JPS6043014B2 - Semiconductor device sealing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a sealing device for a semiconductor device, and more particularly to an improved structure that facilitates insertion of a mount into a sealing head of a sealing device.

2. Description of the Related Art In the manufacturing process of semiconductor devices, there is a sealing process in which a mount to which semiconductor pellets or the like are attached is welded and sealed with a shell that protects and seals the mount.

Furthermore, the sealing device used in this process is comprised of a shell supply process, a mount supply process, a nitrogen gas sealing process, a sealing process, etc., but this invention is particularly applicable to the mount supply process among the above. This is related to insertion.
FIG. 1 shows an example of the arrangement of a sealing device.

In the figure, A is a rotary table, which is supported by a center valve B and rotated for index feeding. A plurality of heads installed on the rotary table are sequentially moved by index feeding to a shell supply position 101, a mount supply position 102, a nitrogen filling position 103 (plurality), a sealing position 104, and a product extraction position 105.
Each step is performed at each position to achieve sealing of the semiconductor device. In the figure, C is a mount insertion device, and D is a sealing part for applying a solution. Conventionally, inserting a semiconductor mount into a sealing device has been done manually, which is inefficient, but an example of a device that mechanizes this process will be described.

The mount 1 is shown in a top view in FIG. 2a and in a side view in the same figure. In the figure, 1a is a semiconductor pellet, lb is a stem substrate,
lc is a lead wire, 2 is a stem mounting hole, and shell 3 forming a part of the envelope is shown in a top view in FIG. 3a and a side view in the same figure.
shows. Next, FIG. 4 is a perspective view of the sealing head, and FIGS. 5 and 6 are top views and sectional views of the sealing head, respectively.
FIGS. 7 and 8 show a top view and a sectional view, respectively, for explaining the case where the mount is inserted into the sealing head. The configuration and operation will be explained for each of the above countries.
First, in FIGS. 5 and 6, reference numeral 4 denotes a head body, and an insulating member 5 is fixed to the inner surface of the head body to electrically insulate and pivotally support an electrode member 9.

Further, a shell electrode member 11 is attached to the upper part of the electrode member 9 using a centering fitting 12 and a fastening pin 10. Further, the electrode member 9 is pushed up by the spring 7 to impart elasticity to the shell electrode member 11. This spring 7 has an insulating member 6 for electrically insulating it from the electrode member 9.
and is held by a lock nut 8 screwed into the head body. In addition, 13 in the figure is a retaining metal fitting with a locking pin 1.
5 is fixed to the head body, and is pivotally supported by the head body 4 so that it can slide up and down while being regulated in the rotational direction by a groove 14 formed in the head body. Next, Figures 7 and 8
The mount receiving portion will be explained with reference to the drawings. The mount holder 7, which has a mount receiving part 21 into which the mount (stem 1a) 1 can be inserted, has a locking pin 19 fixed thereto, and is regulated in the rotational direction by a groove 20 formed in the holding fitting 13. The holding fitting 1 can be slid up and down.
It is pivoted on 3. Then, the mount holder 7 is pushed up by the spring 16 to give elasticity to the mount holder 7. Further, the nitrogen introduction pipe 18 (FIGS. 5 and 6) is fixed to the head body 4. Reference numeral 22 shown in FIG. 4, partially overlapping with the above, is a base, to which a bearing member 23 having a bearing 24 is fixed, and a transfer rod 25 is pivotally supported.

A transfer drive unit (not shown) is provided below the base of the transfer rod for vertically moving and rotating the transfer rod. Further, an arm 26 is fixed to the upper end of the transfer rod, and a mount chuck 27 is attached to the tip of the arm 26 to adsorb the mount 1 by vacuum.
forms a mount conveying section 40 to which is fixed. Note that the direction of movement is indicated by a broken line arrow in the figure. The operation of the insertion device and the sealing head configured as described above will be explained.

Maun not shown. Mount 1 supplied from the transport unit
position A (first position) using a mount positioning device (not shown).
Figure) By positioning the mount downward and lowering the transfer rod 25, the mount chuck 27
is lowered to suction and support mount 1. . Next, in this state, the transfer rod 25 is upwardly swung to move to position B (FIG. 1), and the mount 1 is moved above the sealing head fixed to the rotary table of the sealing device. Then, by lowering the transfer rod again, the mount is inserted into the mount receiving portion 21 which is a recess formed in the mount holder 7 attached to the sealing head. After the insertion is completed (the vacuum source is closed), the transfer rod is swung upward, the mount chuck is returned to the original position A, and this operation is sequentially repeated. However, in this sealing process, the center 0 of the mount shown in Fig. 2 and the center 0'' of the shell 3 (Fig. 3 a)
Due to the need to match the A of the mount during welding (sealing)
, b dimensions and the a″, b″ dimensions of the mount receiving part 21 of the mount holder 7 (Fig. 7). If a mount with the minimum dimensions (within the allowable dimension range) is inserted, the center 0 of the mount will shift significantly. , will not match the center 0'' of the shell 3.Also, even if the tolerance range of the A and b dimensions of the mount is reduced and the a'' and b'' dimensions of the mount receiver are matched to this, the seal There were problems with the accuracy of the mounting device itself and the mount conveyance unit, and there were unavoidable drawbacks such as difficulty in insertion, lack of reliability, and impossibility of implementation.This invention addresses the above-mentioned drawbacks and provides a semiconductor device that improves this. Some provide a sealing device.

In the semiconductor device sealing device according to the present invention, the sealing head includes a positioning guide portion having an opening larger than the mount, and a bottom surface of the opening in the guide portion partially coincides with a side surface of the opening. a mount receiving head portion having a concave mount receiving portion that communicates with the mount receiving portion such that the mount receiving portion has a side surface that communicates with the mount receiving portion; The present invention is characterized by comprising a rotating arm that is lowered along the side surface where the opening and the mount receiving part coincide to be introduced into the mount receiving part, and a mount conveying part having a rotating mechanism for the mount.

Next, the present invention will be described in detail with reference to the drawings regarding an embodiment of a semiconductor device sealing device.

Fig. 9 is a perspective view of the sealing head, Fig. 10 is a sectional view of the mount conveyance section, Figs. 11 and 12 are top views and sectional views of the mount receiving head section, and Fig. 13 is the mount receiving head. The process of inserting the mount in the section is shown in top views in Figures a to c. In the figure, 4'(9th
Figure) shows the mount conveyance part, 22 is the base, and the bearing 24
The bearing member 23 provided with is fixed to the transfer rod 2.
5 is pivoted.

A transfer drive unit (not shown) is provided below the transfer rod 25 to rotate the transfer rod vertically and horizontally. Further, as shown in detail in FIG. 10, an arm 26a is provided at the upper end of the transfer rod 25 with bearings 36, 36''.
is fixed. The arm 26a is provided with a rotary solenoid 29 for rotating the mount chuck 27a around an axis, and a lever 31 is connected to the rotary rod 30 of the rotary solenoid 29. Also, a mount chuck 2 that suctions and supports the mount 1 by reducing pressure (vacuum)
7a is rotatably supported on the arm 26a by fasteners 34 and 3C, and a lever 3V is attached to the upper part of the arm 26a. In order to connect this lever 3'' to a lever 31 attached to a rotating rod 30 of the rotary solenoid 29, connecting members 32, 33, 32' are provided and configured to rotate the mount chuck 27. Further, mount rotation pins 35, 35'' are fixed to the lower end of the mount chuck 27a, and the mount is rotated by these pins. next,
The mount receiving head section 50 will be explained with reference to FIGS. 11 and 12.

The mount holder 17a has an aperture 37 (aperture side surface 38) of a mount position adjustment guide portion and a groove-shaped mount receiving portion 21a (groove side surface 39) formed at the bottom of the aperture. That is, the above structure is provided with a position adjustment guide part,
After the transported mount is once positioned, it is rotated, and the side surface 38 of the hole and the side surface 39 of the groove provided at the bottom are rotated.
It is characterized in that it is adapted to be introduced into the mount receiving portion by being lowered along the side surface 389 that coincides with the mount receiving portion. Next, an example of operation will be explained. In FIG. 9, the mount 1 supplied by a mount supply device (not shown) is positioned by a mount positioning device (not shown), and the transfer rod 25 is lowered to move the mount chuck 27a to position A (first position). (Figure) to lower it and support it by suction. Also, at this time, the mount rotation pins 35, 35'' enter the openings 2 formed in the mount.Next, in this state, the transfer rod 25 is swung upward to move the mount chuck 27a to the position B ( 1) and moves the mount 1 onto the mount holder 17a in the sealing head provided on the sealing device rotary table 28. Then, when the transfer rod is lowered again, the mount 1 is moved as shown in FIG. 13a. Then, by operating the rotary solenoid 29 in this state, the mount chuck 27a is rotated via the lever 30 and the connecting members 32, 33, 32''. , the mount is shown in Figure 13a
Side surface 38 of the opening 37 of the mount position adjustment guide section shown in
The position of the mount is regulated by contacting the opening 37.
A groove-shaped mount receiving portion 21a formed at the bottom of the
a coincident side surface 389 provided between side surface 39 of
It is lowered along the mount receiving portion 21a and becomes as shown in FIG. 13b. At this time, the mount holder 17 is held by the spring 16 (see Fig. 2) built into the sealing head.
a is pushed up to achieve the above introduction. Furthermore, the first
As shown in Figure 3c, the mount is rotated to a predetermined orientation and is in the normal position. Note that the reduced pressure of the mount suction support is closed in the state shown in FIG. 13b, and suction is released. After the insertion is completed, the transfer rod 25 is raised and rotated to return the mount chuck 27a to the position A, and at the same time the rotary solenoid 29 is rotated to return the mount chuck to its original state. This operation is repeated in sequence. Note that the rotary solenoid as a power source of the rotating mechanism is not limited to this. According to this invention, by providing the mount position regulation guide hole in the sealing head part and equipping the mount chuck part with a mount rotation mechanism, variations in the external dimensions of the mount can be prevented. A significant advantage is that insertion can be achieved easily and reliably while positioning the mount without being affected by the accuracy of the transfer device or the like.

[Brief explanation of the drawing]

Fig. 1 is a top view of the sealing device, Fig. 2 shows the mount, Fig. a is a top view, Fig. b is a side view, Fig. 3 shows Sinoel, Fig. a is a top view, Fig. b is a side view, Fig. 4 is a perspective view of a conventional sealing device, FIGS. 5 and 6 show a sealing head, FIG. 5 is a top view, FIG. 6 is a sectional view of FIG. 5, and FIGS. 7 and 8.
7 is a top view, FIG. 8 is a cross-sectional view of FIG. 7, and FIG. 9 is a perspective view of a sealing device according to an embodiment of the present invention for explaining the case where a mount is inserted into a sealing head. Figure, 10th
The figure is a cross-sectional view of the mount conveyance section, FIG. 11 is a top view of the mount receiving head, FIG. 12 is a sectional view of the mount receiving head, and FIGS. 13 a to c show the mount insertion process in the mount receiving head. Both are top views.

Claims (1)

[Claims] 1. A positioning guide part having an opening larger than the mount of the semiconductor device, and a concave mount receiving part that communicates with the bottom surface of the opening of the guide part so that the side surface partially coincides with the side surface of the opening. a mount receiving head portion comprising: a mount receiving head portion for transporting the mount into the opening of the positioning guide portion and rotating the mount in a plane within the opening; 1. A sealing device for a semiconductor device, comprising: a mount transfer section having a rotating arm that lowers the mount along a side surface and introduces the mount into a mount receiving section; and a mount rotation mechanism.