JPS6046769B2 - Method of manufacturing electrical contacts - Google Patents
Method of manufacturing electrical contactsInfo
- Publication number
- JPS6046769B2 JPS6046769B2 JP14791877A JP14791877A JPS6046769B2 JP S6046769 B2 JPS6046769 B2 JP S6046769B2 JP 14791877 A JP14791877 A JP 14791877A JP 14791877 A JP14791877 A JP 14791877A JP S6046769 B2 JPS6046769 B2 JP S6046769B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- heat treatment
- manufacturing
- electrical contacts
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Manufacture Of Switches (AREA)
- Contacts (AREA)
Description
【発明の詳細な説明】
本発明は、Ａｕめつきを施したＡｇ又はＡｇ合金電気接
点の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing an Au-plated Ag or Ag alloy electrical contact.
従来、Ａｕめつきを施したＡｇ又はＡｇ合金電気接点（
以下単に接点と云う）は、Ａｇの硫化を防止して接触抵
抗を低く安定させ、同時に耐粘着性を損わせない為に、
Ａｕめつきで得られた硬い状態のまま使用していた。Conventionally, Ag or Ag alloy electrical contacts with Au plating (
(hereinafter simply referred to as contacts), in order to prevent sulfurization of Ag, keep contact resistance low and stable, and at the same time not impair adhesive resistance.
It was used in the hard state obtained by Au plating.
然し乍ら、Ａｕめつきにはピンホールが存在する為に徐
々にではあるが、ピンホールから硫化〜が発生しＡｕめ
つき面上に這い上り、その為不使用状態が長期間にわた
ると、接点表面に這い上つて来た硫化Ａｇによつて接触
抵抗が増大し、時々、開閉開始時の開閉回路の動作が不
安定になる欠点があつた。However, since there are pinholes in the Au plating, sulfurization gradually occurs from the pinholes and climbs onto the Au plating surface, and if it is not used for a long period of time, the contact surface will deteriorate. The contact resistance increases due to the Ag sulfide that has climbed up, and this sometimes causes the operation of the switching circuit to become unstable at the start of switching.
本発明は、上記欠点に解消せんが為に成されたもので、
耐硫化性に優れ且つ前記従来の接点と同様の耐粘着性Ａ
ｕめつき層を表面に有する接点の製造方法を提供せんと
するものである。The present invention was made in order to solve the above-mentioned drawbacks.
Excellent sulfidation resistance and adhesion resistance A similar to that of the conventional contacts
It is an object of the present invention to provide a method for manufacturing a contact having a U-plating layer on its surface.
本発明は、Ａｇ又は〜基合金にＡｕめつきを施し、これ
を熱処理することによりＡｇ又はＡ嗟合金とＡｕめつき
層との相互拡散を起させると同時にピンホールを塞いで
、耐硫化性を向上させ、更にＡｕめつきを施して従来の
接点と同様の耐粘着性を有するＡｕめつき層を接点表面
に形成する接点の製造方法である。The present invention provides Au plating on Ag or A-based alloy and heat-treats it to cause mutual diffusion between Ag or A-based alloy and the Au plating layer, and at the same time closes pinholes and improves sulfidation resistance. This is a method for manufacturing a contact in which the contact surface is improved and further Au plating is applied to form an Au plating layer on the contact surface that has the same anti-adhesive properties as conventional contacts.
本発明の製造方法に於いては、熱処理前のＡｕめつきの
厚さを０．５μｍ以上にすることが好適で、０．５μｍ
未満では熱処理でピンホールを十分塞ぐことができない
ものである。In the manufacturing method of the present invention, it is preferable that the thickness of the Au plating before heat treatment is 0.5 μm or more, and 0.5 μm or more.
If it is less than that, the pinholes cannot be sufficiently closed by heat treatment.
また熱処理後のＡｕめつきの厚さを０．３μｍ以上にす
ることが好適で、０．３μｍ未満では熱処理時に粗れた
面が平滑になるまでに至らないものである。更に熱処理
温度を１５０゜Ｃ乃至Ａｇ又はＡｇ基合金の融点の範囲
にすることが好適で、１５０℃未満では熱処理に時間が
かかり過ぎ、Ａｇ５ｌは〜基合金の融点を超える・と接
点もろともに溶けてしまうものである。以下本発明によ
る製造方法の効果を明瞭ならしめる為にその具体的な実
施例と従来例について述べる。実施例 １
ＡｇにＡｕを１．５μｍ湿式めつきした後、真空中で３
００℃、２時間熱処理し、更にＡｕを１μｍ湿式めつき
して接点を得た。Further, it is preferable that the thickness of the Au plating after heat treatment is 0.3 μm or more; if it is less than 0.3 μm, the surface roughened during heat treatment will not become smooth. Furthermore, it is preferable to keep the heat treatment temperature within the range of 150°C to the melting point of Ag or Ag-based alloy; if it is less than 150°C, the heat treatment will take too much time, and if Ag51 exceeds the melting point of the base alloy, both the contact points will melt. It is something that will happen. In order to clarify the effects of the manufacturing method according to the present invention, specific examples and conventional examples will be described below. Example 1 After wet plating 1.5 μm of Au on Ag,
After heat treatment at 00° C. for 2 hours, a contact point was obtained by wet plating with Au to a thickness of 1 μm.
実施例 ２
Ａｇ−ＣｄＯｌ２Ｗ／ｏにＡｕを２μｍ湿式めつきした
後、大気中て５００℃，３扮間熱処理し、更にＡｕを１
．５μｍ湿式めつきして接点を得た。Example 2 After wet-plating 2 μm of Au onto Ag-CdOl2W/o, heat treatment was performed at 500°C for 3 days in the air, and then 1 layer of Au was applied.
．． Contacts were obtained by wet plating to a thickness of 5 μm.
従来例１ 〜にＡｕを３μｍ湿式めつきして接点を得た。Conventional example 1 Contacts were obtained by wet plating Au to 3 μm thick.
従来例２Ａｇ−ＣｄＯｌ２Ｗ／ｏにＡｕを４μｍ湿式め
つきして接点を得た。これら実施例１，２及び従来例１
，２の接点各１（１）個につき、大気中で３ケ月間曝露
テストしたところ下表の右欄に示すような結果を得た。Conventional Example 2 A contact point was obtained by wet plating 4 μm of Au onto Ag-CdOl2W/o. These Examples 1 and 2 and Conventional Example 1
, 2 contacts were subjected to an exposure test for 3 months in the atmosphere, and the results shown in the right column of the table below were obtained.
Claims (1)
に熱処理を施し、次いでＡｕめつきを施すことを特徴と
する電気接点の製造方法。 ２ 熱処理前のＡｕめつき厚を０．５μｍ以上とし、熱
処理後のＡｕめつき厚を０．３μｍ以上とすることを特
徴とする特許請求の範囲第１項記載の電気接点の製造方
法。 ３ 熱処理温度を１５０℃乃至Ａｇ又はＡｇ基合金の融
点の範囲とすることを特徴とする特許請求の範囲第１項
記載の電気接点の製造方法。[Scope of Claims] 1. A method for manufacturing an electrical contact, which comprises applying Au plating to Ag or an Ag-based alloy, then heat-treating the same, and then applying Au plating. 2. The method of manufacturing an electrical contact according to claim 1, wherein the Au plating thickness before heat treatment is 0.5 μm or more, and the Au plating thickness after heat treatment is 0.3 μm or more. 3. The method of manufacturing an electrical contact according to claim 1, wherein the heat treatment temperature is in the range of 150° C. to the melting point of Ag or an Ag-based alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14791877A JPS6046769B2 (en) | 1977-12-09 | 1977-12-09 | Method of manufacturing electrical contacts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14791877A JPS6046769B2 (en) | 1977-12-09 | 1977-12-09 | Method of manufacturing electrical contacts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5480556A JPS5480556A (en) | 1979-06-27 |
| JPS6046769B2 true JPS6046769B2 (en) | 1985-10-17 |
Family
ID=15441031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14791877A Expired JPS6046769B2 (en) | 1977-12-09 | 1977-12-09 | Method of manufacturing electrical contacts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6046769B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH031351Y2 (en) * | 1984-01-30 | 1991-01-16 |
-
1977
- 1977-12-09 JP JP14791877A patent/JPS6046769B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH031351Y2 (en) * | 1984-01-30 | 1991-01-16 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5480556A (en) | 1979-06-27 |
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