JPS6110847U - Moving type thermal head - Google Patents
Moving type thermal headInfo
- Publication number
- JPS6110847U JPS6110847U JP9453284U JP9453284U JPS6110847U JP S6110847 U JPS6110847 U JP S6110847U JP 9453284 U JP9453284 U JP 9453284U JP 9453284 U JP9453284 U JP 9453284U JP S6110847 U JPS6110847 U JP S6110847U
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- type thermal
- moving type
- board
- lead wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａは本考案のムービング型サーマルヘヅドに用い
るフレキシブルテープの実施例を示す一部切欠斜視簡略
図、第１図ｂは番１図ａに示すフレキシブルテープを接
続するムービング型サーマルヘッドの斜視簡略図である
。
２・・・放熱基板、３・・・絶縁基板、４・・・ピン、
６・・・発熱抵抗体、７，８．１２・・・リード線、１
０・・・フレキシブルテープ、１３・・・位置決め用基
板。Figure 1a is a partially cutaway simplified perspective view showing an embodiment of the flexible tape used in the moving type thermal head of the present invention, and Figure 1b is a simplified perspective view of the moving type thermal head to which the flexible tape shown in Figure 1a is connected. It is a diagram. 2... Heat dissipation board, 3... Insulating board, 4... Pin,
6...Heating resistor, 7,8.12...Lead wire, 1
0... Flexible tape, 13... Positioning board.
Claims (3)
続するリード線とが配一された高抵抗基板と、この高抵
抗基板を載置した放熱基板と、前記リード線と電気的に
接続するリード線が配置されたフレキシブルテープとを
少なくとも具備するムービング型サーマルヘッドにおい
て、前記放熱基板または高抵抗基板に位置決め用の突起
が設けられ、かつ前記フレキシブルテープにこの位置決
め用の突起に係合する凹部を有する位置合せ用基板が設
けられていることを特徴とするムービング型サーマルヘ
ッド。(1) A high-resistance board on which a plurality of heat-generating resistors and lead wires electrically connected to the heat-generating resistors are arranged, a heat-dissipating board on which the high-resistance board is placed, and an electrical connection between the lead wires and the lead wires. In the moving type thermal head, the moving type thermal head is provided with at least a flexible tape on which lead wires connected to are arranged, and the heat dissipation board or the high resistance board is provided with a positioning protrusion, and the flexible tape is engaged with the positioning protrusion. A moving type thermal head characterized by being provided with an alignment substrate having a matching recess.
る凹部を有することを特徴とする実用新案登録請求の範
囲第１項記載のムービング型サーマルヘッド。(2) The moving type thermal head according to claim 1, wherein the alignment substrate has a recess that engages with the high resistance substrate.
板の厚さと略等しいことを特徴とする実用新案登録請求
の範囲第１項記載のムービング型サーマルヘッド。(3) The moving type thermal head according to claim 1, wherein the thickness of the alignment substrate is approximately equal to the thickness of the high-resistance substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9453284U JPS6110847U (en) | 1984-06-26 | 1984-06-26 | Moving type thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9453284U JPS6110847U (en) | 1984-06-26 | 1984-06-26 | Moving type thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6110847U true JPS6110847U (en) | 1986-01-22 |
Family
ID=30653116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9453284U Pending JPS6110847U (en) | 1984-06-26 | 1984-06-26 | Moving type thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6110847U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016153179A (en) * | 2015-02-20 | 2016-08-25 | 東芝ホクト電子株式会社 | Thermal print head |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS535756B2 (en) * | 1974-12-27 | 1978-03-01 | ||
| JPS5749581A (en) * | 1980-09-11 | 1982-03-23 | Ricoh Co Ltd | Connection between thermal head and heating-energizing circuit |
-
1984
- 1984-06-26 JP JP9453284U patent/JPS6110847U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS535756B2 (en) * | 1974-12-27 | 1978-03-01 | ||
| JPS5749581A (en) * | 1980-09-11 | 1982-03-23 | Ricoh Co Ltd | Connection between thermal head and heating-energizing circuit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016153179A (en) * | 2015-02-20 | 2016-08-25 | 東芝ホクト電子株式会社 | Thermal print head |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6110847U (en) | Moving type thermal head | |
| JPS58120047U (en) | thermal head | |
| JPS605842U (en) | thermal print head | |
| JPS585753U (en) | Thermal head with wiring pattern | |
| JPS59185843U (en) | Heatsink for electrical elements | |
| JPS60194534U (en) | thermal printing head | |
| JPS6073279U (en) | Hybrid integrated circuit device | |
| JPS60130048U (en) | thermal head | |
| JPS59120157U (en) | thermal head | |
| JPS59161283U (en) | sheet heating element | |
| JPS5821446U (en) | thermal head | |
| JPS59101391U (en) | panel heater | |
| JPS6075046U (en) | thermal head | |
| JPS6067933U (en) | thermal head | |
| JPS6041251U (en) | thermal print head | |
| JPS60153592U (en) | Heat dissipation device for heating element | |
| JPS59138201U (en) | Positive characteristic thermistor device | |
| JPS60138747U (en) | thermal head | |
| JPS59162250U (en) | thermal head | |
| JPS6145146U (en) | thermal head | |
| JPS59128759U (en) | End element connection | |
| JPS58145745U (en) | thermal head | |
| JPS5912643U (en) | thermal head | |
| JPS6075995U (en) | fever panel | |
| JPS60157243U (en) | thermal head |