. It will flow. The shielding block 241 of the sealing unit 221 is a cathodized strip 4
A portion that is disposed so as to partially lie below and partially cover the upper part of the impurity anode 101, thereby being continuous with the portion of the conductive strip 4 that has entered the inter-electrode gap 121. is shielded from the anode 101. Thus, the shielding block 241 prevents premature exposure of the conductive strip 4 due to leakage current. ．． Although the shielding block 241 must shield the conductive strip 4 from leakage current,
The upper surface 261 must not come into contact with the surface of the conductive strip 4 or the resist mask formed on the surface.

This is to prevent such contact from staining the surface of the conductive strip or damaging the resist mask. Satisfying these two contradictory requirements means that when the curved upper surfaces 251, 251 of the sealing villages 231, 231 are in proper sliding contact with the conductive strip 4, the upper surface 261 of the shielding block 241 and the conductive strip This is possible by maintaining a gap of 0.1 mm or less between the base plate and the lower surface of the base plate. As can be clearly seen in FIG. 2, the concavely curved lower end surface 271 of the shielding block 241 is arranged to face the upper green end 351 of the upper end surface of the insoluble anode 101. This edge 351 has a curved surface, and the plating liquid is supplied to the supply groove 141 between it and the curved lower end surface 271 of the shielding block 241.
A curved path 361 is formed to lead from the electrode gap 121 to the electrode gap 121. Insoluble anode 101 as described above
and various related materials having the same structure are also provided on the upper side with the conductive strip 4 in between (the upper one (the one with the additional symbol "u")).

) is the lower one whose only hierarchical relationship has been described so far (
Items with an additional code “1”. ) is the opposite. ),
These form a plating zone. Reference numeral 37 denotes a cover that covers the sides and lower side of the finishing zone in the plating tank 2, and the lower wall 38 has a hole 39 formed approximately in the center. It is slanted to the lowest point.

A method for continuously manufacturing copper foil or circuit patterns using the above-mentioned plating apparatus will be described.

In the above-mentioned embodiment, plating can be applied to both the upper and lower surfaces of the conductive strip 4 at the same time, but here, only the plating on the lower surface of the conductive strip 4 will be described, and the plating on the upper surface will be the same as the lower surface. Since they are almost the same, the explanation will be omitted.
First, the conductive strip 4 is fed at a constant speed in the direction indicated by the arrow (to the right in FIG.
Let it pass through the inside. Note that when manufacturing a printed circuit pattern, it is necessary to mask the surface of the conductive strip 4 with a resist agent in advance, but when manufacturing a metal foil, there is no need for such masking. Then, the conductive strip 4 is fed without being made into a cathode (cathode) by the cathode contacts 7, 7. When the pump 181 is activated, the plating solution is applied to the cathodized conductive strip 4.
and the insoluble anode 101 in a turbulent state.

The degree of turbulence of the plating solution flowing through this inter-electrode gap 121 needs to be uniform in the width direction of the conductive strip 4. The fact that the diffusion plate 211 is disposed between the first groove 141 and the second groove 151 of the plating solution supply block 131 contributes to this purpose. When the plating solution is supplied by a pump to the plating solution supply block 131, it first fills the groove 151, then passes through the diffusion plate 211 having numerous small holes and flows into another groove 141.

Then, the plating solution passes through the curved path 361 to the inter-electrode gap 12.
Flow into 1. The existence of this curved path 361 also helps to make the turbulent flow of the plating solution flowing through the inter-electrode gap 121 uniform in the width direction. And Sealing Unit 2
Since there are 21 sealing punches 231, 231, the plating solution flows only along the longitudinal direction of the conductive strip 4. Although the electrical arrangement in the present invention is not shown as it is of a rather conventional and well known type, the direct current density applied through the insoluble anode 101 is up to about 3 A/V.

Then, copper is deposited on the surface of the conductive strip 4. still,
The turbulent flow of the plating solution through the electrode gap 121 effectively prevents the formation of a polarized layer (a portion where the copper ion concentration is excessively reduced) in the vicinity of the conductive strip 4, and This accelerates the rate of copper deposition onto the conductive strip 4. Also, sealing unit 221
The shielding block 241 prevents copper deposition due to leakage current in the part of the conductive strip 4 before entering the regular plating zone, and prevents the electrodeposition of the conductive strip 4 only in the regular plating zone. ensure that this is done. Therefore, copper foil or circuit patterns with a thickness of 17 microns or less can be continuously formed on the surface of the conductive strip 4 without producing pinholes or other defects. As described above, in the present invention, the conductive strip conveyed in a substantially horizontal direction is brought into contact with the means for cathodizing it outside the plating tank, so that the conductive strip etc. This eliminates the inconvenience of abrasion particles being mixed into the plating solution, and a shielding block is placed between the conductive strip and the electrode in front of the plating solution supply port. , the conductive strip will not be prematurely struck by leakage current, and
Plating unevenness can be completely eliminated.

Further, as shown in the above-mentioned embodiments, it is possible to form inter-electrode gaps on both sides of the conductive strip in the plating tank, making it possible to obtain a highly efficient plating apparatus. It goes without saying that the present invention can be applied not only to copper deposition, but also to other metals such as nickel and cobalt, and alloys such as nickel-cobalt alloys.

6 and 7 show another embodiment of the plating apparatus according to the present invention.

The plating apparatus according to this embodiment is designed to plate only the bottom surface of the conductive strip 4, not both sides, and therefore the upper anode 10u and related members are removed. Instead, a holding block 40 made of a material with good sliding properties and good wear resistance is arranged. The presser block 40 is made of a material having good sliding properties and wear resistance, such as Teflon.

The presser block 40 has a flat lower surface 41 that extends in the horizontal direction. Several recesses 42 are formed on the lower surface of the presser block 40, and the recesses 42 are provided with several passages 4 vertically passing through the block 40.
3 and individually have been out of luck. These passages 43 are connected via conduits 44 to a vacuum pump 45 . Thus, while the conductive strip 4 is being fed, the vacuum pump 45
As a result, the inside of the recess 42 formed on the lower surface 41 of the holding block 40 is locally evacuated, and as a result, the conductive strip 4
is attracted to the presser block 40 side.

In this way, the conductive strip 4 comes into sliding contact with the horizontally extending flat lower surface 41 of the holding block 40, and the plating zone
The anode 101 will be run while maintaining the correct gap between the anode 101 and the anode 101 at the same time. In this example, regarding the insoluble anode 101 and its related parts,
Since it is the same as that in the previous embodiment, the same reference numerals are given and the explanation will be omitted.

[Brief Description of the Drawings] Fig. 1 is a schematic diagram showing an example of a conventional plating apparatus, Figs. 2 to 5 show an example of implementation of the plating apparatus according to the present invention, and Fig. 2 partially shows 3 is an enlarged sectional view taken along line mm in FIG. 2, FIG. 4 is an enlarged sectional view taken along line W-W in FIG. FIGS. 6 and 7 are enlarged perspective views showing the knitted fabric and the push-up tube disposed below it, and FIGS. 6 and 7 show another embodiment of the plating apparatus according to the present invention, and FIG. FIG. 7 is an enlarged sectional view taken along the skin line in FIG. 6. Explanation of symbols, 1...Plating solution, 2...
Plating tank, 4... Band-shaped body, 9...
Cathodeization means, 10... Impermeable anode, 12.
...Pole gap, 24...Shielding block. Fig. 1 Fig. 3 Fig. 4 Fig. 5 Fig. N Ant drawing bran Fig. 7

Claims (1)

[Scope of Claims] 1. Plating is applied in the plating tank to the surface of a conductive strip that is fed in a substantially horizontal direction and in a predetermined direction across the plating tank containing the plating liquid. In the method, the conductive strip is brought into contact with a means for cathodizing it outside the plating tank, and the conductive strip traveling inside the plating tank is shielded from electrodeposition due to leakage current. Features the Metsuki method. 2. A plating tank containing plating liquid, a conductive strip that is fed across the plating tank in a substantially horizontal direction and in a predetermined direction, and the conductive strip being used as a cathode outside the plating tank. an insoluble anode arranged in a plating tank and forming a suitable inter-electrode gap extending in a substantially horizontal direction between the conductive strips; and a means for forcibly flowing a plating liquid into the inter-electrode gap. and means for
In front of the supply port for supplying the plating solution, a shielding block made of an electrically insulating material is provided between the cathodic conductive strip and the conductive strip to shield the conductive strip from electrodeposition caused by leakage current. A matsuki device characterized by comprising: