JPS6045010A - Electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Technical Field] The present invention relates to electronic components, and in particular, to a resin-molded solid-state capacitor that can reduce lead degradation or breakage caused by bending of an external lead assembly. It's about structure.

In general, this type of solid electrolytic capacitor is, for example, as shown in FIG. 1, in which a metal wire having a valve action is attached in advance to a capacitor element A, which is formed by press-forming metal powder having a valve action into a prismatic shape and sintering it. i IJ-FB is planted, and the plate-shaped first external lead member C is welded to this anode lead B, and the plate-shaped second external lead assembly is attached to the electrode extraction layer E of the capacitor element Δ'. The conductive adhesive 8' is used to connect (2), and the entire circumferential surface of the conductive element I-A is molded and coated with resin 4:Aa.

By the way, this capacitor is manufactured as follows, for example. That is, first, as shown in FIG. 2, a lead frame 110W'r 1 + is punched out from a plate material.
Second external lead part 1! The capacitor element \ is placed on 'c, n, and the anode lead B and the electrode t;'lj extraction layer E are connected to the eleventh second external lead portion 1i4'c, +]. Next, the lead frame 11 is placed in a mold, -
Adjust the capacitor elements 1-8 so that they are located in the cavity, and install 4ff4 fat a;t O in the cavity.
inject. Next, the failure of the lead frame 11 (
% is divided by 1 from the X-X portion, and the first. As shown in FIG. 1, the second external lead parts C and D are manufactured by being bent along the side and bottom surfaces of the resin material G.

In this capacitor, the first. For example, nickel silver with a thickness of about 0.1 nm is used for the second external lead parts C and D, and the surface thereof is designed to prevent a decrease in mechanical strength due to diffusion of solder material. , the thickness is 0.5μ
A nickel plating layer of about m thickness is formed.

However, since an alloy layer is formed at the interface between the nickel plating layer and the nickel silver due to heat treatment during the manufacturing process, the When bending the second external lead members C and D, there is a problem in that they may break from the bent portion, or may deteriorate and break at the bent portion.

[Disclosure of the invention]

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an electronic component that can effectively reduce deterioration or breakage of an external lead assembly caused by bending with a simple configuration.

The feature of the present invention is that a plurality of external lead members having plating layers on the surface are led out from the component wood in different directions, and the main parts including the component body are molded and covered with resin, and the external lead members are led out from the wood of the component. In the case where the portion is bent along the circumferential surface of the resin assembly, a portion where the plating layer is not formed is formed at the bent portion of the external lead assembly.

According to this invention, since the portion where the plating layer is not formed is formed in the bent portion of the external lead member, appropriate elongation can be applied to the constituent members of the external lead member during the bending process. Therefore, breakage accidents due to breakage or deterioration can be significantly reduced.

[Best mode for carrying out the invention]

Next, an example of the application of the present invention to a solid electrolytic condenser will be described with reference to FIGS. 3 and 4.

In the figure, reference numeral 1 denotes a capacitor element (component body) made by pressure-forming metal powder having a valve action into a prismatic shape and sintering it. A functional metal wire is installed as an anode lead 2. A curved surface extraction layer 3 is formed on the circumferential surface of the capacitor element 1 via an oxide layer and a semiconductor layer.

On the other hand, a plate-shaped first external lead assembly 4 is welded to the positive hard lead 2 of the capacitor element 1, and a plate-shaped second external lead assembly 5 is welded to the small pole extraction layer 8. They are connected using adhesive 6.

In addition, 1st. For example, nickel silver is used for the second external lead part 4.5, and its surface has bent parts 4a, 4b,
A nickel plating layer 7 and a solder plating layer 8 are sequentially formed except for 5a and 5b.

The main parts including the capacitor element 1 are molded and covered with a resin material 9. And the first. Second
The lead-out portions of the resin material 9 of the external lead parts 4 and 5 of 4a. 4b, 5a,
It is bent from the 5b part.

In particular, the first. The thickness of the second external lead assembly 4, 5 is 0.
Use 1mm nickel silver 4, bending parts 4a, 4b.

The thickness is 0.5μ on the surface except for the parts corresponding to 5a and 5b.
m nickel metal layer 7. When the solder plating layers 8 with a thickness of 4 μm were sequentially formed, the number of failures due to breakage at the bent portion due to the bending process and material deterioration was 1%.

In addition, although a plating layer is formed on the entire surface, the defect rate is 5%.
Met.

In addition, in the present invention, the electronic component can be applied not only to a solid electrolytic capacitor but also to a resistor. Further, the materials for the external lead member and the plating layer can be changed as appropriate.

[Brief explanation of drawings]

Fig. 1 is a side sectional view of a conventional example, Fig. 2 is a cross sectional view for explaining the manufacturing method, Fig. 3 is a side sectional view showing an embodiment of the present invention, and Fig. 4 is an enlarged view of main parts. It is. In the figure, 1 is the component body, 4 and 5 are external lead members, 4a,
4b, 5a, and 5b are bent portions, 7.8 is a meridian layer, and 9 is a resin material. ) 1) 1 Figure 2 Figure 3 Do 4 No. 4 Do 4 b 4 9 39-

Claims (1)

[Claims] A plurality of external lead parts having plating layers on the surface are led out from the component body in different directions, and the main part including the component body is molded and covered with a resin material, and the lead-out part of the external lead member is wrapped around the resin material. An electronic component that is bent along a surface, and characterized in that a portion where a plating layer is not formed is formed in the bent portion of the external lead member.