JPS606541B2 - Manufacturing method of moisture-proof insulation treated hybrid IC - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a moisture-proof insulated hybrid.

Conventionally, powder paints and solvent-based moisture-proof insulation paints have been used as moisture-proof insulation paints for hybrid ICs.

However, since these paints are heat-curable, it takes a long time for insulation treatment. For short-time processing, ultraviolet curable resin compositions that cure within several seconds to several minutes are advantageous, but ordinary ultraviolet curable resin compositions have problems in adhesion to ceramics and moisture resistance. As a result of various studies, the present inventors have discovered a method for producing a hybrid IC with excellent moisture-proof insulation properties using a resin composition whose cured product has excellent adhesion to ceramics and moisture resistance.

The present invention relates to compounds obtained by addition reaction of wind maleic anhydride, maleic anhydride, and animal and vegetable oils having a double bond capable of addition reaction, and a compound with the formula (R, , R2 is a day or a C string, and these are the same A compound obtained by reacting a compound represented by the formula (hereinafter referred to as Component) [B) a photopolymerization initiator and a compound represented by the formula and/or CH2:CH-Sj (OR5
)3 (R3 is H or C ratio, R4 is a divalent hydrocarbon residue, R5 is an alkyl group) A resin composition containing a compound (hereinafter referred to as component }) is made into a hybrid. The present invention relates to a method for manufacturing a hybrid IC that is coated and cured by light irradiation, which is subjected to a moisture-proof insulation treatment.

The addition reaction between maleic anhydride and an animal or vegetable oil having a double bond capable of an addition reaction is carried out using 0.5 to 2 moles of this animal or vegetable oil per mole of maleic anhydride.
It is preferable to carry out at 16,000 to 24,000 for 3 minutes to 6 hours.

If necessary, a solvent such as toluene or xylene may be used. It is preferable to react approximately equimolar amounts of the compound represented by the formula with respect to 1 mole of the addition reactant in the absence of a solvent at 60 qo to 12,000 qo for 4 to 24 hours.

Examples of animal and vegetable oils having double bonds capable of addition reaction with maleic anhydride of the present invention include linseed oil, tung oil, coconut oil, safflower oil, soybean oil, dehydrated castor oil, rice bran oil, cottonseed oil, and fish oil. These can be used alone or in combination.

Compounds represented by the formula (R, R2 is H or C&) include 2-hydroxyethyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl methacrylate, 2-hydroxypropyl acrylate, etc. can be used alone or in combination.

Examples of the photopolymerization initiator include benzyl dimethyl ketal, benzoin, benzoin ethyl ether, penzoin propyl ether, benzoin phenyl ether, penzoin thioethers, benzophenone, acetophenone, 2-ethylanthraquinone furoin, benzoin ether Michler ketone, chlorinated decylnothioxanthone, etc. are used. The compound represented by the formula or the compound represented by CH2CH-Si(OR5) (R3 is H or CH3, R4 is a divalent hydrocarbon residue, and R5 is an alkyl group) is, for example, Examples include y-methacryloxypropyltrimethoxysilane, y-methacryloxypropyltriethoxysilane, y-acryloxypropyltrimethoxysilane, vinyltrimethoxysilane, and vinyltriethoxysilane.

0.00 parts by weight of photopolymerization initiator per 10 parts by weight of harmful ingredient
It is preferable to use the 'C} component in an amount of 0.0001 to 20 parts by weight from the viewpoint of adhesion to ceramics and UV curability. The various components mentioned may be contained as necessary.

Examples of crosslinkable monomers include styrene, vinyltoluene, Q-methylstyrene, p-tertiarybutylstyrene, chlorostyrene, divinylbenzene, diallyl phthalate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, methyl methacrylate, and ethyl methacrylate. 1, such as lauryl methacrylate, a reaction product of methacrylic acid and Cardura E-10 (trade name of glycidyl ester, a higher fatty acid manufactured by Shell Chemical Co., Ltd.)
Functional esters of methacrylic acid, ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, 106 hexanediol dimethacrylate, etc.
Functional methacrylic esters, trifunctional methacrylic esters such as trimethylolpropane trimethacrylate, methyl acrylate, ethyl acrylate, lauryl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, acrylic acid monofunctional acrylic esters such as the reaction products of Cardura E-10, difunctional acrylic esters such as ethylene glycol diacrylate, diethylene glycol diacrylate, 1,6 hexanediol diacrylate, trimethylolbropane triacrylate, etc. Trifunctional acrylic esters such as acrylates can be used alone or in combination.

As the solvent, aromatic solvents such as toluene and xylene, ester solvents such as ethyl acetate and butyl acetate, and ketone solvents such as methyl ethyl ketone and acetone can be used.

As a radical polymerization initiator, suitable silver oxides such as benzoyl peroxide and acetyl peroxide, ketone peroxides such as tert-butyl peroxide, methyl ethyl ketone/gu oxide, kyumene hydroperoxide, and cyclohexanone peroxide, and dicumyl peroxide are used. Alkyl peroxides such as, tertiary butyl peroxybenzoate, oxyperoxides such as tertiary butyl/dioxyacetate, etc. can be used.

As a hardening accelerator, naphthenates, octenoates, etc. of iron, cobalt, lead, manganese, nickel, tin, zinc, etc. can be used. As the polymerization inhibitor, quinones such as hydroquinone, paratertiary butylcatechol, pyrogallol, and other commonly used ones can be used.

The resin composition of the present invention may also contain inorganic fillers such as quartz glass powder, hydrated alumina powder, talc, calcium carbonate, mica, mica powder, synthetic mica, synthetic mica powder, alumina oxide, and silica, if necessary. , pigments, dyes, etc. may be added.

Components such as the above-mentioned crosslinkable monomers are used in amounts commonly used in resin compositions, and there are no particular limitations on the amounts used. Further, the resin composition in the present invention includes unsaturated polyester resin, oil-modified unsaturated polyester resin, dicyclobesotagene-modified unsaturated polyester resin, polybutadiene, acrylic acid and/or methacrylic acid-modified polybutadiene, unsaturated epoxy shester resin, supoxy Can be used in combination with resin etc.

In the present invention, the resin composition is applied to the hybrid by soaking the hybrid IC in the above resin composition or by coating the hybrid IC with the above resin composition. In the present invention, the resin composition is applied to the hybrid and then cured by light irradiation, but a radical polymerization initiator may be added to the resin composition and the resin composition may be irradiated with infrared rays or far infrared rays.

Next, Examples and Comparative Examples will be described, but the present invention is not limited to these Examples. In Examples and Comparative Examples, parts are by weight. Comparative example 1 EP-828 (Shell Chemical Co., Ltd. epoxy resin) 290 minutes,
Acrylic acid of 140% was reacted at 100°C for 4 hours to give an acid value of 1.
．． Eboxy acrylate of No. 5 was obtained.

Varnish A was obtained by mixing seven parts of this eboxy acrylate, three parts of styrene, and one part of benzyl dimethyl ketal. Comparative Example 2 Varnish B was obtained by mixing 7 parts of Aronix 8060 (manufactured by Toagosei Co., Ltd., polyester acrylate), 3 parts of styrene, and 1 part of benzyl dimethyl ketal.

Comparative Example 3 EP-82810 $ parts, triphenylsulfonium hexafluoroantimony (50% propylene carbonate solution) 6
Varnish C was obtained by mixing the parts.

Comparative example 4 708 parts of linseed oil, 125 parts of maleic anhydride 1 part 4
Pour into a three-necked flask and blow nitrogen gas into it.
After reacting at 20 qo for 4 hours, the mixture was overflowed to 100 qo, and 167 qo of 2-hydroxyethyl methacrylate and 0.2 qo of hydroquinone were added, and while blowing air, 1
Reacted at 00℃ for 4 hours, acid value 70, viscosity 32 poise (
Compound A (25°C) was obtained.

Varnish D was obtained by mixing 7 parts of Compound A, 3 parts of styrene, and 1 part of benzyl dimethyl ketal. Example 1 Parts of Compound A7, 3 parts of styrene, 2 parts of y-methacryloxypropyltrimethoxysilane, and 1 part of benzyl dimethyl ketal were mixed to obtain Varnish E.

Example 2 Varnish F was obtained by mixing parts of Compound A7, 3 parts of styrene, 2 parts of vinyltrimethoxysilane, and 1 part of benzyl dimethyl ketal.

The varnishes A to F of Comparative Examples and Examples were applied to an alumina ceramic substrate to a thickness of 40 cm and cured completely by UV irradiation for 60 seconds using a mercury lamp manufactured by Ushio Inc. at a 50 W/skin irradiation distance of 10 cm. hardened to.

Next, adhesion was evaluated by peeling off the tape according to the JISK 5400 cross-cut test.

The results are shown in Table 1. Table 1 From Table 1, it can be seen that the resin composition of the present invention is UV curable, and the cured product has excellent adhesion to ceramics and weaving resistance, thereby providing a hybrid IC with excellent moisture-proof insulation properties. is shown.

Claims (1)

[Scope of Claims] 1 (A) Compounds and formulas obtained by the addition reaction of maleic anhydride and an animal or vegetable oil having a double bond capable of addition reaction▲There are mathematical formulas, chemical formulas, tables, etc.▼ (R_1, R_2 are H or CH_3, and these may be the same or different.) Compound (B) Photopolymerization initiator and formula (C) ▲ Numerical formula, chemical formula, table, etc. There is a compound represented by ▼ and/or CH_2=CH-Si(OR
_5) A resin composition containing a compound represented by _3 (R_3 is H or CH_3, R_4 is a divalent hydrocarbon residue, and R_5 is an alkyl group) is applied to a hybrid IC and cured by light irradiation. A method for manufacturing a hybrid IC treated with moisture-proof insulation, characterized by: