JPS6068935A - Adhesive coated insulating board - Google Patents
Adhesive coated insulating boardInfo
- Publication number
- JPS6068935A JPS6068935A JP17765283A JP17765283A JPS6068935A JP S6068935 A JPS6068935 A JP S6068935A JP 17765283 A JP17765283 A JP 17765283A JP 17765283 A JP17765283 A JP 17765283A JP S6068935 A JPS6068935 A JP S6068935A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- epoxy
- product name
- ethylene
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明に、無電順−めっきにより金PAm体回路勿形成
する印刷配線板の製造に使用ざrしゐ接加剤伎嶺杷縁叡
に関丁ゐものであゐ0熊1h解めっさにより専体回路忙
形成する、いわゆゐアディティブ法印刷配線板に、接后
酌被恨絶縁板→スルーホール穴めけ→(ロ)路となる部
分以外VC無電解めっきレジスト形成→無電酔めっさに
よゐ回路形by%によゐ方法%或は接后酌仮抜絶は基数
→スルーホール穴あけ→全曲無電I簀めっき→全@電気
めっき一+回路とな/)部分にエツチングレジスト形成
、→エツチング、Vcよる方法により製造さ扛てい6゜
このアディティブ印刷配掴板VC於ては・杷轍基似表囲
に形成した恢7u剤層の回路パターン都Vc無1K #
めっさt析出させて形成しfc金金属鉢体回路強固に接
層していりこと。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to adhesives used in the manufacture of printed wiring boards in which gold PAM circuits are formed by electroless plating. On the so-called additive printed wiring board, in which a dedicated circuit is formed by 1 hour of unraveling, the following insulation board → through-hole drilling → (b) VC electroless plating except for the parts that will become the path. Resist formation → Electroless electroplating method depending on the circuit type by % or the temporary removal after consideration is the base number → Through hole drilling → All electroless I box plating → All @electroplating + circuit. 6゜This additive printing distribution board VC is manufactured by forming an etching resist on the part, → etching, VC. No 1K #
The metal is deposited to form a solid layer of FC gold metal pot body circuit.
および電子部品忙裕載丁ゐためのI¥11’ll+’a
はん1ど1′μ莱に耐えるすぐ、fした耐熱性を竹子ゐ
ことか藷本的な要件で′Aりゐ。And I ¥11'll+'a for electronic parts busy loading.
The basic requirement for bamboo shoots is that they can withstand 1000 µm of heat and have excellent heat resistance.
絶縁基叡表面の接層剤層は、無電解めっきに先立って化
学的エツチングによジ表面粗化さ匙るが、従来のアディ
ティブ法印刷配線叡に使用されていゐ接虐偵りはエツチ
ングVCよ/)表囲租化が容易でめゐこと、および析出
金属との依宥性に丁ぐ扛ゐことから、一般にアクリロニ
トリル・ブタジェンゴムで骨格と丁ゐ合成ゴム糸接盾創
が使用逓扛ていゐ〇
ところかこの甘酸ゴム糸接庸剤は硬さなどの架橋密度の
問題や基本骨格が弱いため耐熱狂刀1工性が必ずしも十
分でにな(、近年1丁11)冒謬腿化している電子僚器
VC通用丁ゐ印刷配線板としてに、エツチドフォイル法
でl’j )fAした印Aト1]配線似より伯租性に久
ける入点がめった。The surface of the adhesive layer on the surface of the insulating substrate is roughened by chemical etching prior to electroless plating. Generally, acrylonitrile-butadiene rubber is used to form the skeleton and synthetic rubber threads are used because it is easy to form a surface area and has good compatibility with the precipitated metal. However, this sweet acid rubber thread adhesive has problems with crosslinking density such as hardness, and has a weak basic skeleton, so it is not necessarily sufficiently resistant to heat treatment (in recent years, it has become blasphemous). As a printed wiring board for electronic equipment VC commonly used, I found that the etched foil method was used to produce a mark A to 1] that was more expensive than the wiring pattern.
′Tなわら、硬さ不足による傷などやはんだ面J熱性が
低いことおよびはんたづけにより印刷10勝板に搭載し
′fc電子部品が、しはしは回路上の小兵@から部品父
挨さ7″L、ゐことがめり、かかゐ場会には一般に50
0℃以上、時には400ないし420°Cもの高瀞はん
だゴテを用いた手けんだイ6正作菜が行わnゐがげん/
ピつ幻一部品恰載都の接宥剤が熱軟化あるいに熱劣化し
てランドパターンが横動してしまうため、部品父侠作栗
は極めて困難であった。However, due to the lack of hardness, scratches, low heat resistance of the solder surface, and soldering, the electronic components can be mounted on printed boards, but the parts are easily removed from the small soldiers on the circuit. Dust 7″L, Ikotomeri, Kakaiba meeting generally 50
Hand soldering using a Takatoro soldering iron at temperatures above 0°C, sometimes 400 to 420°C, is carried out by hand.
It was extremely difficult to prepare the parts because the land pattern would move laterally due to heat softening or thermal deterioration of the soothing agent used in the parts.
徒た、 印刷自己勝機の接オノ1g1i、j引1午a′
不Ill〆′すゐt戊験法としてほんた処理したのちM
I L刈、伯に記載さnた熱価軍試鋏(M I L
107 L)、−65℃ 50 多す← 125℃ 5
0 分 ) K11 つZjJM 会、 ae勝値スル
ーポールのコーナー耐SKI、ぼしはクラック久撰τ生
ずゐことかあり1吾別]牲τ1よ十δセゐ原因の一つと
なっていlこ。でこ−C,ンエノール伺14m エポキ
シ伝fB’Mτ〕Y1拍丁なCとVt J、り耐熱性τ
同上さぜる千成が竹なわノーシ瓦が1討熱注の同上とと
もに逆にビール価芒か低1・した。I wasted my chance to win by printing.
After processing it as an experimental method, M
The heat value military test scissors described in I L Kari and Haku (M I L
107 L), -65℃ 50 more ← 125℃ 5
0 minutes) K11 ZjJM meeting, corner resistance SKI of ae winning value through pole, I have not had a crack τ for a long time, and this is one of the reasons why the sacrifice τ1 is ten δ. . Deco-C, Nenol 14m Epoxy transmission fB'Mτ] Y1 timeless C and Vt J, heat resistance τ
On the contrary, the beer price dropped by 1 point, as Sennari Doji Sazeru and Takenawa Noshi Kawara commented on the same day.
不発明はこのような点に舵r ”’−Cな訟ノしたもの
で、把は基数の我ti11.アクリロニドIJルブタジ
エンコ′ム、ンエノールイシJ1拍、コーポキシク均I
JiT、エナレンムμn更ビニル共厘台捧よυノμゐ淋
映化牡倭漬剤層で形J戎した接腐痢機緩杷蘇軟て必ゐ〇
テなわち不発明は、アクリロニトリルブタジェンゴムと
フェノール側屈との架橋性を上けさbVtエポキシ側脂
側周いりことによって耐熱性を同上嘔せゐとともにエチ
レン酢叡共重曾樹脂τ刀0えることにより耐m1生巌沼
ジ虫さに丁ぐfL−た接層ハ1」被栓P3縁板でろる0
本発明の接后剤側脂で使用さnゐアクリロニトリルブタ
ジェンゴム(以下N B Rと1晒丁)はニトリル金型
60%以下のものが使用でさ、望1しくに、ニトリル金
型50〜25%のものかよい。NBR′Iitは25〜
80垂童部で使用できるが、NBRは熱に弱いため好捷
しぐに1101熟性同上のlIJ+から50〜50沖重
都がよい0フエノール側脂にフルキルンエノール樹脂ノ
ボラックフェノール(幻脂などいろいろあめがアルキル
フェノール側jjnがのそましい0
フェノール側屈は、レゾールンエノールうυ4Br4s
ノボラフクフェノール佃脂告独々のものが使用で′nゐ
が、アルキルフェノール4M3 jiffが望ましい。Non-invention is based on these points, and the basic number is ti11.
JiT, enalem μn, and present a vinyl colloid table. The cross-linkability between the rubber and the phenol sidewall is improved, and the heat resistance is increased by adding Vt epoxy around the sidewalls, and the ethylene-acetic acid copolymer resin is used to improve resistance to m1 raw Iwanuma insects. The acrylonitrile butadiene rubber (hereinafter referred to as NBR and 1) used in the adhesive of the present invention is made of nitrile mold. 60% or less is used, preferably 50 to 25% nitrile mold. NBR'Iit is 25~
Although it can be used in 80 degrees, NBR is sensitive to heat, so it is better to use 1101 ripeness. The candy is alkylphenol side jjn is slow 0 Phenol side bending is resolen enol υ4Br4s
Novolafukuphenol's proprietary product is used, but alkylphenol 4M3 jiff is preferred.
アルキルフェノール樹脂としては、フヱノール樹脂の置
換基の種類、官能基の柱知および分子菫分布について谷
独のアルキルフェノールが使わnるがバラエテルン工ノ
ール、)(ラターシャリーブテルフエノール、バラセカ
ンクリーン゛チルフェノール、パラターシャリ−アミル
フェノールバラノルマルブチル2−r、ノール、)心う
フェニルフェノール、オルンンエニルンエノール。Regarding the alkylphenol resin, the alkylphenol produced by Tanidoku is used in terms of the type of substituent group, the columnar knowledge of the functional group, and the molecular distribution of the phenol resin. , paratertiary amylphenol, paranormal butyl 2-r, nor,) phenylphenol, orenylphenol.
バラオクチルフェノール、バラベンジルンエノール々と
が1更用でき/)0待にN BRと架稿丁ゐ熱及工6型
が脇ましく、収応註が十分〆、1°1(1分子鎖分布が
狭く、フリーフェノールJ[rのほとんと7jI/′1
側朋が艮い0励として1110〜55)Jf、Jj1部
使用でき心か、粗化1生回上の凹〃・ら15〜45M石
部が好丑しい0筐たノボジッタ型フェノール朔力旨とし
て6カシ5忽1り1:沈どか1史用できる。Paraoctylphenol, parabenzylene enol, etc. can be used once/) 0, NBR and manuscript heat applied type 6 are sideways, and the convergence is sufficient, 1°1 (one molecular chain The distribution is narrow, with most of the free phenol J[r being 7jI/'1
1110-55) Jf, Jj 1 part can be used as 0 excitation when the side friend is 0. 6 Kashi 5 Kun 1 Ri 1: Shindoka 1 history can be used.
エポキシ1剪l財としては、ビスフェノール型・月ぼ環
式などかめゐか、11σ1戸〜性またに租化肚の魚の・
ら鉄性エポキシ梅脂またはノボラノタ型エホキシ側脂が
好ましい0俊性エポキシ四〇1i百としてはエポキシ化
1.4ポリブタジエン、木端蹟や111i1 MLがC
00HIたにNl(、などの欧状ポリブタジェンとエポ
キシ(fi11JiTτプリリアクションシタものなど
がある0好址しくは、高架慟性で司沈性の付与さ2’し
たものが望ましい。そのit4”L、 ”J読性の変性
エポキシ側脂τ用い7)〃・そうでない力・で笈化すゐ
が2〜45重盆姉で使用でき、好丑しくに、粗化仕回土
τ目的VC5〜24M奮部がよい。N B R:熱峻化
性優I朋飲5分(ンエノールイ心(哨十エポキシ値脂(
せ硬化酌))は60ニア0〜65:65で使用でさOo
この範囲τ藤えN B Rが多すぎゐと耐熱性の老しい
低トーが住しまた少な丁さ゛ゐと粗化性I/、I者しい
低−Fが生じる〇好1しくに、耐熱性τ(口」上達ぜゐ
ため、より架4ρi取分τ堀拓丁ゐ方向がよ(N B
i<取分とギー硬化性成分に50:50〜65:35か
留−4しく7ルキル2エノールイ豆(]」rI=エポキ
シ但111t’Tおよびa化角り比7>i80 二 2
0〜5 〇 二 50 L:/)i+ia 囲vt 、
e:rゐことが好ましい0工チレン師敵ビニル共皿台体
は計敞ビニル含詠20〜40虚坦%りものが覚剤できる
エチレン酢版ビニル共逮台14−怠aO15〜15 n
L’lD、’&1j7J” j イ□ f K 1〜1
0 MmfrLi;’/’好゛ましいO?Φ品父法釦熱
性、り(めけガ(j土性11ζは嵌右沖i表回の粗間化
か十分性なわJしないとさKげ、無体化−oi物光債A
IJτ〃nλゐことが−Cさゐ0こ′nによりIIIツ
熟・註および冗あVづ1拘の殴ち、およびMかの容易な
エツテングVCよV衣■槓の者しい積大とアンカー効未
も大きくなめ。1Ioj饅性および緻V(靜ptt性τ
↑」丁0尾(伝化名゛吻九倶畑としては、灰眠カルンク
ム、炭臥マク坏ンソム、クイ取アルミニウム、り11駁
ジルコニウム、ta’t、化亜鎗、酸化チタン、ば化マ
ク洋シシム、【収化妖、鹸化ケ(系、71< rX化ア
ルiニワム、アルミニウムシリフート、腫腋バリウム、
峨化アンチ七ンなどτ1−P独lたげ2棟以上τ′反用
゛j−心ことが出向(、平均3’xt、 i4; (J
、01〜20 +cunのものか、渡用てさ好’f L
((fl +〜0. I 〜5 ttm (trもの
で15〜65厘旬%の郵1で刀1(えることかカーまし
い0以上の依后ハリ倒B’GC的ケ1.I、Ll収払と
成子りtC使JI式オ′Lゐ七イ々浴媒として?M l
・ルエ/、ノテルエナルクトン、アセトン、メチル17
プテルクトン、キシレン、エタノール、メタノール、ジ
エテレ/グリコールモノメチルエーテルチレンクリコー
ルモノエチルエーテ乞ジエナレングリコールモノエナル
エーテルアセタート、酢酸エナル.告の1袖以上か使用
でさゐ0紙、カラス布告のき材に2工ノール側片凱エポ
キシ初脂等の熱硬化性側周を含浸加熱加圧した&層似寺
の杷轍丞仮に,前述の接庸炸」τ、没潰、ローラ塗9、
にけ塗9、吹付は告により塗布子ゐ0又は、接沼剤を台
城側血フ4/レム、蛍属箔寺の離型フィルムに塗布しf
c恢杷祿蹟仮に転写丁ゐ寺手段により形成して接虐i+
j被覆絶縁板と丁ゐ0接履酌は峡化汝のノ皐みか10〜
80μmとなるようVC形取丁ゐこと〃(好祉しい。Examples of epoxy products include bisphenol type, moonbocyclic type, etc.
Iron-based epoxy ume fat or noboranota type epoxy side fat is preferable. As the 0-stability epoxy 401i, epoxidized 1.4 polybutadiene, kibata-yaki and 111i1 ML is C.
It is preferable to use a polybutadiene and epoxy (fi11JiTτ pre-reaction type) such as 00HI, Nl (, etc.). ``Using modified epoxy side fat τ with J readability 7)〃・Other power・Can be used for 2-45 Jubon sisters, and conveniently, roughening soil τ purpose VC5-24M Strive The part is good. NBR: 5 minutes of heat softening
The hardening cup)) can be used from 60 near 0 to 65:65.
If this range τF NBR is too large, a low heat-resistant temperature will occur, and if it is too low, a roughening I/I will occur, and a low-F will occur.Preferably, a heat-resistant In order to improve the sex τ (mouth), it is better to take the 4ρi share τhori takuchoi direction (N B
i < 50:50 to 65:35 to the fraction and ghee hardening ingredients, 4 to 7 ruquils, 2 enol beans (]' rI = epoxy, but 111 t'T and a conversion ratio 7 > i80 2 2
0~5 〇2 50 L:/)i+ia VT,
Preferably, the base is made of ethylene and vinegar with a vinyl content of 20-40%.
L'lD,'&1j7J" j □ f K 1~1
0 MmfrLi;'/'Preferable O? Φ article father law button heat characteristic, ri (mekega (j earth nature 11
Ijτ Nλ こ こ ゐ ゐ ゐ ゐ ゐ ゐ 0 0 0 づ づ づ づ づ づ づ づ づ づ づ づ づ づ づ づ づ づ づ づ づ づ づ づ づ づ づ づ 槓 づ 槓 槓 槓 槓 槓 槓 よ よ ■ ■ ■ 槓 ■ 槓 ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ 槓 ■ ■ ■ ■ 槓 ■ ■ 槓 ■ ■ ■ ■ ■ 槓The anchor effect is also large. 1Ioj glutinousness and dense V (quietness τ
↑'' Ding0bi (The traditional names are Haim Karungkum, Tanbo Makunsom, Kui Tori Aluminum, Ri11Rin Zirconium, ta't, Kaya Yari, Titanium Oxide, Ba Ka Makyo) Shishim, [synthesis, saponification (system, 71 < rX aluminum, aluminum silicone foot, axillary barium,
τ1-P exclusive use of two or more τ' anti-sevens, etc.
, 01~20 +cun's, Watayotesako'f L
((fl +〜0. Ll collection and Naruko RitC envoy JI style O'L 7 I as a bath medium? M l
・Rue/, noterenalctone, acetone, methyl 17
Pterctone, xylene, ethanol, methanol, dietele/glycol monomethyl ether tyrene glycol monoethyl ether, dienalene glycol monoenal ether acetate, enal acetate. If one or more of the sleeves of the notice were used, the wood of the Karasu notice was impregnated with thermosetting epoxy resin, etc. on the 2-Konol side and heated and pressed. ,The aforementioned contact explosion' τ, collapse, roller coating 9,
9. Spraying is done by applying coating agent 20 or wet agent to the mold release film of Taijo side Blood 4/Rem and Hotaru Hakudera.
c. Formed by means of transcription and masturbation i+
The insulation plate and the insulation board are the same as yours.
The VC shape should be set to 80μm (this is good practice).
不発明の接7M剤仮板杷瞭似は,熱硬化,1ヒ学的に粗
面化の工程τ経て、硬化した租囲接ンMi剤層を侍,無
電解めっきにより金趙寺坏口路定形成して印刷配線板て
製造丁ゐ0無電解めつきτ析出さ+!:るために接加剤
塗膜にめつさ核’alT与さ一+!:ゐ必安がめゐが、
めっき核として賃金属化@物、例えは塩化パラジウムで
塩1ソ浴漱として吸泗させる方法あるいは,予め依2i
剤中に均一に分散さ+!:ゐ方εが用いら肚ゐ0金属専
体回路の形成は、無電解めっきり今によりイ■つてもよ
く、無′亀解めつきと電気めつきτ併用してもよいO
実施例1
1り+)ロニトリルブタジエンコ゛ムNipo1100
1(日本ゼオ70由製曲品名アクリロニトリル含蛍41
%)52重句都、アルキルフェノール
社製曲品名) 2 1 itst都、ノホラツク型エフ
jミキシ槌110DEN458(ダウ・ケミプノル表曲
猷1名)21■昂部.エチレン酢緻ビニル共亜@側)j
盲エバフレックス40(三片ポリグミカル)5ip。The uninvented adhesive 7M agent temporary board is made by heat curing and chemically roughening process τ, and then the hardened adhesive layer is applied to the metal layer by electroless plating. Manufacture printed wiring boards by forming traces and electroless plating τ deposition+! :Metsusa nuclear 'alT is applied to the adhesive coating film! :It's a must-have game, but
As a plating nucleus, a material such as palladium chloride can be used as a soaking solution, or
Uniformly dispersed in the agent! :The formation of a metal-dedicated circuit when ε is used may be done by electroless plating, and electroless plating and electroplating τ may be used in combination.Example 1 1 +) Ronitrile Butadiene Column Nipo1100
1 (produced by Nippon Zeo 70) Product name: Acrylonitrile-containing 41
%) 52 double poems, product name made by Alkylphenol Co., Ltd.) 2 1 itst capital, Nohorak type FJ Mixi Hammer 110DEN458 (Dow Chemipunol table song 1 person) 21 ■ Kobe. Ethylene vinegar densified vinyl Kyoa @ side)
Blind Evaflex 40 (Three Pieces Polygmical) 5ip.
エポキシ硬化剤B Fs Ct H5N Ht (僑本
化)或■製う1重言部.めっき触TN:(日立化成工条
1i式+J表ー6f+名PEC−8)5菫hχ−紳忙二
ーダー忙使用してセロンルブアセテートに帛月年分i父
δぜて1占1ル分ω述isoffi墓%の接危創を作成
したOこの接瘤」(」を紙エポキシ積層載(日立化敢工
莱(掬−A商品名LE−144N)K、乾深俊の膜厚が
25 ttm(/Cなるよりに塗布朝練し、170℃で
60分間力0熱級化き+!:た。この接沼剤何栢層似V
CN Cハンチングマシンτ使用して部品搭載用、スル
ホール接続用の穴必り力j」工〒行なった佼無電力手め
っさKL/b印刷配約仮作成の當法に便ってめっきパタ
ーン部となる以外の部分にレジスト忙印刷し、次いで酸
化性クロム混酸浴数によりパターン部の接九11す面釦
化宇エツチング狙化、71(抗。Epoxy curing agent B Fs Ct H5N Ht (made in China) or one layer. Plating touch TN: (Hitachi Chemical Co., Ltd. 1i type + J table - 6f + name PEC-8) 5 Sumire hchi - 2nd grade using Ceronlube acetate for 1 year, 5 months and 1 hour for 1 hour ω mentioned isoffi % of the injury created by this aneurysm” (”) paper epoxy laminated (Hitachi Kagen Korai (Kiku-A product name LE-144N) K, Inui Fukatoshi's film thickness is 25 ttm (/C Naruyori applied in the morning and heated to 170℃ for 60 minutes to achieve a zero heat rating.
The plating pattern was created using a CN C hunting machine τ for drilling holes for mounting parts and connecting through holes. 71 (resistance).The resist is printed on the area other than the area where the pattern area will be.Then, by using a chromium oxide mixed acid bath, the pattern area is targeted for etching.
中41、水洗工程τ行い無電解鋼めっき1合に(ン偵し
て凡そ65μm厚さの専14:回t6τ形底δゼて、印
刷配勝嶺τ作成した。この印刷配線数のzr寸注を表1
に示す。During the middle 41st period, a water washing process τ was carried out on the electroless steel plating (with a thickness of approximately 65 μm), and a printed distribution ridge τ was created by forming a t6τ shape bottom δ. Notes in Table 1
Shown below.
実施例2
7り’)ロブタジエンコ゛ム(日本ゼオンは看装置伯品
名N1po+ 1052 ) 50 厘=s、アルキル
フェノール側)」d(日豆化底工莱tlfJ製1司品名
ヒクノール2aoo)1s4ii律i工ボキン汲注位J
脂(出M:、 Zi rlII化学−裂開品名Po1y
bd M−45EPI)13点首部、エチレン酢液ビ
ニル共庸台・1fj(+I* x ハフレックス40(
三片ポリケミ刀ル)8亜lt iB * エポキシ側B
目吠化創(H本化某t4W製商品名カヤハードCLへ)
54J(抜部、光J+i4 glJ(白水化学■製四
品名ミクロパックス20A)10止童郡、めつぎん)媒
(日立化J戎工來(株裂開品名PEC−8)5京ルBl
lからなゐmlノ仄吻τ芙施・レリ1で述べた方法と回
付にして・づ表7d合りの作り兄、十妥旭R」付活ノ曽
叡の2(あけ刀(1ニー・よび刈し′屯月トめっきτ行
って印刷配線板τ1′[・成し1ζ0狗らnた配性(似
り瞥牡tφモ1に示す。Example 2 7) Robutadiene Column (Nippon Zeon Product Name N1po+ 1052) 50 rin=s, alkylphenol side) d (Product Name Hikunor 2aoo manufactured by Nippon Kasoko Korai TLFJ) 1s4ii Ritsui Engineering Bokin pumping position J
Fat (output M:, Zi rlII chemistry - cleavage product name Po1y
bd M-45EPI) 13-point neck, ethylene vinegar solution vinyl base, 1fj (+I* x Haflex 40 (
Three-piece polychemical knife) 8 nitride iB * Epoxy side B
Mebo Kaso (product name Kaya Hard CL made by H Honka t4W)
54J (Nukibe, Hikari J+i4 glJ (manufactured by Hakusui Chemical ■4 product name Micropax 20A) 10 Todo-gun, Metsugin) Media (Hitachi Chemical J Ebisu Korai (stock split product name PEC-8) 5 Kl Bl
According to the method and circulation described in 1 from 1 to 10 ml, the method described in 1. The printed wiring board τ1'[・formation 1ζ0 狗n pattern (similar view is shown in Figure 1).
実施例6
7り1)ロニトリルフク/エンコム(日本セオン鵠う襞
間品名N1pol 1052 ) 55爪気鄭、アルキ
ルフェノール樹脂(スケイ・フタティケミカル社製商品
名S P 126 ) 17 H7,、=’itb、エ
ホキシ笈注側+In(山元石油化学θ゛抑袈間品名Po
1ybdR45E P ”r) 17 jbJtH15
,−1−11z7LD’[ビュル共血’a 樹)j’F
Jエバフレックス25〇三升ボリクミカル■i製8部、
エホキシ竣化酌および硬化助バ+J1−1−1(す」4
11化成■袈)8里気都、N−ベンジルジメチルアミン
(BDMA)(和光純系(((7)製)2A【気都、兄
項卸」(白水化9二けで0製商品名ミクロパックス20
A)12皿班都5(it4麻■製藺品名クリりタライト
VX−X)4重鎖%。Example 6 7ri 1) Ronitrile Fuku/Encom (Nihon Seon Co., Ltd. product name N1pol 1052) 55 Zumekicheng, alkylphenol resin (Product name SP 126 manufactured by SKY Futati Chemical Co., Ltd.) 17 H7,,='itb, Ehoxy wicker side + In (Yamamoto Petrochemical θ゛pressure side product name Po
1ybdR45E P ”r) 17 jbJtH15
, -1-11z7LD'[Burukyoblood'atree)j'F
J Evaflex 2503 sho Borikmical ■8 parts made by i,
Ephoxy completion cup and curing aid + J1-1-1 (su'4)
11 Kasei ■ 興) 8 Rikito, N-benzyldimethylamine (BDMA) (Wako Pure Series ((7)) 2A [Keto, Anishang Wholesale" (Hakusui Ka92ke 0 product name Micropax) 20
A) 12 plate Banto 5 (IT4 hemp product name Kuritalite VX-X) 4 heavy chain%.
めっさ触媒、(日立化成工第(株裏曲品名PEC−8)
5京凋都からl双/)組J5y、物τ突施例1で赴べた
方法と同号求にして印刷配線板τ作成した。 イarら
扛た時性を表I K示す0
夾#1例4
アクリロニトリル7′タシエンコ゛ム(日本セオンle
am m品名N1pol DN401 ) 64m’、
hi8Lアルキルフェノール側8W (日立化成工來鼎
]埃間品名ヒタノール2400 ) 22.Nfff1
mエポキシ俊g、樹脂(油化シェルti’tl製エポキ
シ樹11ぼエビコ−)1055と宇郡舛座鞠裟カルボキ
シル基せ有アクリロニトリルブタジェン共血台俸kiy
carCTBN1500X1+τ−= itr比5対1
の古り舎で180℃6時間反応したもの)20厘食郡、
エチレン目1−酸ヒニル共電台坏エバフレックス250
(三片ポリケミカル(](1→製)6爪5=’+飾、エ
ポキシ峡化用4!+1111i(スケイ・タノディケミ
刀ル社製藺品名5P6600) 15重箱部、めつさ触
媒、(日立化l戊工莱(偽→製間11f1名PEC−8
ン5亘シff311 ’ir”らな々組成!j/lJτ
天ノン+# 1.で11、ベノ(カ淋と回付・にして即
用」配線板τ作成しグこc) ’ljらツムた’lay
ij:tτ表 I VCンJく丁〇
比Itす21り・リ
アクリロニトリルン′タシエンコ゛ム(日本セオン14
’:J製N b6名1xiipol 1052)39
nti8飾、アルキルフェノールイMIJti’r (
スクーイ、ノクフーイグεノノル社dis品名Sl)+
26 ) 25.111jイr’il’L ヒスフェ
ノール型エホキシ幀1iti (r′u↓化/エル!f
’l’122曲品名エピコー)1001)151ノL=
’i、1)、 工小キシ硬化用憐JIItY(スケ不り
タデイケミカル社袈間品名5P6600)81重都、光
横創(白水化学(1(J製部品名ミクロパックス2UA
]20屯石すiβ、めっき触媒(日立北j戊1未(會4
穆I Kf+品名PEに−5)6重暑fl′15刀・ら
/!、ゐ組り載抽グτダ(〃也ψす1で述べ1こ方法と
1614矩にして印AIIIJ自じω敏τ1下J戊した
0僧ら7Lた特性?表−1Vc示す0上記夾抛1タリ、
比較例の]妥治創面の映さおよび印刷配線板の王として
、はんだ耐熱性5回路接始性VCついて性能試験γ行っ
た結果を衣−1LL示す。Messa catalyst, (Hitachi Chemical Co., Ltd. Uramoku product name PEC-8)
From Kyoto to Kyoto, Class J5y created a printed wiring board using the same method as in Example 1. Table 1 shows the timeliness of ear et al.
am mProduct name N1pol DN401) 64m',
hi8L alkylphenol side 8W (Hitachi Chemical Industry) Dust product name Hitanol 2400) 22. Nfff1
M epoxy resin, resin (epoxy resin made by Yuka Shell Ti'tl) 1055 and Ugun Masuza Mari carboxyl-based acrylonitrile butadiene combination.
carCTBN1500X1+τ-= itr ratio 5:1
(Reacted at 180℃ for 6 hours in an old building) 20 liters,
Ethylene 1-hinyl ester Kyodendai Kyo Evaflex 250
(Three-piece polychemical (manufactured by 1→) 6 claws 5='+ decoration, 4!+1111i (manufactured by SKY Tanodi Chemical Co., Ltd., product name 5P6600), 15-layer box part, Metsusa Catalyst, (Hitachi Converter Bokurai (Fake → Seima 11f 1 name PEC-8
N5 Wataru ff311 'ir' and other compositions!j/lJτ
Tenon+#1. 11, Beno (I made a wiring board τ for immediate use) 'lj et al.'lay
ij:tτ Table I
': J made N b6 people 1xiipol 1052) 39
nti8 decoration, alkylphenol MIJti'r (
Scoui, Nokufuig ε Nonolsha dis product name SL)+
26) 25.111j Ir'il'L Hisphenol-type epoxy 1iti (r'u↓ification/El!f
'l'122 Song name Epicor) 1001) 151 no L=
'i, 1), Engineering small hardening method JIItY (Sukewari Tadei Chemical Co., Ltd. product name 5P6600) 81 Shigeto, Mitsu Yokoso (Hakusui Chemical (1 (J product name Micropax 2UA)
] 20 Tonseki S iβ, plating catalyst (Hitachi Kita-jō 1-mi (kai 4
Mu I Kf + product name PE -5) 6 heavy heat fl'15 sword/ra/! , ゐThe combination of abstraction τda(〃also ψsu 1 mentioned 1 method and 1614 rectangle and mark AIIIJ itself ωmin τ1 lower J 戊戊 0 monk et al. 7L characteristics?Table-1Vc shows 0 above 夾抛1tari,
Comparative Example] As a reflection of compromise and the king of printed wiring boards, the results of a performance test γ of the solder heat resistant 5-circuit contact VC are shown below.
衣−1
1):JIS、C−6481VC準拠。260℃はんだ
浴におけゐ黙破象抄数τd1す建てゐ。Clothing-1 1): Compliant with JIS, C-6481VC. In the solder bath at 260°C, the number of solder samples τd1 is built.
2):スルホール郡に搭載した電子部品τ260°′C
に調蟹した70−ソルダー忙1史用してげんた埃絖した
のち280 ’Cに調休し7c、ttlんだ吸取?kt
用いてほんた〒除さ′電子部品τ父侯し、次いで600
°’Cvc調企したけんたコ゛テf1史用してほんだ→
及続およびはんた吸取器によめ部品父保τ(り刀島えし
竹い。2):Electronic components τ260°'C installed in Surhole County
70-cold to 70--solder was used for 1 time, dust was applied, then adjusted to 280'C, 7c, ttl was blotted? kt
Used to remove 'electronic parts' father, then 600
°'Cvc was planned for the Kenta Cote f1 historical use →
Continue to use the solder blotting device to remove parts.
スルホール日ISのフンド破根く丁、接幌久撰丁7)迄
のμ11畝9:り4リシl三丁イ〕06):JIs−c
64otVc年づ処して、4凶・11〜の引き余IJシ
]安雇5虫8τかII ’y、を丁ゐ0不発つ」の無電
解のっさ用接后fi’i ’に杷は払抜に塗イfj し
たアディティフ印=、+自じにべ4反8−+ンt、4反
に1便く鷲グζ]功が1寸きに(〈、ス部品ス悲!・1
・上に丁ぐ肚ておりtL;va4+ 印A1114配祿
板としての一飯材性ヤリえは回路嵌眉注・?1んたディ
ツノ耐H’s<’、 ’l+等か)くランスして−1ぐ
7ICいゐ。μ11 ridge 9: ri 4 rishi l 3 cho i] 06): JIs-c up to Surhole day IS fundohakonkucho, contact kusencho 7)
64otVc years, 4 evil, 11 ~ leftover IJ shi] cheap labor 5 insect 8τ or II 'y, just 0 duds' electroless kiss fi'i ', loquat The Aditif mark that was painted on the brush was =, + itself 4 times 8 - + nt, 1 time for 4 times eagle ζ] Go was 1 inch (〈, Su parts Susai!・1
・I'm sitting on the top, tL; va4+ Mark A1114 is a one-shot material as a dispensing board, but is it a circuit fitting? 1st ditsuno resistance H's<', 'l+ etc.) Lance and -1g7 IC.
Claims (1)
ゴム、フェノール樹脂、エポキシ樹脂。 エチレン酢酸ビニル共重曾体よ、り成ゐ熱映化性接盾創
層盆形成した接膚剤板校絶縁板02、熱硬化性接庸剤が
、アクリロニトリルブタジェンゴム25〜80軍片都、
ンエノール朔脂10〜55貞箪郡、エポキシ位f脂2〜
45MM部、エチレン酢収ビニル共重付体0.5〜1
5 M:ff M ’T ’i’J * 浴IA VC
均−VC7M 台8 (fC接涜刑でめる翁許請求の範
囲第1項記載の候后剤被榎絶縁扱。 3、熱硬化性接盾痢が、アクリロニトリルブタシx 7
−r450〜50M1蔗tJ−アルキルフエ/−に南k
1s〜45重及都、エポキシ衝加5〜24電鉦都、エ
チレン酢1投ビニル共重合体7〜to1i麓都、無機元
項剤10〜45直貨部を有僚浴媒に均一に混合させた接
眉剤である特FF 請求の範囲1項記載の接盾却J仮核
絶縁板[Claims] 1. Acrylonitrile butadiene rubber, phenol resin, and epoxy resin on the surface of the sheet H&board. Made of ethylene-vinyl acetate copolymer, the skin contact plate is made of a thermosetting adhesive layer with a wound layer formed on the insulation board 02, and the thermosetting adhesive is made of acrylonitrile butadiene rubber 25 to 80 units. ,
Nenol Sakuhi 10~55 Teitan County, Epoxy position f fat 2~
45MM parts, ethylene acetate-vinyl copolymer 0.5-1
5 M:ff M 'T 'i'J * Bath IA VC
Uniform-VC7M unit 8 (fC range of claims for blasphemy punishment Treated as a candidate agent as described in paragraph 1. 3. Acrylonitrile buta x 7
-r450~50M1 tJ-Alkylhue/-to south k
1s to 45 parts, 5 to 24 parts of epoxy, 1 part of ethylene vinegar, 7 to 1 parts of vinyl copolymer, 10 to 45 parts of inorganic additives mixed uniformly in the bath medium. A special FF which is a clitic agent having a climatic structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17765283A JPS6068935A (en) | 1983-09-26 | 1983-09-26 | Adhesive coated insulating board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17765283A JPS6068935A (en) | 1983-09-26 | 1983-09-26 | Adhesive coated insulating board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6068935A true JPS6068935A (en) | 1985-04-19 |
JPH0411381B2 JPH0411381B2 (en) | 1992-02-28 |
Family
ID=16034732
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17765283A Granted JPS6068935A (en) | 1983-09-26 | 1983-09-26 | Adhesive coated insulating board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6068935A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6276587A (en) * | 1985-09-28 | 1987-04-08 | 住友ベークライト株式会社 | Additive plating adhesive |
EP0361754A1 (en) * | 1988-09-20 | 1990-04-04 | Hitachi Chemical Co., Ltd. | Adhesive composition for printed wiring boards |
-
1983
- 1983-09-26 JP JP17765283A patent/JPS6068935A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6276587A (en) * | 1985-09-28 | 1987-04-08 | 住友ベークライト株式会社 | Additive plating adhesive |
JPH0573078B2 (en) * | 1985-09-28 | 1993-10-13 | Sumitomo Bakelite Co | |
EP0361754A1 (en) * | 1988-09-20 | 1990-04-04 | Hitachi Chemical Co., Ltd. | Adhesive composition for printed wiring boards |
US5053280A (en) * | 1988-09-20 | 1991-10-01 | Hitachi-Chemical Co., Ltd. | Adhesive composition for printed wiring boards with acrylonitrile-butadiene rubber having carboxyl groups and 20 ppm or less metal ionic impurities; an alkyl phenol resin; an epoxy resin; palladium catalyst, and coupling agent |
Also Published As
Publication number | Publication date |
---|---|
JPH0411381B2 (en) | 1992-02-28 |
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