JPS605593Y2 - Electrical component lead wire shape - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to the shape of lead wires for electrical and electronic components such as integrated circuits and transistors.

Conventionally, many electrical and electronic components such as integrated circuits and transistors that have a plurality of lead wires employ plate-shaped lead wires for ease of lead wire manufacture.

As shown in the side view of FIG. 1, the method for attaching these electrical and electronic components to equipment is to attach the lead wire 2 to the seat 3 on an insulating material 1 such as a printed board, The connection between them is made using a joining material such as solder.

However, when installing these electrical and electronic components, the lead wires and mounting seats are generally minute, so in order to obtain a strong bond, precise adjustment and control of bonding conditions such as the amount of solder, heating temperature, and time are required. At the same time, inspection of the bonding condition is an essential requirement.

However, with the conventional mounting method as shown in Figure 1, the spacing between the joints is small due to the plate-shaped lead wires, and the structure is such that defective parts where solder does not adhere can easily occur inside the joints. Since the joints are minute, visual inspection of the joint state is difficult, and mechanical detection by applying an external force is difficult because there is no suitable holding part. There is.

The purpose of this invention is to solve these drawbacks by creating a lead wire for electrical and electronic components that can be attached in a direction away from the seat, thereby making it extremely easy to obtain a reliable connection. The purpose is to provide shape.

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 2 is a perspective view of the shape of the lead wire of the electrical and electronic component of the present invention, and FIG. 3 is a side sectional view of FIG. 2.

In these figures, the tip of the lead wire 2 of the electrical/electronic component 1 is bent in the direction away from the seat 3, and the lead wire 2 and the mounting are made using the soil removal space 5 as the introduction point for the solder 6. Solder 6 is flowed between the seats 3 and the lead wires 2 are attached and joined to the seats 3.

By providing a space 5 for supplying solder 6 that is continuous to the joint between the lead wire 2 and the seat 3, the supplied solder 6 flows in one direction due to capillary action, and flows into.

Therefore, a portion where the solder 6 is not filled is less likely to occur in the middle of the joint, and a good joint is formed over the entire joint.

Furthermore, since the bonded state of the solder 6 attached to the bent end portion of the lead wire 2 is several times larger than that on the side surface of the bonded portion, visual inspection is facilitated.

Furthermore, by making the bending dimensions appropriate, it becomes possible to hold that part and easily perform a tensile test.

As explained above, the present invention eliminates the causes of joint defects by making the flow of solder 6 in one direction, and furthermore, the soldering process can be easily inspected by visual inspection and tensile test after soldering. , has the advantage of significantly increasing the quality of the bond.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a conventional electrical and electronic component lead wire shape, FIG. 2 is a perspective view of an embodiment of the present invention, and FIG. 3 is a sectional view of an embodiment of the present invention. In the figure, 1...Electricity, electronic parts, 2...Lead wires, 3...Mounting seat, 4...Insulating material, 5... ...Space, 6...Solder.

Claims (1)

[Scope of utility model registration request] In the shape of a plurality of plate-shaped lead wires connected to electrical components mounted on a printed wiring board, the mounting provided on the same surface as the mounting surface of the electrical components on the printed wiring board is soldered to the seat. , wherein the plurality of plate-shaped lead wires are formed of a part parallel to the mounting seat and a tip part bent in a direction away from the printed wiring board and continuous with the parallel part. Part lead wire shape.