JPS6067933U - thermal head - Google Patents
thermal headInfo
- Publication number
- JPS6067933U JPS6067933U JP15884983U JP15884983U JPS6067933U JP S6067933 U JPS6067933 U JP S6067933U JP 15884983 U JP15884983 U JP 15884983U JP 15884983 U JP15884983 U JP 15884983U JP S6067933 U JPS6067933 U JP S6067933U
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- wiring
- gap
- backflow prevention
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はサーマルヘッドの従来例を示す要部概略斜視図
、第２図および第３図ａ、 ｂはその問題点を説明する
ための図、第４図は本考案に係るサーマルヘッドの一実
施例を示す要部概略斜視図、第５図はその要部平面図、
第６図は同じく要部側面図である６
１・・・・・・耐熱性基板、２・・・・・・発熱体抵抗
素子、・３・・・・・・配線用基板、４・・・・・・共
通配線、５・・・・・・ペースマウント、６・・・・・
・絶縁シート、７・・・・・・導体群、８・・・・・・
逆流防止用素子アレイ、１０・・・・・・間隙。FIG. 1 is a schematic perspective view of the main parts of a conventional example of a thermal head, FIGS. 2 and 3 a and b are diagrams for explaining the problems, and FIG. 4 is a diagram of a thermal head according to the present invention. A schematic perspective view of the main parts showing the embodiment, FIG. 5 is a plan view of the main parts,
FIG. 6 is a side view of the same main parts. ...Common wiring, 5...Pace mount, 6...
・Insulating sheet, 7... Conductor group, 8...
Backflow prevention element array, 10... gap.
Claims (1)
基板と、共通配線が形成された配線用基板と、前記発熱
体抵抗素子と共通配線とを導体群を介して接続する逆流
防止用素子アレイとを備え、前記耐熱性基板と配線用基
板との間に間隙を設けるとともに、この間隙内に前記逆
流防止用素子アレイを配設したことを特徴とするサーマ
ルヘッド。A heat-resistant substrate on which a plurality of heating element resistance elements are formed, a wiring board on which a common wiring is formed, and a backflow prevention device that connects the heating element resistance element and the common wiring through a group of conductors. What is claimed is: 1. A thermal head comprising: an element array; a gap is provided between the heat-resistant substrate and the wiring substrate; and the backflow prevention element array is disposed within the gap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15884983U JPS6067933U (en) | 1983-10-14 | 1983-10-14 | thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15884983U JPS6067933U (en) | 1983-10-14 | 1983-10-14 | thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6067933U true JPS6067933U (en) | 1985-05-14 |
Family
ID=30349837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15884983U Pending JPS6067933U (en) | 1983-10-14 | 1983-10-14 | thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6067933U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57116665A (en) * | 1981-01-14 | 1982-07-20 | Nippon Telegr & Teleph Corp <Ntt> | Thermal head incorporated in driving circuit |
| JPS57203572A (en) * | 1981-06-10 | 1982-12-13 | Matsushita Electric Ind Co Ltd | Thermal sensitive recording thermal head |
-
1983
- 1983-10-14 JP JP15884983U patent/JPS6067933U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57116665A (en) * | 1981-01-14 | 1982-07-20 | Nippon Telegr & Teleph Corp <Ntt> | Thermal head incorporated in driving circuit |
| JPS57203572A (en) * | 1981-06-10 | 1982-12-13 | Matsushita Electric Ind Co Ltd | Thermal sensitive recording thermal head |
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