JPS6050915A - Method of producing laminated solid electrolytic condenser - Google Patents
Method of producing laminated solid electrolytic condenserInfo
- Publication number
- JPS6050915A JPS6050915A JP15923983A JP15923983A JPS6050915A JP S6050915 A JPS6050915 A JP S6050915A JP 15923983 A JP15923983 A JP 15923983A JP 15923983 A JP15923983 A JP 15923983A JP S6050915 A JPS6050915 A JP S6050915A
- Authority
- JP
- Japan
- Prior art keywords
- insulating coating
- solid electrolytic
- coating film
- forming
- comb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は複数枚の櫛形電極箔を積層して作製した無極性
の積層形固体電解コンデンサの製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a nonpolar multilayer solid electrolytic capacitor manufactured by laminating a plurality of comb-shaped electrode foils.
従来の無極性電解コンデンサとしてはアルミ電解コンデ
ンサ素子あるいはクンタル固体電解コンデンサ素子ケ素
子毎に陽極・陰極欠作成し、陰極同志欠接続して構成し
ていたが、作成された素子欠測々に接続しあるいはケー
ス内で一方の電極のみゲ接続したりしていたが、所要容
量の2倍の素子欠得なければならず大形となる問題点が
あった。Conventional non-polar electrolytic capacitors were constructed by creating an anode and cathode missing for each element, such as an aluminum electrolytic capacitor element or a Kuntal solid electrolytic capacitor element, and connecting the cathodes with each other. Alternatively, only one electrode was connected to the other side within the case, but this had the problem of requiring an element with twice the required capacity, resulting in a large size.
またアルミ電解陽極箔火2枚スペーサ欠介して巻回しそ
れぞれの電極箔から引出端子部を設けて無極性電解コン
デンサヶ構成する方法もあるが、高価格な陽極箔ゲ2枚
巻回するものであり引出端子を陽・陰極箔に接続して引
出丁のに格別の注意力7要するなど、大形化、高価格化
となる欠点を有していた。There is also a method of constructing a non-polar electrolytic capacitor by winding two pieces of aluminum electrolytic anode foil with a spacer interposed and providing a lead-out terminal from each electrode foil, but this involves winding two pieces of expensive anode foil. The drawer terminals had to be connected to the anode and cathode foils and special care was required to draw out the drawers, resulting in large size and high price.
本発明は上記の点に鑑みなされたもので小形・薄形で低
価格な無極性の積層形固体電解コンデンサの製造方法を
提供するもので、アルミ、タンクである。以下実施例に
より説明する。第1図および第2図に示すようにQ、1
m厚のアルミ箔(1)欠公知の手段により粗面化したの
ち化成処理を行って酸化皮膜(2)火生成し、該アルミ
箔ゲ櫛形に打ち抜いて基部(3)および複数の歯(4)
ヲ設けた櫛形電極箔とする。または粗面死後櫛形に打ち
抜いて化成処理7行ってもよい。この櫛形電極箔の基部
(3)から歯(4)の根元に若干わたるようにシリコー
ン、ポリアミド、弗素系樹脂などの耐熱性絶縁塗料欠塗
布して絶縁塗膜(5)を形成し、これ欠硝酸マンガン溶
液に浸漬したのち引き上げて2500中で7分間焼成し
て二酸化マンガン層(6)などの半導体層乞生成するが
、焼成によって破壊された前記酸化皮膜(2)を修復す
るために再化成火付う。この硝酸マンガン溶液への浸漬
−焼成−再化成ゲ数回繰り返して所望の二酸化マンガン
層(6)欠得ろ。このようにして二酸化々ンガン層(6
)ヲ生成した櫛形電極箔の歯(4)の部分をカーボンブ
ランクまたはカーボングラファイト懸濁液に浸漬してカ
ーボン欠付着させろ。この状態の櫛形電極箔化第3図に
示すように前記絶縁塗膜(5)同志または該絶縁塗膜(
5)上にさらに塗膜ケ形成した部分が重なり合うように
、かつ基部(3)が対向するよう歯(4)火交互に重ね
合せて積層したのち乾燥−焼付してカーボン層(7)を
形成するとともに積層された前記絶縁塗膜(5)または
該絶縁塗膜(5)上の塗膜ケ接着せしめて一体化する。The present invention has been made in view of the above points, and provides a method for manufacturing a non-polar multilayer solid electrolytic capacitor that is small, thin, and inexpensive, and is an aluminum tank. This will be explained below using examples. As shown in Figures 1 and 2, Q, 1
After roughening the surface of aluminum foil (1) with a thickness of m by known means, a chemical conversion treatment is performed to form an oxide film (2), and the aluminum foil is punched into a comb shape to form a base (3) and a plurality of teeth (4). )
A comb-shaped electrode foil is provided. Alternatively, the chemical conversion treatment 7 may be performed by punching out a comb shape after the rough surface is finished. An insulating coating film (5) is formed by applying a heat-resistant insulating coating such as silicone, polyamide, or fluorine-based resin so as to extend slightly from the base (3) of the comb-shaped electrode foil to the roots of the teeth (4). After being immersed in a manganese nitrate solution, it is pulled up and fired for 7 minutes at 2500°C to form a semiconductor layer such as a manganese dioxide layer (6). It catches fire. The desired manganese dioxide layer (6) is removed by repeating immersion in the manganese nitrate solution, calcination, and reconversion several times. In this way, the carbon dioxide layer (6
)) Dip the teeth (4) of the comb-shaped electrode foil produced into a carbon blank or carbon graphite suspension to eliminate carbon adhesion. In this state, the comb-shaped electrode foil is formed.As shown in FIG.
5) Laminate the teeth (4) alternately so that the coated parts overlap and the bases (3) face each other, and then dry and bake to form the carbon layer (7). At the same time, the laminated insulating coating film (5) or the coating film on the insulating coating film (5) is bonded and integrated.
この積層された櫛形電極箔の前記絶縁塗膜(5)で区分
されたそれぞれの基部(3)の両端に導電性塗料欠塗布
して引出端子電極部+81 +91とする。このように
して一体化され、対向している一方または両方の基部(
3)欠歯(4)の幅に沿って切断し、第4図の如(一方
の基部(4)欠共通端子(10)とし、切断された他方
ケそれぞれの端子(11)とした構造、または第5図の
如く両方の基部(3)欠歯(4)の幅に沿って切断して
端子(20)とした構造の無極性の積層形固体電解コン
デンサを得ろことができる。Conductive paint is applied to both ends of each base portion (3) of the laminated comb-shaped electrode foil separated by the insulating coating film (5) to form lead terminal electrode portions +81 to +91. In this way, one or both opposing bases (
3) Cut along the width of the missing tooth (4) to form a missing common terminal (10) on one base (4) and a terminal (11) on each of the other cut pieces as shown in Figure 4, Alternatively, as shown in FIG. 5, it is possible to obtain a nonpolar multilayer solid electrolytic capacitor having a structure in which terminals (20) are formed by cutting along the width of both the base (3) and the missing teeth (4).
本発明は以上のように構成されろものであるから電極欠
櫛形にすることによって複数のコンデンサ乞容易に積層
により得ることができ、かつ基部(3)に絶縁塗膜(5
)欠設け、該絶縁塗膜(5)火重ねろように積層・接着
するためカーボンが引出端子電極部(8) +91に浸
入することがなく、コンデンサを形成する歯(4)の積
層部分と引出端子電極部t81(9)と完全に区分され
絶縁不良となることがない。また素子の構成手段として
巻回などの方法を採用しないので巻回によるストレス2
受けず酸化皮膜の破壊がなく安定した特性のコンデンサ
欠得ることができる。さらに第5図の如く構成したもの
は無極性のチップコンデンサとして使用できるので基板
への実装に際し極性ケ確認する必要がないから装填作業
化能率的に行うことができる、
なお上記実施例ではアルミ箔を用いた場合について述べ
たがタンタル、ニオブ、チタンなどの弁作用金属を用い
てもよく、また二酸化マンガン層に代えて有機半導体た
とえばN−ノルマルプロビールキノリン−TCNQ塩や
N−イノプロビールキノリン−TCNQ塩、)チルキ/
IJ y−T CNQ塩、エチルキノリy−TCNQ
塩、’r: T、 F −T CNQ塩などを用いても
よい。Since the present invention is constructed as described above, it is possible to easily obtain a plurality of capacitors by laminating them by making the electrodes interdigitated, and the insulating coating (5) is provided on the base (3).
) is not provided, and the insulating coating (5) is laminated and bonded in a fire-like manner, so that carbon does not enter the lead terminal electrode part (8) +91, and the laminated part of the tooth (4) forming the capacitor. It is completely separated from the lead-out terminal electrode portion t81(9) and no insulation defects occur. In addition, since methods such as winding are not used as a means of constructing the element, the stress caused by winding is 2.
Therefore, it is possible to obtain a capacitor with stable characteristics without damage to the oxide film. Furthermore, since the capacitor configured as shown in Figure 5 can be used as a non-polar chip capacitor, there is no need to check the polarity when mounting it on the board, so the loading process can be carried out more efficiently. In the above description, valve metals such as tantalum, niobium, and titanium may be used, and instead of the manganese dioxide layer, organic semiconductors such as N-normalprobylquinoline-TCNQ salt and N-inoprobylquinoline may be used. -TCNQ salt, ) Chirki/
IJ y-T CNQ salt, ethylquinoly-TCNQ
salt, 'r:T, F-T CNQ salt, etc. may also be used.
図面はいずれも本発明の実施例ケ示すもので、第1図は
アルミ箔の側断面図、第2図はアルミ箔の平面図、第3
図はアルミ箔を積層した状態火水す側断面図、第4図は
一方の基部火切断した積層形固体電解コンデンサを示す
斜視図、第5図は両方の基部ケ切断した積層形固体電解
コンテンサの他の実施例ケ示す斜視図である。
(1)・・・・・アルミ箔 (2)・・・・・酸化皮膜
(3)・・・・・基部 (4)・・・・・歯 (5)・
・・・・絶縁塗膜(6)・・・・・二酸化マンガン層
(7)・・・・・カーボン層(81(91・・・・・引
出端子電極部(10)・・・・・共通端子
(11)(20)・・・・・端子
特許出願人
マルコン電子株式会社
国見電子株式会社The drawings all show embodiments of the present invention; Fig. 1 is a side sectional view of the aluminum foil, Fig. 2 is a plan view of the aluminum foil, and Fig. 3 is a plan view of the aluminum foil.
The figure shows a side sectional view of laminated aluminum foil, Figure 4 is a perspective view of a laminated solid electrolytic capacitor with one base cut off, and Figure 5 shows a laminated solid electrolytic capacitor with both bases cut off. FIG. 7 is a perspective view showing another embodiment of the invention. (1)...Aluminum foil (2)...Oxide film (3)...Base (4)...Teeth (5)...
...Insulating coating film (6) ...Manganese dioxide layer
(7)...Carbon layer (81 (91...Output terminal electrode part (10)...Common terminal (11) (20)...Terminal patent applicant Marcon Electronics Kunimi Electronics Co., Ltd.
Claims (3)
に絶縁塗膜を形成する工程と、前記櫛形電極箔の歯に半
導体層欠形成する工程と、該半導体層上にカーボンブラ
ックまたはカーボングラファイト懸濁液を塗布する工程
と、該工程ののちに前記絶縁塗膜同志が重なり、かづ基
部が対向するように前記櫛形電極箔を交互に積層したの
ち前記絶縁塗膜同志着する工程と、前記基部の両端に引
出端子電極部火形成する工程と、前記基部を歯幅に活っ
て切断する工程とを具備した積層形固体電解コンデンサ
の製造方法。(1) A step of forming an insulating coating film on both sides of the bases and roots of the teeth of a plurality of comb-shaped electrode foils, a step of forming a semiconductor layer on the teeth of the comb-shaped electrode foils, and a step of forming a semiconductor layer on the semiconductor layer with carbon black or a step of applying a carbon graphite suspension, and a step of laminating the comb-shaped electrode foils alternately so that the insulating coating films overlap each other and the bases thereof face each other, and then attaching the insulating coating films to each other. A method for manufacturing a multilayer solid electrolytic capacitor, comprising the steps of: forming lead terminal electrodes on both ends of the base; and cutting the base to a tooth width.
のからなることを特徴とする特許請求の範囲第(1)項
記載の積層形固体電解コンデンサの製造方法。(2) The method for manufacturing a multilayer solid electrolytic capacitor according to claim (1), wherein the insulating coating film is formed by further forming a missing coating on the insulating coating film.
する特許請求の範囲第(1)項または第(21項記載の
積層形固体電解コンデンサの製造方法。 (41基部の切断が一方または両方の基部欠切断するこ
とを特徴とする特許請求の範囲第(1)項〜第(3)項
のいずれかに記載の積層形固体電解コンテンノサの製造
方法。(3) A method for manufacturing a multilayer solid electrolytic capacitor according to claim 1 or claim 21, characterized in that the method is carried out by heating the insulating coating film in a non-adhesive manner. A method for manufacturing a laminated solid electrolytic content according to any one of claims (1) to (3), characterized in that both bases are cut off.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15923983A JPS6050915A (en) | 1983-08-30 | 1983-08-30 | Method of producing laminated solid electrolytic condenser |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15923983A JPS6050915A (en) | 1983-08-30 | 1983-08-30 | Method of producing laminated solid electrolytic condenser |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6050915A true JPS6050915A (en) | 1985-03-22 |
Family
ID=15689381
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15923983A Pending JPS6050915A (en) | 1983-08-30 | 1983-08-30 | Method of producing laminated solid electrolytic condenser |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6050915A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01175223A (en) * | 1987-12-28 | 1989-07-11 | Nitsuko Corp | Laminated solid electrolytic capacitor |
US7929273B2 (en) * | 2005-01-24 | 2011-04-19 | Panasonic Corporation | Chip type solid electrolytic capacitor |
-
1983
- 1983-08-30 JP JP15923983A patent/JPS6050915A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01175223A (en) * | 1987-12-28 | 1989-07-11 | Nitsuko Corp | Laminated solid electrolytic capacitor |
US7929273B2 (en) * | 2005-01-24 | 2011-04-19 | Panasonic Corporation | Chip type solid electrolytic capacitor |
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