JPS6067020A - Method and device for manufacturing plate in predetermined size by treating coarse plate from rolling mill - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method and apparatus for processing rough plates of large size and thickness, referred to herein as parent plates, coming from a rolling mill.

The processing of the product coming from the rolls of a rolling mill for flat plate products first determines the dividability of the rough plates, which are then cut by shears into daughter plates of exact dimensions.

Dividability (indentability) is the ability to cut multiple plates of the required dimensions from a given parent plate by cutting procedures to minimize metal loss, taking into account irregularities on the edges of the parent plate and defects within the plate. This refers to the possibility of dimensional distribution for cutting out the child plate.

Currently, the determination of divisibility is made by chalk marks or rough registers.

As a manual process, the operator moves around the board to mark the usable parts, determines the partial or total distribution of the child boards by rough register, and determines the remaining salvageable parts. Once this marking zone is determined, it is notified to the shear operator and the edge of the parent plate is cut to the required length.

This method is clearly unsuitable for modern industry, requires a large amount of labor, has large segmentation errors, and is expensive.

To assist in the marking operation, it is known to draw longitudinal lines by providing a rond with a light source in close proximity to a roller table on which the master plate to be marked is placed. However, this method only improves some of the manual operations described above, and is independent of the calculations and marking operations performed by the marking operator to separate the daughter board from the parent board in the longitudinal direction of the board.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a method and apparatus for treating a parent plate leaving a rolling mill, which completely obviates the two drawbacks.

The method according to the invention for processing and cutting the master plate coming out of a rolling mill into a plurality of child plates of predetermined dimensions makes it possible to divide each master plate in order to define marking zones that allow optimum utilization of the master plate. Then, when passing through a device that cuts each main board in the longitudinal direction 1] direction to cut out daughter boards, as an operation to determine the possibility of division, a crossed irradiation net is projected onto the main board, selectively moving each irradiation beam while keeping the ratio of 1 to 1, setting a predetermined -f' reverse batch on the main plate, and setting the J41i mark of the irradiation line with respect to the reference device in accordance with the main plate; Cut the main board according to the specified coordinates.

With the above configuration, the operator can perform marking work by controlling the irradiation beam while sitting in the observation cab.
The work is easy and accurate, and the fixed coordinates can be easily transmitted to the cutting machine to cut the board to the required size.

The invention also provides an apparatus for carrying out the method described above.

Reference will now be made to illustrative embodiments and drawings to demonstrate the advantages of the invention.

FIG. 1 shows a plan view of the device of the invention. This device has a marking station 1, a shearing device 2 at the downstream end for cutting off the front end of the mother plate TM, and a marking unit 3 downstream of this. This unit 3 is installed above the transfer table 4, and the plate to be cut is cut by a double-edged shearing device 5.
, and then sent to a shearing device that cuts the child plate from the parent plate.

A delivery table 7 for delivering the child plate is provided at the exit end of the device.

The marking station 1 shown as a perspective view in FIG. 2 has a known marking table 8, and the top of the table 8 is formed by a number of rollers 9. Move above 9.

A transverse beam 10 is provided between the upstream end of the table 8, that is, the outlet end of the rolling mill, and straddles the path of the plate in the lateral direction. An H portion rod 11 is provided on the right side of the table 8 in the direction of movement of the plate, and is brought into contact with the parent plate between the markings. On the opposite side of the table there is a series of light sources 1 to 16, 9, in the example shown seven devices] 2, and on the transverse beam 10 two light sources 14a.
, 14/' are provided. The light source is preferably a laser,
Cover with a shack when not in use. Light sources 14a, 14/
J are two parallel beams F1. F2 is on the same plane, and a longitudinal irradiation line 1. ．． 12. When using a laser, beam F1. F2 can be a cylindrical light source or a swept type, so that the beam hits the entire length of the plate in a predetermined sequence.

Light sources 16α to 13. ! 7 respectively produce an irradiation beam F6;
The beam is projected onto the plate as a horizontal line '3ct'''sg. This beam is preferably a laser that sweeps a variable surface.

The light sources 16.alpha.-1roy are rotatably mounted on a support device to be described later, so as to produce a horizontal line at a predetermined variable position in the zone on the base plate to which the lasers are associated, as desired by the operator.

That is, the line t3(L''-'35) can be moved longitudinally under the control of the operator by means of the necessary devices controlling the movement of the light sources 1-16g.

FIG. 6 is an explanatory diagram of the device 15 without moving the light sources 14a, 14A. This device has a bearing 16 fixed to a transverse beam 10, in which a ball bearing row screw 17 is supported. engaging the support moving table 18 with the nut 19 to the lead screw 17;
A linear movement is made by rotating the lead screw. The light source 14a or 14/I is supported on the movable table 18, and two
Lasers 20a, 20b are provided to produce beams F, l F
Generate 2.

The lead screw 17 is rotationally driven by a stepping motor 21 via a coupling 22. Angle encode! 23 is preferably of an absolute multi-rotation type and is coupled to the lead screw 17. This encoder produces a Gray-type binary code whose value is a function of the linear displacement of carriage 18 along the lead screw. This code is converted into a pure binary code by a converter 24, and the circuit 2
5, the measurement tolerance is corrected and sent to the calculation control unit 2G, the output of which is supplied to the stepping motor 21 and the computer 27 in FIG. 5, which will be described later.

The support device 15 of the light source 145 has a speed reduction device 28, 29, which corresponds to the relatively long dimension of the endless lead screw 17.

The reduction gear is shown in Figure 6 f! It is coupled to an encoder 23 indicated by a single line.

Figure 4 shows a device 3 that controls whether the light sources 1roa to 1roq are heard.
Indicates 0. The device 30 has a swept laser 3J, which is mounted on a support device 32 that is rotatable about a horizontal axis. The optical axis of the laser is tilted with respect to the horizontal and the beams F, I mark a horizontal line on the mother plate TM. A rotatable support device 32 is rotatably attached to the fixed bracket 32 .

The device 30 further includes a ball lead screw 34 along which a nut 35 that engages provides linear movement. Two smooth rods 36 slidable within the nut are secured to a rotatable support device 32. A stepping motor 38 is connected via a speed reducer 37 coupled to the lead screw 34.
An angle encoder 39 is connected to 4 through a coupling 40.

Similar to the device 18 for the light sources 14a, 14/), a converter 41 connected to an encoder 39 converts the gray code into a binary code, a circuit 42 corrects tolerances and outputs it to the computer 27 from the calculation control unit 43. supply.

FIG. 5 shows the data processing control circuit device 44. As shown in FIG.

The center of this circuit device is a computer 27 such as a microcomputer, to which peripheral units described later are connected.

The general construction of the controlled production of the mother plate and daughter plate is carried out by means of a large-capacity central calculation) a, 45. The computer 45 is, for example, a factory control computer, and stores instructions according to the present invention.

This computer stores instructions regarding the boards to be supplied to the customer, which instructions are supplied via line 46 to the computer 27 of the illustrated device in the form of a document called a marking ticket. This document is printed and specifies in particular the dimensions and metallurgical properties of the treated board.

The computer 27 connects the light sources 16a to 1 through lines 47, 48, and 49.
3g, 14a, 14/l and marking control desk 50
Connect to +Vi! 52 to a display device such as Morph 5J. The above-mentioned parts are placed at marking station J,! do.

The data obtained during marking are fed to the central computer 45 and via lines 53, 54 to the shear crack Z'5'6. The shearing devices 5, 6 are equipped with a control desk 55, 56 and a display screen 57+58. Furthermore, the data is supplied via line 59 with respect to the abscissa defined between the markings to the marking unit 3, which determines the complete identification information for each child plate to be cut out.

The end shearing device 2 is connected to the calculator 27 by a line 52.

A temperature measuring device 60 is provided to effect length correction and compensate for expansion of the plate due to temperature. This device is connected to the computer 27 via line 61. A further device 62 is connected to the calculator 27 via line 63 and takes into account variations in thickness from plate to plate. This variation can affect measurements depending on the position of the laser during marking.

The operator's control desk 50 is connected to the computer by other lines 64, 65, 66, found on the main board between the markings,
send commands regarding defects such as bent boards, boards shorter than required length, boards with uncorrectable defects, etc.

The main function of the above-mentioned device is to enable an optimal arrangement of the daughter plates within the parent plate, and this operation is primarily carried out by marking station J.
It is possible to define the so-called divisibility by a person skilled in the art.

In FIG. 6, a procedure for determining division possibilities performed at a marking station using the circuit arrangement 44 shown in FIG. 5 will be described.

The parent plate is transferred from the rolling mill to the transverse beam 10 before the end shearing device 2.
Once there, the operator requests characteristics regarding the parent plate by indicating the roll number on the keyboard of desk 50. This characteristic is written on a marking ticket, sent from the central body Ω machine/I5 to the computer 27, and manually displayed on the screen. Steps up to N are shown in steps 67 and 68 in Figure 6).

The computer 27 that has received the data regarding the position and characteristics of the child board to be marked automatically operates the motor 2J and the light source 14h, which moves the irradiation line t2 to the left of the board as seen in the direction of movement. Determine the position of H. This edge is called the ``thick line.''
, ] is pressed +=J to increment 1. This large edge line t2
is marked at the position of the theoretical dimension 1max from the rod]], and the front edge of the plate is sheared at the position 16 below the shearing device 2. (actuate t and do not move to the minor edge line t1.) This command is generated at the desk 50 and is transmitted via the computer 27 to the device r15 shown in FIG.

When writing the minor edge line tI, ?
- In order to avoid unevenness as much as possible, workers tend to select a position away from the small edge of the main plate. However, this results in a loss of a relatively large portion of the board.

In the example shown in FIG. 7, the parent plate has an edge defect that must be removed when cutting out the daughter plate. In FIG. 7, the defects are greatly exaggerated.

After moving the line t, the operator evaluates the selected position on the desk 50 without retrieving the corresponding data in the computer's memory. These are the six operations in FIG. 6.1. When setting line t1, both lasers 14a and 14A move by the same dimension in the same direction, and line 1. ．． Maintain the same distance of 1 m, a, and x between i2.

Under these conditions, the operator checks whether the divisibility regarding the width ( 1], and stores the position of line t2 as correct in the divider 27.In the opposite case, the operator corrects the position and sets the new position as the correct position. 1]. This is operation 70. This position is described as effective rl]7u in FIG. 7 as 1-.

Due to a defect on the opposite edge, the effective "1" lu of the main board
is smaller than the maximum medium .chi.chi. However, this defect can be removed by other methods described later, and the final width of the daughter plate cut out is 677 mm (maximum).

Split iEJ performance data for active and maximum is shown on the operator's screen 51. Manipulate this +71.
72.

Next, data regarding divisibility (related to the length of the parent board TM) is received. The end shearing device 6''2 generates a plate length reference point signal after cutting the parent plate 1'J and/or the sample.
0 to 13g so that it can be obtained optically. This laser is called a head laser.

The operator determines the length of the board based on the theoretical length of the board.
- Which of the lasers (foot laser) is selectively positioned to avoid irregularities on the opposite edge of the head and to determine an effective selective position. During this operation, the effective length between the cutter of the cutting device 2 and the evaluation position of the foot laser is stored in the divider 27. The dimensions may be the same as the front end of the plate excluding the sample portion. Samples can also be taken from other parts if required, and the length data relating thereto is also derived by the central computer 45 and fed via the computer 27 to the corresponding laser.

Assume that the position of the foot laser is correct. This is referred to as operation 73.

Calculator 20 receives temperature data from apparatus 60 shown in FIG. 5 and queries whether the measured length values need to be modified to compensate for expansion. (operation 76a), the operator corrects the length (operation 74) or corrects it (operation 75).
).

If there is no defect, the computer 27 engraves a large number of child plates on the main plate TM. (Operation 7G) In this case, the marking ticket is received from the calculator 45, and the dimensions are the divided values from the measured values of both edge lasers and foot laser.

This operation 76 includes various subprograms.

First, as shown in FIG. 7, in operation 77, the operator determines the dead board BM in order to remove defects in the board. For this purpose, in the illustrated example, the laser 13C13C is operated as required to determine the position.

The operator can place another sample plate in operation 78 (71'). The subsequent program is a marking request in operation 79, and the computer calculates the final marking on the board according to each of the above-mentioned data. The computer positions all the lasers.

This result is shown on screen 61. (Operation 80) If the operator has corrected this final marking (Operation 81), the program returns to Operation 8CIK and the revised marking is displayed.

The program then moves to a marking confirmation operation 82, where corrections in marking planon 1 are disabled. The marking plan is maintained until the board is discharged.

After confirmation, the computer 27 stores all the data. (Operation 83) In the above description, the rolled parent plate is determined by the tolerance of the parent plate,
It is assumed that the board can be divided into daughter boards according to marking tickets and instructions that define the parameters of the daughter board by taking into account temperature, board thickness, etc.

However, in some cases, the set of tolerances may not allow marking for optimal partitioning.

In this case, the device according to the invention allows a compromise division, again making optimal use of the material of the parent plate, and the product leaving the device is within the required tolerance range.

Usually the daughter plate is sold with a nominal dimension Cn, which, with the exceptions mentioned below, must not be shorter than the lower limit. Plates are usually supplied in nominal dimensions plus a positive tolerance, and customarily the length of the supplied product is the dimension Cn+e, i.e. the maximum dimension Lrnax.
required to be.

At the end of the operation procedure 76 shown in FIG. 6, when the operator determines and confirms the effective length J, +b of the main board, the cutting length of the board is included in the subtraction, and the cutting of the child board required by the marking ticket is done. There may be cases where all the outgoing dimensions are not equal to the dimensions Cn and +C.

If the effective length L'w of the parent board is longer than the sum of the total dimension C of the daughter board and the minimum dimension of the cut-off part, the divider 27 performs an average calculation, and the marking process determines the length of the daughter board. The value of C
n<C'〈71-1- C and Zuro. (Figure 6 Operation 8G
).

On the other hand, if the effective length J, +L of the main board is smaller than the sum of the total value of the phase length C of the child board and the length of the cut-off part, the computer program will remove one or more child boards. The allocation is done and the scrap of the parent board is recycled. (Operation 85).

In some cases, daughter plates may be manufactured with tolerances around nominal values. This is the case, for example, when the plates are used for the manufacture of tubes.

At this time, after determining the effective length LIL of the parent plate in operation 76, the operator introduces the allowable tolerance ranges LM and Lm.

Activate the calculator 27 and perform the distribution σ) subprogram (operation 86).
In the first step, this subprogram 86 calculates 7 boards of i, +t is LM
Consider whether it can be divided by -4-ro. If it breaks, d゛口'L
In the tL machine, the number x-/LM is the plate with the maximum flame, and the plate with the minimum length J, m is zero.

If Lu is not divisible by 14, the computer calculates the following equation.

In addition, , the calculator 27 obtains the maximum number of child boards to be marked on a predetermined parent board.

By entering a predetermined command from the operator into this subprogram, it is possible to set the marking on the child plate to be midway between the lengths Lm and Lm according to the following formula.

Lu, -, γLM Llg') Lt, = -) LmKoni, Ll:
Intermediate length of child plate.

The calculator may perform an allocation subprogram (operation 87), taking into account the aforementioned parent plate defects. In this case, the computer 27 considers the defect-free length L/u of the main board TM, considers it to be a new main board, and divides it into child boards in the same manner as described above.

This subprogram includes a command to group unusable σ) boards with defects resulting from the allocation calculation as secondary parent boards, which allows for optimal utilization of the material.

If the operator finds that the effective 1jllJ+b found in operation 70 is not sufficient, he visually inspects the board to see if it is narrow or curved to ensure that the correct division of length is not possible in the normal way. Know what you cannot do. The roots are usually always in the marking table 1 soil, with the concave edge facing the rod 11.

The worker found out that the board was bent. 11 Diagonal C operation 88
, and execute subprogram 9 "Curved Board" (operation 89). The divider 27 divides the divisibility shown in FIG. 8 by the following algebraic formula.

Here, 4γ: Retrievable width of the curved main plate 11th 2 In theory of the curved main plate f: Height of the inner arc near the rod 11 of the bent main plate L゛ Length of the inner arc Lγ: Recovery Possible length J, reb: Length that can be recovered after cutting the end of the main board, Lγeh, etc. The subtraction of Lγ determines the divisibility regarding the width by comparing lJr and 11mtyx of the child board that should be marked. , determine the number of child plates to be distributed over the recoverable length.

After operation 83, the computer 27 storing the splitting possibility information is activated to transmit the corresponding data to the other devices of the cutting device, in particular the marking device 3. Edge shear device 5. Pruning 101 device 6
The data can also be stored in the central computer 45.

The marking device 3 receives length data for the first part of the daughter board and uses this data to fix the mark on the daughter board.

Similarly, the shearing devices 5 and 6 are marked by a marking device σ). According to the defined division possibility data, an IH contactor or an operator receives this data and inputs it into a control desk and supplies it to the shearing device.

In the latter case, the plan for cutting the daughter plate is communicated to the operator of the shearing device 6. This same stroke σ includes a vertical positioning command for the movable abutment part υ of the shearing device necessary for cutting the child plate.

[Brief explanation of the drawing]

Figure 1 is a diagram of a device according to the present invention for cutting a mother plate (may be multiple σ) daughter plates in accordance with the marking ground determined by the theoretical marking plan, and Figure 2 is a diagram of the marking used in the device of Figure 1. FIG. 3 is a perspective view of a device for controlling the set of edge marking lasers; FIG. 4 is a perspective view of a lateral marking laser; FIG.
The figure is a block diagram of the information processing circuit device according to the present invention (C), FIG. 6 is a flowchart of the operation of the circuit device of FIG. 5, FIG. 7 is a plan view of the main board between markings, and FIG. It is a geometric figure showing the calculation for determining the indentability of the parent plate.'' Marking station 2.5.6 Shearing device 3 Marking unit 4 Transfer table 8 Marking cheeple 1 ]...Edge rods 13a to 13g, 14d, 14/l-L/-The light source 15/light source moving device 17.34...Lead screw 18-
・Moving platform 20 (L, 20b, 31 ・L/-The 2
1.38... step motor 23,39 ・Encoder 2
7.45... Computer 44... Data processing control device 50, 55.56... Control desk 60/Temperature measuring device (4 others) Continuation of page 1 @ Inventor Hervé Siret France [Inc. ] Inventor
Jean-Michel Kais Belgian Tatsuser 77

Claims (1)

[Claims] 1. A method for processing a rough plate, that is, a parent plate, produced from a rolling mill and cutting it into a plurality of child plates of predetermined dimensions, the method being for determining a marking plan that enables optimal use of the parent plate. The splitting possibility of each main board is determined in the next step. Next, when each main board is cut in the middle direction in the longitudinal direction and passed through a device that cuts out daughter boards, the operation to determine the splitting possibility is to perform cross-irradiation on the main board. Project a wire net, selectively move each ray while keeping it parallel to determine the required batch of daughter plates on the parent plate, and determine the coordinates of the rays relative to the reference device by matching them to the parent plate. A method for cutting a parent plate after exiting a rolling mill into child plates of predetermined dimensions, the method comprising cutting the parent plate according to the determined coordinates. 2. The method according to claim 1, wherein the length reference position of the reference device is obtained by cutting an end of one small edge of the parent plate. 2. The method according to claim 1, wherein the length reference position of the coordinates is determined by a radiation beam projected at right angles to the main plate. 4. The method according to claim 1 or 6, wherein one of the irradiation lines extending in the longitudinal direction of the main plate is used as the width reference position of the reference device. 5. As an operation for determining the possibility of division, first move the longitudinal irradiation line to determine the possibility of division regarding Ii]K, and then move the lateral direction ray to determine the possibility of division in the longitudinal direction. Range 1st and 2nd terms. Either of Item 6 and Item 4 is the method described in Item 1. 6. During the operation to determine the possibility of division regarding the width, move one of the longitudinal rays to avoid the unevenness of one of the edges of the main plate, and move the other longitudinal ray according to the theory, Longitudinal irradiation, check whether the gland moves away from the irregularities on the other edge of the parent plate, modify the position of the irradiation line as necessary to move it away from the irregularities on the larger edge, and adjust the position of the longitudinal irradiation line. 6. The method according to claim 5, wherein the width coordinates are determined by confirming the width coordinates. 7 In response to the operational question regarding divisibility regarding length, calculate the effective length of the board by moving the rear end irradiation line closest to the edge on the opposite side of the front reference edge of the main board to avoid unevenness on that side edge. The position of the other intermediate lateral rays is determined according to the length of the required daughter plate, and the length coordinates are determined by confirming the positions of all the lateral rays. The method described in Clause 5 or Clause 6 according to Clause. 8. A method according to claim 7, in which the position of at least some of the lateral irradiation rays is moved to avoid defects present on the side edges of the main plate in response to the operational question regarding length division possibility. 9. Said other lateral irradiation rays are moved as a function of a calculation of the optimum utilization of the mother plate obtained by a computer, and the computer is supplied with length data of the required daughter plate batches. The method described in section. 10. The method according to claim 9, wherein the temperature of the parent plate is measured during the marking process and the position of the horizontal irradiation line is corrected according to the measurement result.几 The method according to claim 9 or 10, wherein the position of the horizontal irradiation line is modified as a function of the thickness of the parent plate. 12. A method according to any one of claims 9 to 11, characterized in that the lateral rays are positioned as a function of dimensions depending on the upper limit of the tolerance of the daughter plate to be cut out. 13. If the length of the daughter board to be cut exceeds the effective table of the main board with respect to the tolerance limit, special feature 1. Q claim IIi! . The method described in paragraph 5. 14. For some child plate dimensions, the length is the maximum length within the tolerance range, and for other child plate dimensions, the length is the minimum length within the tolerance range, and the horizontal irradiation line is selectively positioned according to the following formula: A method according to claim 9 or 11. X: Number of daughter plates with length Lpt Y: Number of daughter plates with length Lm E: Function indicating the ratio of the total length of the daughter plates to the effective length Lu of the parent plate. 15. Any one of claims 9 to 11, wherein the longitudinal irradiation line and the lateral irradiation line are positioned according to the following formula in order to divide the main plate curved in the length direction.
The method described in section. lJr Retrievable width of the curved main board, lth, 'Theoretical width of the curved main board, f: Height of the inner arc of the curved main board, L, Chord length of the inner arc, Lr Retrievable width Length, Lreh: Retrievable length after cutting the front end of the parent board. 16. A device for carrying out the method according to claim 1, which includes a device for performing the marking process, a device for cutting into required dimensions, and a device for optically determining the possibility of dividing a predetermined number of child plates into a parent plate. 1. The apparatus for optically determining the splitting possibility comprises a plurality of light sources projecting longitudinal irradiation rays onto the mother plate parallel to the longitudinal edges of the mother plate; a plurality of second light sources that are movable in the lateral direction relative to the edge and irradiate the main board with irradiation beams that are movable in the lateral direction and parallel to each other in the lateral direction; a device that does not move the light source; a device that detects movement in the position of the light source; A cutting device that cuts a parent plate from a rolling mill, which is equipped with an information processing device, into child plates of a predetermined size. 1Z The cutting device of claim 16, wherein the light source comprises a swept laser having a cylindrical optical element. 18. The moving device is coupled to a stepping motor;
18. The cutting device according to claim 16, further comprising a support device movably supported by rotation of the lead screw and supporting the light source, and wherein the detection device is coupled to the lead screw. 19. The cutting device according to claim 18, wherein the first light source is directly mounted on the support device and mounted with a lead screw on a cross beam spanning the path of the parent plate in front of the marking zone. 20. Each of the second light sources is attached to a mounting element rotatable about a horizontal axis, and a mechanism for rotating the mounting element about the axis is coupled to the support device, and the optical axis of the light source is directed downward. 19. A cutting device according to claim 18, wherein the cutting device is mounted spaced apart from each other on the device with all the second light sources parallel to the marking zone. 21. The cutting device according to any one of claims 16 to 20, wherein a device for determining a front end reference is attached to an end of the marking zone opposite to the first light source. 22. Claims 16 and 22 further include a computer connected to receive a position signal supplied by the detection device and transmit a command signal to the drive device, the computer being connected to a control desk with a display screen. The cutting device according to any one of Item 21. 2) The number of times the calculator detects the temperature of the main plate
Claim 22: C-connection to compensate for expansion of the main plate
Cutting device as described in section. 24. The cutting device according to claim 22, which is equipped with a circuit for detecting the thickness of the parent plate and is connected to the separate calculator to correct marking errors due to changes in the thickness of the plate to be processed. 25. According to any one of claims 21 to 24, the calculator is connected to a circuit that transmits position data of a light source at the end of marking and operates a device that cuts the mother plate into a predetermined size. 026 The device according to any one of claims 22 to 25, comprising a marking unit that marks the identification code of the daughter board on the main board in response to a light source position signal from a computer. Cutting device.