JPS6064271A - Card tester - Google Patents

Abstract

PURPOSE:To attain to reduce the cost of a personal board by facilitating the fabrication thereof, by providing through-holes in the grids of earthing conductive patterns formed onto an insulating base board in a grid form. CONSTITUTION:Grid like conductive patterns 22 for GND are formed to both surface S or single surface of an insulating base board 20 comprising glass-epoxy resin and each of through-holes 21 for mounting lifter pins 10, 10' are formed to the center part of each grid. The earth wire 24 from the lifter pin 10' in the back surface side of the base board 20 is passed through two through-holes and soldered to one grid point of the patterns 22 as shown by numerals 25b, 25a and, therefore, the arbitrary lifter pin 10' can be tightly earthed. As a result, a card tester can be easily assembled by general-purpose parts and alteration or reutilization is easy and the enhancement in the efficiency of testing work and cost reduction can be achieved.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a tester for IC boards or cards of various digital devices, and in particular to an in-circuit tester that tests any IC circuit in a card while it is mounted. , relates to a novel structure of a probe section called a pedestal of nails that electrically connects a card and a tester.

[Technology background]

Conventionally, a type of universal in-circuit tester bed-of-nails that can be adapted to any IC card has a board equipped with a large number of spring probe bins arranged in a matrix, and only the necessary spring probe bins protrude to test the IC card. Some have a binding bin board structure in which a board is planted with a glue bin for contacting the conductive parts of the board. An example is shown in Figure A11.

Figure 1: 1 is a cross-sectional view of the bed of nail of the in-circuit tester, where 1 is an IC card, 2 is a diaphragm rubber, 3 is a diaphragm board, 4/ is a matrix port, and 5? Yo probe pinhole,.

6 is a spring probe bottle, 7 is an air seal rubber,
8 is the lifter board, 9 is the GND (ground) brain, 10
is a lifter pin, and 11 is a pin isolation hole.

12 is a ground wire, 13 is a link wire, and 14 is a pin contact.

15 is an interface board, 16 is a probe pin, 1
7 indicates a ring wire, and 18 indicates a tester body.

The matrix board 4 and the lifter board 8 are made of an insulating material, and the plane 9 (GNL) is a metal plate,
A pin isolation hole 11 is provided corresponding to the lifter pin so as not to come into contact with the lifter pin. For Paul 5 of Matrix Pode 4.

A spring probe pin 6 is slidably inserted.

A lifter pin 10 is fixed to the lifter board 8.

The lifter pins 10 are placed directly below each conductive portion of the IC card 1 that requires electrical connection with a tester.

Figure 2 shows an example of lifter board glue pin arrangement.

By attaching the lifter board 8 to the lower surface of the matrix port 4, each lifter pin 10 pushes up the corresponding spring probe pin 6. Therefore, the spring probe bin 6 protrudes upward through the diaphragm board 3 and the diaphragm rubber 2, and the tip of the pin contacts the conductive surface on the back side of the IC card 1, and is firmly pressed by the force of the spring. FIG. 3 shows the state in which the spring probe bin 6 is pushed up. In addition.

Inside the bed of nails, that is, IC card 1, matrix port 4. A vacuum is applied between the lifter boards 8 so that the entire surface of each board is evenly pressed together.

This allows any conductive surface of the IC card 1 to be
The test points and the like of the C circuit are electrically connected to the lifter pin 10 via the spring probe pin 6.

Among each lifter pin 10, the pin to be grounded is the grounding wire 12.
The signal transmission pin is connected to the GND plane 9 by the link line 13. Bottle contact 14° probe pin 16
．． It is connected to the tester body 18 via a link line 17.

The matrix port 4 is used for general purposes, and has several tens to tens of thousands of probe pinholes 5 so that any part of an IC card to be tested can be tested. but.

The lifter board 8 and the GND brain 9 are called personal boards because they are created for each IC card to be tested.

Many man-hours are required for drilling holes, fixing lifter pins, connecting ground wires, etc., and the cost is also high.

[Object and structure of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to facilitate the production of a personal board used in a bed of nails of a card tester and to reduce costs.

Therefore, the present invention creates a personal board that integrates a lifter board and a GND plane.

In addition, like the matrix port, a hole for insertion is pre-drilled on the entire surface so that the lifter pin can be easily attached to any position.

Accordingly, the configuration of the present invention includes a matrix port having a built-in spring probe pin, and a personal board equipped with a lifter pin that pushes up a spring probe pin at a predetermined position within the matrix board, and the personal board is an insulating substrate. A grounding conductive pattern formed in a lattice shape on top, through holes provided in each lattice of this grounding conductive pattern, a resist layer covering a portion of the grounding conductive pattern other than the lattice points, and a predetermined It is characterized by being fixed to a through hole in the position or by a lid pin.

[Embodiments of the invention]

The details of the present invention will be explained below based on examples.

FIG. 4 (cLl + (6) + (cl) indicates one embodiment of the personal board according to the present invention, and FIG. 1 (α) is a top view and FIG. 2 (b).

(, J are cross-sectional views taken along X-X and Y-Y in the figure (α), respectively. In the figure, 19 is a personal board, 20 is an insulating substrate, 21 is a through hole, 22 is a conductive pattern for GND, 23 represents a resist layer.

The insulating substrate 20 is made of glass, epoxy resin, etc., and a GND conductive pattern 22 is formed in a grid pattern on both sides or one side of the insulating substrate 20 using a known etching technique. The through hole 21 is a hole for attaching a lifter pin.

It is formed in the center of each grid. Resist layer 23
is when the ground wire from the lifter pin is soldered to the 22 child points of the GND conductive conductive pattern.

It works to prevent solder from flowing from the grid points.

Figure N-5 (αl, (b) shows a state in which lifter pins are attached to a part of the personal board 19 shown in Figure 4. Figure (α) shows the top surface of the personal board 19. (bl indicates the bottom surface of the same personal board. In the figure, 10.10' beam lid bin, 21 is a through hole, and 22 is a conductive pattern for GND.

Reference numeral 24 represents a grounding wire, 25α and 25b represent soldering parts, and 26 represents a link wire.

The ground wire 24 from the lifter pin 10' passes through two through holes and is soldered to one grid point of the GND conductive pattern as shown at 25a and 256. In this way, any rope lid bin 10 can be firmly connected to ground.

The empty through hole where the lifter pin is not installed is Af.
During the vacuum suction inside the bed of nails explained in Figure 1,
Since this can cause air leakage, it is filled with a suitable insulating paint, or after the lift turbine is installed, the lift turbine is fixed and the empty through holes are fixed all at once with solder dip and filled.

〔Effect of the invention〕

As described above, according to the present invention, the personal board in the bed of nails can be easily assembled using general-purpose parts, and can be easily modified.

Since it is easy to reuse, it is possible to improve the efficiency of test work and reduce costs.

[Brief explanation of the drawing]

Figure 1 is a sectional view of a bed of nails in a conventional card tester, Figure 2 is a diagram showing an example of the configuration of a beam lid board,
: Figure A13 is a diagram showing the state in which the spring probe pin is actuated by the lifter pin, Figure 4 (LL), (b
), (a) is a structural diagram of one embodiment of the personal board according to the present invention, and Figure 1 (a) is a top view, Figure 1 (6), (c
) are cross-sectional views at the X-X and Y-Y positions of the figure (ar), FIG. card, 4 is matrix board, 6 is spring probe pin, 10.10' beam lid bin,
19 is a personal board, 20 is an insulating substrate, 21 is a through hole, 22 is a GND conductive pattern, and 23 is a resist layer. Patent Applicant Usatsuk Electronics Industry Co., Ltd. Representative Patent Attorney Fumihiro Hase (2 others) Y-1 Affected ◎;
Y

Claims (1)

[Claims] It has a matrix board that has a built-in spring probe bin, and a personal board that is equipped with a lifter bin that pushes up the spring probe bin at a predetermined position in the matrix board, and the personal board is formed in a grid shape on an insulating substrate. A conductive pattern for grounding, a through hole provided in each grid of the conductive pattern for grounding, a resist layer covering the portion of the conductive grounding pattern except for the grid points, and a resist layer fixed to the through hole at a predetermined position. A card tester comprising a lid and a lid.