JPS6046472A - Testing method of chip carrier type ic - Google Patents

Abstract

PURPOSE:To prevent damage to be inflicted on input/output terminals of an IC by using an auxiliary testing device consisting of a guide which slides in fitting in a device printed board and a cursor having a pin which moves orthogonally in being attached to the guide and abuts on a terminal. CONSTITUTION:Guide grooves 19 formed at both end parts of the lateral view channel type guide 16 are inserted both side edges of the printed substrate 2 of the device printed board. The cursor 17 fitted slidably at right angles to the sliding direction of the guide 16 and guide 16 are slid on the chip carrier type IC3 to be tested so that the tip of the probe pin 18 provided to the cursor 17 is pressed against the input/output terminal of the IC3 and the connection part of the printed board pattern 6, thus connecting a test circuit.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a method for testing a chip carrier type IC mounted on a substrate such as a printed circuit board.

(b) Technical Background and Problems In recent years, there are many devices in which a chip carrier type IC is mounted on a printed circuit board or the like to constitute a device printed board, and this device printed board is inserted in parallel on a shelf.

In FIG. 1, (a) is a perspective view and (b) is a sectional view of the apparatus printed board.

In the figure, an apparatus printed board 1 is constructed by mounting a chip carrier type IC 3 on the surface of a printed board 2. As shown in FIG. A printed board connector 4 is attached to one side edge of the printed board 2 so that it can be inserted into a bank board connector arranged in parallel on the back board of the shelf.

The chip gear rear type IC 3 is mounted on the printed circuit board 2 by soldering the input/output terminals 5 led out to the outer periphery of the rectangular carrier 3a to the respective printed board patterns 6 of the printed circuit board 2.

To test the circuit operation, signal characteristics, etc. of these chip carrier type IC3, each chip carrier type I
The input/output terminal 5 portion of C3 must be connected to a test device (not shown).

Therefore, it is necessary to mechanically test the device Print &1 with it removed from the shelf, and electrically with it connected to the bank board of the shelf.

FIG. 2 is a perspective view showing the printed board test device, in which the upper and lower plates of the shelf 7 are opposed to the device printed board 1.
A guide groove is formed to guide the device printed board 1 when the device is inserted into the shelf 7. and shelf 7
On the backboard 8, backboard connectors 9, into which the printed board connectors 4 of the apparatus printed board 1 are inserted, are arranged in parallel corresponding to the respective guide grooves.

A printed board test tool 10 is inserted into the guide groove after the selected apparatus printed board l to be tested is removed from the shelf 7.

The printed board test device 10 includes a printed board 11 having the same shape as the printed board 2 and a printed board connector 12 attached to the bank board connector 9, and a small screw on the side edge opposite to the printed board connector 12. A mounting plate 13 is fixed to the mounting plate 13. The plate-shaped mounting plate 13 has a width slightly smaller than the width of the printed board 11, and the side edge opposite to the side edge fixed to the printed board 11 is bent at a right angle to form a bent portion 13a. There is. A bank board connector 14 into which a printed board connector 4 attached to the device printed board 1 is inserted is attached to the front end surface of the bent portion 13a. Each lead terminal of the bank board connector 14 and the terminal of each pattern of the printed board 11 are connected by a lead wire 15.

By attaching such a printed board test device 10 to the shelf 7 and inserting the printed board connector 4 of the device printed board 1 into the backboard connector 14 of the printed board test device 10, the device printed board l is placed on the shelf 7. When pulled out and mechanically held, the shelf 7 is electrically connected to the backboard 8. Therefore, the device printed board 1 is in operation. Therefore, chip carrier type l
A desired test can be performed by connecting the input/output terminal 5 of C3 to a test device.

However, in the chip carrier type IC 3, the thick input/output terminal 5 and the printed circuit board pattern 6 are connected by soldering, and unlike the DIP type IC, the lead terminal is inserted into the through hole of the printed circuit board 2 and soldered. It is inferior in strength compared to the Therefore, if a known test IC crimp, which clamps the lead terminal portion by spring pressure, is used when testing a DIP type IC or the like, there is a risk that the input/output terminal 5 portion may be damaged.

(C) Object of the Invention An object of the present invention is to provide a test method for chip carrier type ICs that eliminates the above-mentioned problems.

(d) Structure of the Invention In order to achieve this object, the present invention involves removing an equipment printed board from a shelf, attaching it to the shelf via a printed board testing tool, and attaching both ends to both edges of the equipment printed board. A side view channel-shaped guide bridged to the printed circuit board of the device, and a guide mounted on the guide so as to be slidable in a direction perpendicular to the sliding direction of the guide. An auxiliary test device equipped with a cursor and a probe pin attached to the cursor so that a lead wire connected to the test device is wrapped around it and each tip can be pressed into contact with each input/output terminal section of a chip carrier type IC. use,
The cursor is moved to the top of the chip carrier type IC and the probe pins are brought into pressure contact with the input/output terminal portions of the chip carrier type IC to connect and configure the test circuit.

(e) Embodiments of the Invention The present invention will be described below with reference to illustrated embodiments.

3A and 3B are perspective views (A) and (B) sectional views of an auxiliary testing device according to an embodiment of the present invention.

In the figure, the guide 16, which has a channel shape when viewed from the side, is arranged so that the guide grooves 19 formed at both ends fit into both side edges of the printed circuit board 20 of the device printed board 1, and hold the printed circuit board 2. is cross-linked to. Therefore, the guide 16 is slidable in the longitudinal direction of the printed circuit board 2, that is, in the front-rear direction along the printed circuit board 2 with the device printed board 1 inserted into the printed circuit board testing device 10.

Further, the guide 16 is provided with a groove 20 having two dovetail grooves 20a in a direction perpendicular to the sliding direction.

In the cursor 17, a housing 21 made of an insulator is fitted into the groove 20, and a space 21a protruding from both end faces is inserted into the dovetail 120a with a sufficient gap. Therefore, the cursor 17 can slide along the groove 20.

On the bottom of the housing 21, there is a chi-knob carrier type IC3.
Probe pins 18 are juxtaposed and protrude from the connection portions of the input/output terminals 5 and the printed circuit board no-turns 6, respectively. The probe pin 18 (the tip end on the printed circuit board 2 side is shown in the figure) is a known probe pin having a structure in which it comes into pressure contact with the connection portion between the input/output terminal 5 and the printed circuit board pattern 6 by the elasticity of a coil spring.

The housing 21 is provided with a cavity on the side opposite to the printed circuit board 2, and the head of each probe pin 18 protruding into this cavity is connected to a test device (not shown) and a lead wire 22 is connected to the head of each probe pin 18 projecting into the cavity. The terminals are wrapped around each other.

Further, on the side surface of the guide 16 opposite to the printed circuit board 2, fixing screws 23 whose tips protrude into the dovetail groove Oa are screwed in parallel along the dovetail groove 208. This fixing screw 2
3 are normally turned in a dovetail so that their tips do not protrude into the dovetail groove 208. Therefore, the cursor 17 is not prevented from moving along the groove 20. In addition, the probe pin 18 is connected to the printed circuit board 2 only in the gap 21a.
Since the probe pin 18 can be separated from the surface of the guide 16, the probe pin 18 will not hit the chip carrier type IC 3 and will not become an obstacle to sliding on the guide 16.

Attach the auxiliary test device as described above to the device printed board 1, slide the guide 16 and cursor 17 as desired, move it to the top of the chip carrier type IC 3 to be tested, and attach the fixing screw screwed to that part. Screw 23. The tip of the fixing screw 23 presses the gap 21a, and the fin portion 21a is pressed against the wall surface of the two printed circuit boards in the dovetail groove 20a. As a result, the cursor 17 is moved toward the printed circuit board 2 by the gap 21a and is fixed at that position. When the cursor 17 moves to the printed circuit board 2 side by the gap 21a,
The tip of each probe pin 18 is pressed into contact with the connection portion between the corresponding input/output terminal 5 of the chip carrier type IC 3 and the printed circuit board pattern 6, thereby forming a connection circuit with the test equipment.

<r>Detailed Description of the Invention As described above, the present invention enables pressure contact of a probe pin to an input/output terminal by a simple operation of moving a cursor and a guide.
This test method for chip carrier type ICs has an excellent practical effect in that a test circuit can be configured without damaging input/output terminals.

[Brief explanation of the drawing]

In Fig. 1, (A) is a perspective view of the printed board of the device, (B) is a sectional view, and Fig. 2 is a perspective view showing the printed board test device.
3A and 3B are perspective views (A) and (B) sectional views of an auxiliary testing device according to an embodiment of the present invention. In the figure, 1 is a device printed board, 2 is a printed circuit board, 3 is a chip carrier type IC, 5 is an input/output terminal, 6 is a printed board pattern, 7 is a shelf, 1O is a printed board test tool, 16
17 represents a guide, 17 represents a cursor, and 18 represents a probe pin. ￥-l Mutt (Inn/Ka 2 Town Dormitory 3 Sake (1'7)

Claims (1)

[Claims] In a device printed board that is inserted in parallel to a shelf and has a chip carrier type IC mounted thereon, the device printed board is removed from the shelf and attached to the shelf via a printed board test tool, so that both ends are connected to the device. A channel-shaped guide in side view bridges the device printed board so that it can be inserted into both side edges of the printed board and slidable in the front-rear direction, and a guide that is slidable in a direction perpendicular to the sliding direction of the guide. A cursor attached to the guide and lead wires connected to the test equipment are wrapped around each other, and each tip is attached to the chip carrier type IC.
The cursor is moved to the top of the chip carrier type IC using an auxiliary test device equipped with a probe bottle attached to the cursor so as to be able to be press-contacted to each input/output terminal portion of the chip. Connecting and configuring a test circuit by press-contacting it to the input/output terminal section of a carrier type IC.