JPS6054271A - Supplying and joining device of molten solder of minute constant-quantity - Google Patents

Supplying and joining device of molten solder of minute constant-quantity

Info

Publication number
JPS6054271A
JPS6054271A JP16075683A JP16075683A JPS6054271A JP S6054271 A JPS6054271 A JP S6054271A JP 16075683 A JP16075683 A JP 16075683A JP 16075683 A JP16075683 A JP 16075683A JP S6054271 A JPS6054271 A JP S6054271A
Authority
JP
Japan
Prior art keywords
piston
cylinder
minute
molten solder
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16075683A
Other languages
Japanese (ja)
Inventor
Shinsuke Obara
伸介 小原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OHARA KINZOKU KOGYO KK
Original Assignee
OHARA KINZOKU KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OHARA KINZOKU KOGYO KK filed Critical OHARA KINZOKU KOGYO KK
Priority to JP16075683A priority Critical patent/JPS6054271A/en
Publication of JPS6054271A publication Critical patent/JPS6054271A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0607Solder feeding devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To execute exactly and efficiently a solder joining of a minute pattern in various apparatuses by providing a molten solder tank on the upper part of a minute inside diameter cylinder in a heater member, and moving a piston upward and downward against the cylinder. CONSTITUTION:A set of a minute inside diameter cylinder 1 and a piston 2 is provided on the inside of a heater part, a molten solder tank 4 is provided on the upper part of the cylinder 1, and the piston 2 is moved up and down by an operating cylinder. As a result, when the piston 2 is at the top dead center, a minute constant-quantity flows naturally into the upper part in the cylinder 1 by a capillary phenomenon due to a fact that the surface tension is large, and it is held by the tip when the piston 2 descends. This solder is supplied to a substrate or object joining parts, for instance, a parts lead wire 6.

Description

【発明の詳細な説明】 この発明は、基板或い#i目的接合部品の微細パターン
に微定量の溶融はんだを技術的原理梠成により供給され
て1部品と基板等とのはんだ接合を省力的1機能合理的
に0准えるようにした微定量溶融はんだ供給接合装@に
関するもので?)ゐ。
[Detailed Description of the Invention] This invention supplies a minute amount of molten solder to the fine pattern of a board or #i target joining part by the technical principle of layering, thereby saving labor in soldering a single part to a board, etc. 1. Is it related to a micro-quantity molten solder supply bonding device that can be reasonably prepared for zero functions? )ゐ.

従来、[:f−機器製品等製作においての轡細々パター
ンでの糺lんだ溶融による接合着作業は。
Conventionally, in the production of equipment products, etc., bonding work was carried out by welding in small patterns.

作業員がはんだ供給器?操作して手動にてηされていて
5供給爪の加減調整等も目測りtl?Lnければなら彦
い上に、微小部分への生業のこととて1作業むらが生じ
るだけてなく6作業時rlUのか\ることか欠点である
Is the worker using the solder feeder? Did you manually check the adjustment of the 5 supply claws by eye? In addition, when working on minute parts, not only is there unevenness in one work, but there is also a drawback that it is rlU during six works.

七こて1本発明は、上記のよう力欠点がkく。Seven trowels (1) The present invention has a number of power shortcomings as described above.

はんだ剤の性杖を巧みに活用し、微小接合部分への微定
量供給が機能合理的に行々え、同時に各種機器における
微細パターンにてのけんだ溶融接合着k jE確、能率
的にかつ確実に実施できるλ、うプハンドタイプのコン
パクトか微定量溶融けんだ供給装置を開発したものであ
るにの発明は、溶融はんだの表面張力穴による毛細管現
象、つまり溶融はんだが散剤η管内入目にtま、浮上性
状態にある僅かな時間における・そσ)現象を技術的原
理としたもので、前記せる極短時分での溶融はんだの性
状罠よる現象なl。
By skillfully utilizing the properties of the solder agent, it is possible to supply minute amounts to minute joints in a functional and rational manner, and at the same time, it is possible to accurately, efficiently and The invention of this invention is the development of a compact or micro-quantity molten solder supply device of the folded hand type that can be carried out reliably. The technical principle is the phenomenon that occurs during a short period of time when the solder is in a floating state, and is a phenomenon that is caused by the properties of the molten solder in the extremely short period of time described above.

シリンダー・ピストンの組に応用し、微小パターンでの
該溶融上んだの微定量供給を微妙に行がい、同時にはん
だ付けを反復して々L得られる原理構成でおることが特
色てめる。
It is characterized by its principle structure that can be applied to a cylinder-piston set, delicately supplying a minute amount of the molten material in a minute pattern, and at the same time repeating soldering to obtain a large quantity.

本発明の要旨とするとc;5ii、 微小内径シリンダ
ーとピストンのmeヒータ一部材内部に装備し、前記シ
リンダー上部に溶融けんだNgを設け、前記シリンダー
・ピストンの組を作動用シリンダーと結合して、ピスト
ンな」−下させることにより、溶融はんだの微定量が表
面張力穴による毛細管現象によりピストンが上死点時に
自然にシリンダー内上部に流れ込んだ溶融はんだ金ピス
トン降下時にその先端に保持されてそれが基板又は目的
接合部品に供給され、溶融接合てきるように構成してな
る点にるる。
The gist of the present invention is c; 5ii, a me-heater for a cylinder and a piston with a small internal diameter is installed inside the member, molten Ng is provided in the upper part of the cylinder, and the cylinder-piston set is connected to an operating cylinder. By lowering the piston, a small amount of molten solder naturally flows into the upper part of the cylinder when the piston is at top dead center due to capillary action caused by the surface tension hole.As the piston descends, it is held at the tip of the molten solder. is supplied to the substrate or the target component to be bonded, and is configured to perform melt bonding.

次に、第1図の2作業順序説明を葡ねた作動原理機構例
肉により説明する。
Next, an explanation will be given using an example of the operating principle and mechanism, which is based on the explanation of the two work sequences shown in FIG.

第1因罠おいて、(1)iま微小内ILシリンダー、(
,2)k′iピストンで、シリンダー(l)におけるピ
ストン(2)の嵌まシ部(3)の上端面がガイド部分と
なる。 (4t)はけんだm、(j)はクリー゛ニング
ノズル、(6)は部品リード(線)であって、(イ)は
ピストン(2)の停止時−歩(ロ)はtまんだ吸入時(
ピストン上死点、熔MBんだ保持→(ハ)はピストン(
,2)降下−+(ニ)#1供給O接合→(ホ〕はピスト
ン(J、)先端をクリーニング。→(イ)へ。
Considering the first cause trap, (1) Ima minute inner IL cylinder, (
, 2) In the k'i piston, the upper end surface of the fitting part (3) of the piston (2) in the cylinder (l) becomes the guide part. (4t) is the soldering m, (j) is the cleaning nozzle, (6) is the component lead (wire), (a) is when the piston (2) is stopped - the step (b) is t. During inhalation (
Piston top dead center, holding molten MB → (c) is piston (
, 2) Lowering - + (D) #1 supply O junction → (E) Cleans the tip of the piston (J,). → Go to (A).

の、技術的原理に基ずく作動によシ、微定量溶融はんだ
供給接合を機能合理的[9%施でさるものである。
The operation is based on a technical principle, and it is possible to supply a small amount of molten solder for joining in a functionally rational manner [9%].

従つ゛C1電子機2g品等製作工程1こかいての微小パ
ターンでの溶融はんブご付けを正鏑かつC上*的に行プ
えるので、各この種作朶面で実効性大iるものといえる
Therefore, since the process of manufacturing 2g C1 electronic products, etc., can be carried out using the molten solder in minute patterns, it is highly effective in various types of production. It can be said that

本発明の実施適用例は次のとかりである。Examples of practical application of the present invention are as follows.

l コンピューター基板のジャンパー線挟合。l Jumper wires on computer board.

2 基板上の微小ランドへの足又はんだ供給。2. Feeding feet or solder to minute lands on the board.

8 微小ランドへの過剰予鋪はんだ供給。8. Excessive pre-solder supply to minute lands.

4 各種目線動の微小四部底部のはんだ接合。4. Soldering of the bottom of the four microscopic parts of various eye movements.

11お、本発明は上記のとおりでるるか、従来仁の種溶
融接合を手作朶で行なわれ°〔いた仁とに比べての7#
′発明の実施成果は、第一図図表に示すとおりCめる。
11. The present invention is as described above, and compared to the conventional method in which seed fusion bonding of seeds was performed by hand.
'The results of implementing the invention are as shown in Figure 1.

なお。In addition.

幻■、θ、2φ (3u線 ハθ×へ〇 ランド はんだめつ@ On基板 方法 Cwi線を基板上に粘着テープを各する力どして
固定して、液体フラックス を塗布L&乾燥後、gO1(3〜ざO@Or−予熱はん
だ付けの順序で行ぬった。
Illusion ■, θ, 2φ (3u wire C θ gO1 (3~zaO@Or- Preheating soldering was performed in the order.

この発明は」−記のとおりであるから、各柚産業界、に
おhての微小部分へのけんだ接合について?4効性に冨
み、工業的価値六方るものてめる。
Since this invention is as described in "-," is it related to the solder joining of minute parts in each citrus industry? It is rich in four effects and has industrial value in all directions.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は作動順序を兼ねた本発明のfl:動原理機構例
図、第J図#′i夾施試験結果を示す図表である。 第 1 図 二 請求 図面の+i’l’+’(内容( 第 2 ?=1んfchk< 1〕+、7 ) イ■、(2)l
?ツノ1″ 変更なし) 図 j /Q /3 1に合11、r間C(’J・) 手続補正書動コ0 1、事件の表示 昭和夕3手持 許 願 第1乙。736号1g件とのR
Fk 特 館゛ 出願人 住所(居所) 7、補正の内容 l直置で勿っての毛1徒礁・+4 L
ゎ「つて、・「はjlQ定=3mノにての量的動向2示
・の関保全示す図表でめ」 (2) 図面の第氾図を別紙のとおり補正しiす。 8添伺°層木1グJ1 補正の第一図
FIG. 1 is a diagram showing an example of the fl:dynamic mechanism of the present invention, which also serves as an operating sequence, and FIG. 1st Figure 2 +i'l'+' of the requested drawing (Contents (2nd?=1nfchk<1]+, 7) I■, (2)l
? Horn 1'' No change) Figure J / Q / 3 1 to 11, r between C ('J.) Procedural amendment document 0 1, Indication of the case Showa Era 3 in hand Request for permission No. 1 B. No. 736 1g R with
Fk Special Hall゛ Applicant's address (residence) 7. Contents of amendment 1.
ゎ “Tsu,“ is “JLQ standard = 3m ot 3M no。。。。。。。。。。。。。。。。。。。 8 Attachment ° Layer 1 G J1 First diagram of correction

Claims (1)

【特許請求の範囲】[Claims] 微小内径シリンダーとピストンの組をヒータ一部材内部
に装備し、前記シリンダー・」:部にメ容lv4はんだ
槽を設け、前記シリンダー・ピストンの組を作動用シリ
ンダーと結合して、ピストンを上下させることにょシ、
溶融はんだの微定飛全1表面張力大による毛細管現象九
よりピストン窄上死点時に自然にシリンダー内上部に流
れ込んだT′!8FFA#iんだ會ピストン降下時妬そ
の先端に保持されてそれが基板又はト1的接合部品に供
給され、溶融接合できるように構成l、てなる仁とを特
徴とする微定i熔?1lAt、tんだ供給接合装置。
A combination of a small inner diameter cylinder and a piston is installed inside a heater member, a volume LV4 solder bath is provided in the cylinder part, and the cylinder and piston combination is combined with an operating cylinder to move the piston up and down. In particular,
Due to the capillary phenomenon due to the large surface tension, the molten solder naturally flowed into the upper part of the cylinder when the piston was constricted at top dead center.T'! 8FFA#i A micro-determined melting device characterized by a structure in which the piston is held at its tip when it is lowered, and it is supplied to a substrate or other parts to be melted and joined so that it can be melted. 1lAt, solder supply bonding equipment.
JP16075683A 1983-08-31 1983-08-31 Supplying and joining device of molten solder of minute constant-quantity Pending JPS6054271A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16075683A JPS6054271A (en) 1983-08-31 1983-08-31 Supplying and joining device of molten solder of minute constant-quantity

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16075683A JPS6054271A (en) 1983-08-31 1983-08-31 Supplying and joining device of molten solder of minute constant-quantity

Publications (1)

Publication Number Publication Date
JPS6054271A true JPS6054271A (en) 1985-03-28

Family

ID=15721781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16075683A Pending JPS6054271A (en) 1983-08-31 1983-08-31 Supplying and joining device of molten solder of minute constant-quantity

Country Status (1)

Country Link
JP (1) JPS6054271A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4837627U (en) * 1971-09-07 1973-05-08
JPS5492341A (en) * 1977-12-29 1979-07-21 Sharp Corp Liquid crystal display element

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4837627U (en) * 1971-09-07 1973-05-08
JPS5492341A (en) * 1977-12-29 1979-07-21 Sharp Corp Liquid crystal display element

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