JPS6050513A - Liquid crystal display device - Google Patents
Liquid crystal display deviceInfo
- Publication number
- JPS6050513A JPS6050513A JP15841283A JP15841283A JPS6050513A JP S6050513 A JPS6050513 A JP S6050513A JP 15841283 A JP15841283 A JP 15841283A JP 15841283 A JP15841283 A JP 15841283A JP S6050513 A JPS6050513 A JP S6050513A
- Authority
- JP
- Japan
- Prior art keywords
- type lead
- fitting part
- substrate
- liquid crystal
- clip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Liquid Crystal (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は液晶表示装置の接続に関するものであり、更に
はクリップ型リードピンの部材及び嵌合方法の改良に関
するものでるる。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a connection for a liquid crystal display device, and further relates to an improvement in a member of a clip-type lead pin and a fitting method.
低１圧、低消費電力という特長をもつ液晶表示素子は、
当初はその特長をいかして携帯用機器であるウォッチや
電卓といった表示容量の小さい表示デバイスに多く用い
られてきた。しかるに近年になって液晶材料の改良が進
み、低電圧、低消費電力の特長を残しながら高時分割駆
動が可能な液晶材が開発され、ｌ／３２〜１／６４デユ
ーテイの時分割駆動によるドツト表示デバイスが工夫さ
れるようになり、α−二二一メリックのみならず漢字表
示がＯＴ能である液晶表示装置が具体化石れつつある。The liquid crystal display element has the features of low voltage and low power consumption.
Initially, it was widely used in display devices with small display capacity, such as portable devices such as watches and calculators, due to its characteristics. However, in recent years, improvements have been made in liquid crystal materials, and liquid crystal materials that are capable of high time division driving while retaining the features of low voltage and low power consumption have been developed. As display devices have become more sophisticated, liquid crystal display devices capable of displaying not only α-221 merrick characters but also kanji characters are becoming increasingly popular.
表示容量がこのように多くなってくると、それにともな
ってリード端子の接続が周辺技術の問題として新たに発
生してくる・
従来、このような液晶表示装置の脱続には導電性ゴムや
クリップ型リードピンが用いられるコトが多い。導電性
ゴムによる方法は取付が容易である反面、クリップ型リ
ードピンによる方法にくらべると信頼性が低く、特に自
動車等のように振動の多い所に液晶表示装置を搭載する
場合には適当ではない。As the display capacity increases, the connection of lead terminals becomes a new problem in peripheral technology. Conventionally, conductive rubber or clips were used to connect and disconnect such liquid crystal display devices. Type lead pins are often used. Although the method using conductive rubber is easy to install, it is less reliable than the method using clip-type lead pins, and is not suitable especially when the liquid crystal display device is mounted in a place where there is a lot of vibration, such as in a car.
第１図は従来行なわれているクリップ型リードピンＰＣ
よる方法を説明する液晶表示装ｄの断面図である。液晶
パネルの一方の基板ｌの上に形成されたＸ父はＹ電極の
リード端子２はクリップ型リードビン３の嵌合部４によ
ってはさみ込まれ、リード端子２とクリップ型リードビ
ン３は電気的に接続される。この状態では基［１とクリ
ップ型リードビン３との開音保持する刀は嵌合部４の弾
力だけで１強度的に不十分で必るので、シリコンゴム等
のモールド材５によ！１１嵌−８一部４の１部又は全体
をモールドし基板ｌとクリップ型リードビン３を一体化
する。係るクリップ型リードビンによる電気的接続で重
要な点は嵌合部４０弾力が一定以上につよく嵌合部４が
リード端子２を弾性的に強く押え込むことで必る。しか
るにこの弾性方抑圧による接続のため従来のクリップ型
リードビンによる方法はクリップ型リードビンの取り付
けが容易ではなかった。当然の事であるが取り付は前の
クリップ型リードビンの嵌合部の間隔は基板の厚さより
小さくクリップ型リードビンを取り付けるに際して、こ
の間隔を押し広げるようにして基板を嵌合部に押し込む
必要がある。一連のクリップ型リードビンを位置合せし
つつ、リード端子部に嵌合させる接続技術は熟練を要し
、又基板端面が欠は落ちる不具合が発生する場合もあり
、クリップ型リードビン取り付は作業は非常に非能率的
であった。Figure 1 shows a conventional clip-type lead pin PC.
FIG. 3 is a cross-sectional view of a liquid crystal display device d for explaining a method according to the present invention. The lead terminals 2 of the X and Y electrodes formed on one substrate l of the liquid crystal panel are sandwiched between the fitting parts 4 of the clip-type lead bins 3, and the lead terminals 2 and the clip-type lead bins 3 are electrically connected. be done. In this state, the elasticity of the fitting part 4 alone is insufficient in terms of strength to hold the base 1 and the clip-type lead bin 3 open, so it is necessary to use a molding material 5 such as silicone rubber. Part 11 or the whole part 4 is molded to integrate the board 1 and the clip-type lead bin 3. An important point in electrical connection using such a clip-type lead bin is that the elasticity of the fitting part 40 is strong above a certain level so that the fitting part 4 strongly presses down the lead terminal 2 elastically. However, because of the connection based on elastic compression, it was not easy to attach the clip-type lead bin using the conventional method using the clip-type lead bin. Of course, during installation, the gap between the fitting parts of the previous clip-type lead bin is smaller than the thickness of the board, and when installing the clip-type lead bin, it is necessary to widen this gap and push the board into the fitting part. be. The connection technique of aligning a series of clip-type lead bins and fitting them to the lead terminals requires skill, and the problem of chipping or falling off the edge of the board may occur, so attaching clip-type lead bins is extremely difficult. It was inefficient.
本発明は上述の従来のクリツノ型リードビンによる接続
方法の欠点を除去し、容易でかつ確実なりリップ型リー
ドビンによる接続方法を有する液晶表示装置を提供する
ことである。An object of the present invention is to provide a liquid crystal display device which eliminates the drawbacks of the above-mentioned conventional connection method using a lip-type lead bin, and which has an easy and reliable connection method using a lip-type lead bin.
本発明によれば液晶パネルの基板上に形成されたリード
端子と、該リード端子を嵌合してなるクリップ型リード
ビンをそなえた液晶表示装置において、上記クリップ型
リードビンの嵌合部が形状記憶合金であることを特徴と
する液晶表示装置かえられる。According to the present invention, in a liquid crystal display device including lead terminals formed on a substrate of a liquid crystal panel and a clip-type lead bin formed by fitting the lead terminals, the fitting portion of the clip-type lead bin is made of a shape memory alloy. A liquid crystal display device characterized by:
以下実施例によシ本発明を説明する・
第２図は本発明の実施例であって、クリップ型リードビ
ン］１が基板１２上に形成されたＸ及びＹ電極のリード
端子部１３に嵌合される直前の様子を示す断面図である
。クリップ型リードビン１１の嵌合部１４は形状記憶合
金で形成されてる。ここでいう形状記憶合金とｉ’ｊ：
Ｔｕ−Ｎｉ合金が代表的であって、塑性変形する前の形
状を記憶していて、変形を起したときの温度より僅かに
高い温度、例えば４０〜６０℃高い温度に加熱するだけ
で変形前の形に復帰するという性質をもつ合金である記
憶させる形状は合金のいわゆる母相の状態で形成すれば
よく、塑性変形はマルテンサイト変形を起す状態で行な
えばよい◎上記クリップ型リードピン１１の嵌合部１４
は母相状態で間隙１５が基板１２の厚さより若干小さく
なるように形成してあり、この状態では基板１２は嵌合
部１４の間隙１５には入らない。該嵌合部】４をマルテ
ンサイト変形を起す状態、通常は常温付近で基板】２の
厚みより十分広くなる間隙１５を押し広げ、塑性変形を
つくっておく。この状態が第２図の通りである。嵌合部
１４の間隙１５は基板１２の厚みより十分広くとっであ
るので、当然基板１２は嵌合部１４に容易に、挿入でき
、しかも位置合せｉｄ簡単である。The present invention will be described below with reference to examples. FIG. 2 shows an example of the present invention, in which a clip-type lead bin] 1 is fitted into lead terminal portions 13 of X and Y electrodes formed on a substrate 12. FIG. The fitting portion 14 of the clip-type lead bin 11 is made of a shape memory alloy. Shape memory alloy and i'j here:
Tu-Ni alloy is a typical example, and it remembers its shape before being plastically deformed, so it can be changed just by heating it to a temperature slightly higher than the temperature at which deformation occurs, for example, by 40 to 60 degrees Celsius. The memorized shape, which is an alloy that has the property of returning to the shape of the alloy, can be formed in the so-called matrix state of the alloy, and the plastic deformation can be performed in a state that causes martensitic deformation. ◎ Fitting of the clip-type lead pin 11 Joint part 14
is formed so that the gap 15 is slightly smaller than the thickness of the substrate 12 in the matrix state, and in this state, the substrate 12 does not enter the gap 15 of the fitting part 14. The mating portion [4] is in a state where martensitic deformation occurs, usually at room temperature, and the gap 15, which is sufficiently wider than the thickness of the substrate [2], is pushed out to create plastic deformation. This state is shown in FIG. Since the gap 15 of the fitting part 14 is sufficiently wider than the thickness of the substrate 12, the substrate 12 can naturally be easily inserted into the fitting part 14, and alignment is easy.
この状態でクリップ型リードビン１１の塑合部１４の温
度を約５０℃上昇させれば、嵌合部１４は塑性変形以前
の形状すなわち、間隙１５が基板１２の厚みより小さい
形状をとりもどし、その結果、嵌合部は基板１２をしっ
かり締めつける形となりクリップ型リードビン１１と液
晶パネルは一体化される。従来のごとくこの上からモー
ルド材をほどこせばなお一層完全である。If the temperature of the plastic fitting part 14 of the clip-type lead bin 11 is raised by about 50°C in this state, the fitting part 14 will regain its shape before plastic deformation, that is, the shape in which the gap 15 is smaller than the thickness of the substrate 12, and as a result, The fitting portion firmly tightens the substrate 12, and the clip-type lead bin 11 and the liquid crystal panel are integrated. If you apply molding material over this as in the past, it will be even more complete.
以上の実施例から明らかなように本発明によればクリッ
プ型リードビンの嵌合部を形状記憶合金で形成すること
により、クリップ型リードビンの取付けが非常に簡単に
なり、しかも、取付後はいわゆる焼ばめと同様に固定さ
れたクリップ型り一ドビンを有する液晶表示装置を提供
するものである。As is clear from the above embodiments, according to the present invention, by forming the fitting part of the clip-type lead bin with a shape memory alloy, the attachment of the clip-type lead bin becomes very easy. The present invention provides a liquid crystal display device having a clip-type dowel that is fixed in a manner similar to a fit.
第」図は従来例によるクリップ型リードビンの取り付を
示す断面図、第２図は本発明によるクリップ型リードビ
ンの取シ付の様子を示す断面図である。
図中、１．１２・・・・・・電極基板、３，１】・・・
・・・りリップ型リードビン、２，１３・・・・・・リ
ード端子、４，１４・・・・・・嵌合部。Fig. 2 is a sectional view showing how a clip-type lead bin is attached according to a conventional example, and Fig. 2 is a sectional view showing how a clip-type lead bin is attached according to the present invention. In the figure, 1.12...electrode substrate, 3,1]...
...Rip type lead bin, 2, 13... Lead terminal, 4, 14... Fitting part.
Claims (1)
ド端子と、該リード端子を嵌合してなるクリップ型リー
ドピンをそなえた液晶表示装置において、上記クリップ
型リードピンの少なくとも嵌合部が形状記憶合金である
ことを特徴とする液晶表示装置。In a liquid crystal display device comprising a lead terminal formed on at least one substrate of a liquid crystal panel and a clip-type lead pin formed by fitting the lead terminal, at least the fitting portion of the clip-type lead pin is made of a shape memory alloy. A liquid crystal display device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15841283A JPS6050513A (en) | 1983-08-30 | 1983-08-30 | Liquid crystal display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15841283A JPS6050513A (en) | 1983-08-30 | 1983-08-30 | Liquid crystal display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6050513A true JPS6050513A (en) | 1985-03-20 |
Family
ID=15671187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15841283A Pending JPS6050513A (en) | 1983-08-30 | 1983-08-30 | Liquid crystal display device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6050513A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5142644A (en) * | 1991-03-08 | 1992-08-25 | General Motors Corporation | Electrical contacts for polymer dispersed liquid crystal films |
| JP2008167114A (en) * | 2006-12-28 | 2008-07-17 | Japan Radio Co Ltd | Dual reflector antenna |
| CN108020944A (en) * | 2016-10-31 | 2018-05-11 | 乐金显示有限公司 | Supporting frame and the display device including supporting frame |
| EP3211227A4 (en) * | 2014-10-10 | 2018-10-24 | SMK Corporation | Drive device and mounting structure thereof |
-
1983
- 1983-08-30 JP JP15841283A patent/JPS6050513A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5142644A (en) * | 1991-03-08 | 1992-08-25 | General Motors Corporation | Electrical contacts for polymer dispersed liquid crystal films |
| JP2008167114A (en) * | 2006-12-28 | 2008-07-17 | Japan Radio Co Ltd | Dual reflector antenna |
| EP3211227A4 (en) * | 2014-10-10 | 2018-10-24 | SMK Corporation | Drive device and mounting structure thereof |
| CN108020944A (en) * | 2016-10-31 | 2018-05-11 | 乐金显示有限公司 | Supporting frame and the display device including supporting frame |
| US11390053B2 (en) | 2016-10-31 | 2022-07-19 | Lg Display Co., Ltd. | Supporting frame and display device including the same |
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