JPS604267B2 - Particulate additive dispersion equipment - Google Patents
Particulate additive dispersion equipmentInfo
- Publication number
- JPS604267B2 JPS604267B2 JP12840980A JP12840980A JPS604267B2 JP S604267 B2 JPS604267 B2 JP S604267B2 JP 12840980 A JP12840980 A JP 12840980A JP 12840980 A JP12840980 A JP 12840980A JP S604267 B2 JPS604267 B2 JP S604267B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- tank
- liquid
- dispersion
- plating liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
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Description
【発明の詳細な説明】
本発明は、微粒子添加物の分散装置に係り、特に複合め
つき用めつき液に含まれる微粒子添加物を界面活性剤等
の分散剤を用いずに、しかも最も効果的に分散させるこ
とができ、また構造が極めて簡易なものとした分散装置
に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a device for dispersing particulate additives, and in particular, the present invention relates to a device for dispersing particulate additives, in particular, dispersing particulate additives contained in a plating liquid for composite plating without using a dispersing agent such as a surfactant, and moreover, in the most effective manner. The present invention relates to a dispersion device that can disperse the water and has an extremely simple structure.
複合めつきは、霞解めつきと異なり、めつき液に含まれ
ている還元剤によってめつき材を析出させて、金属の表
面にめつき層を形成するめつき法であり、特に自動車の
クラッチ用スプラィンシャフト等の擦過腐食を生じ易し
、摺動を伴なう高速重荷重を受ける機構部品の表面処理
に応用され、その自己潤滑性と耐摩耗性を著しく向上さ
せることができるものである。Composite plating, unlike haze plating, is a plating method in which a plating material is precipitated using a reducing agent contained in a plating solution to form a plating layer on the metal surface. It is applied to the surface treatment of mechanical parts that are prone to scratch corrosion, such as spline shafts for industrial use, and are subjected to high-speed heavy loads that involve sliding, and can significantly improve their self-lubricating properties and wear resistance. be.
このような大きな特長を示すのは、めつき材の中に、酸
化物、炭化物等のセラミック又は金属等の微粒子添加物
が分散析出しているためである。この微粒子添加物は、
直径1仏程度の円形微粒子であって、高い自己潤滑性と
耐摩耗性を金属めつき層に与えている。このような榎合
めつきを施すには、めつき液に例えばセラミックの微粒
子添加物を混合して分散させておき、該めつき液中に被
めつき物を所定時間浸潰してめつき材と微粒子添加物を
析出させてめつき層を形成する。The reason for this great feature is that particulate additives such as ceramics such as oxides and carbides or metals are dispersed and precipitated in the plating material. This particulate additive is
They are circular fine particles with a diameter of about 1 French, and provide high self-lubricating properties and wear resistance to the metal plating layer. In order to perform this type of plating, a fine particle additive of ceramic, for example, is mixed and dispersed in the plating liquid, and the object to be plated is immersed in the plating liquid for a predetermined period of time to form the plating material. and fine particle additives are precipitated to form a plating layer.
しかしめつき液中に混合された微粒子添加物は、その表
面張力によって、極めて凝集し易く、従ってこれをめつ
き液中に均一に分散させておくことは技術的に相当困難
である。However, the particulate additives mixed in the plating solution tend to aggregate extremely easily due to their surface tension, and it is therefore technically quite difficult to uniformly disperse them in the plating solution.
従来は、例えばニッケルの複合めつきの場合、硫酸ニッ
ケル(NiSQ)にセラミック(SIC)を微粒子添加
物として混合し、更に還元剤である媒介物質として次亜
リン酸ソーダ(NaH2P02)を加えてメッキ液とし
、該めつき液に、セラミック(SIC)の凝集を防止し
て分散させるため界面活性剤等の分散剤を混合し、めつ
き液槽にはェアを吹き込んで常に蝿梓させる装置が用い
られていた。Conventionally, for example, in the case of composite plating of nickel, a plating solution was prepared by mixing nickel sulfate (NiSQ) with ceramic (SIC) as a fine particle additive, and then adding sodium hypophosphite (NaH2P02) as a reducing agent mediator. A dispersant such as a surfactant is mixed with the plating solution to prevent the ceramic (SIC) from agglomerating and dispersed, and a device is used to constantly blow air into the plating solution tank. It was getting worse.
しかしながら上記従来装置によると、界面活性剤は老化
し易く、またその量が少なかったり、生産能率を高める
ため、めつき液の温度を少なくとも60度C以上、望ま
しくは90度C前後まで上げると、セラミック(SIC
)を分散させる効果が薄れ、微粒子1は、第1図に示す
ように、めつき糟2のめつき液3内において凝集してし
まい、その結果金属表面に形成されるニッケルめつき層
内において、セラミック(SIC)の微粒子1は凝集し
た形で部分的に偏在することになり、均質な複合めつき
層を得ることができない欠点があった。However, according to the above-mentioned conventional apparatus, the surfactant easily ages, the amount thereof is small, and in order to increase production efficiency, the temperature of the plating solution is raised to at least 60 degrees Celsius or higher, preferably around 90 degrees Celsius. Ceramic (SIC)
) becomes less effective, and the fine particles 1 aggregate in the plating liquid 3 of the plating pot 2, as shown in FIG. , the ceramic (SIC) fine particles 1 are partially unevenly distributed in an aggregated form, which has the disadvantage that a homogeneous composite plated layer cannot be obtained.
また界面活性剤の量が多くなると、めつきの付着性が悪
化するので、余りその量を多くすることはできなかった
。またェアの吹込みのみでは、セラミック(SIC)の
微粒子1を分散させることは不可能であり、いずれにし
ても、従来装置では界面活性剤の使用が不可避であり、
甚だ不都合が多かった。本発明は、上記した従来技術の
欠点を除くためになされたものであって、その目的とす
るところは、複合めつき用のめつき液に添加される微粒
子添加物を、界面活性剤等の分散剤を一切用いることな
く完全に均一に分散させることができるようにすること
であり、またこれによって、被めつき物表面に形成され
るめつき層内に均一に分散した微粒子添加物が析出存在
するようにして、自己潤滑性、耐摩耗性共に優れた複合
めつき層を得ることである。Moreover, if the amount of surfactant increases, the adhesion of plating deteriorates, so it was not possible to increase the amount too much. Furthermore, it is impossible to disperse the ceramic (SIC) fine particles 1 only by blowing air, and in any case, the use of a surfactant is unavoidable with conventional equipment.
There were many inconveniences. The present invention has been made to eliminate the above-mentioned drawbacks of the prior art, and its purpose is to change the fine particle additives, such as surfactants, to the plating solution for composite plating. The goal is to be able to completely and uniformly disperse the additive without using any dispersant, and by doing so, the evenly dispersed particulate additive can be deposited within the plating layer formed on the surface of the object to be plated. The objective is to obtain a composite plated layer with excellent self-lubricating properties and wear resistance.
また他の目的は、分散剤を用いないことによって、めつ
きの付着性を良好に保つと共に、めつき液の温度を高く
保つことを可能として生産能率の向上る図ることである
。更に他の目的は、めつき液をめつき液槽の底部から取
り出してめつき槽の外部で微粒子添加物を分散させて後
めつき液槽の上部に戻すことによって、微粒子添加物の
沈澱を防止し、最も効率的に微粒子添加物を分散させる
ことができるようにすることである。要するに本発明は
、酸化物、炭化物、金属等の微粒子添加物を含むめつき
液を用いる複合めつき装置において、該めつき装置のめ
つき糟の底部に、超音波発振装置を備えた前記微粒子添
加物の分散槽を蓮通接続し、該分散槽で前記微粒子添加
物に超音波振動を与えて前記めつき液中に分散させ、該
めつき液を前記めつき槽に戻すようにしためつき液搬送
手段を備えたことを特徴とするものである。以下本発明
を図面を示す実施例に基いて説明する。Another object is to maintain good plating adhesion and to maintain a high temperature of the plating solution by not using a dispersant, thereby improving production efficiency. Still another purpose is to remove the precipitation of particulate additives by taking the plating solution from the bottom of the plating tank, dispersing the particulate additives outside the plating tank, and then returning the particulate additives to the top of the plating tank. The objective is to prevent this and enable the most efficient dispersion of particulate additives. In short, the present invention provides a composite plating apparatus that uses a plating solution containing fine particle additives such as oxides, carbides, metals, etc., in which an ultrasonic oscillator is provided at the bottom of a plating pot of the plating apparatus. A dispersion tank for additives is connected through a lotus connection, and the particulate additive is subjected to ultrasonic vibration in the dispersion tank to be dispersed in the plating liquid, and the plating liquid is returned to the plating tank. This device is characterized by being equipped with a liquid conveying means. The present invention will be explained below based on embodiments shown in the drawings.
第2図において、分散槽4には、酸化物、炭化物、金属
等、主としてセラミック(SIC)の微粒子1の添加物
及び還元剤としての次塵リン酸ソ−ダー(Na比P02
)を含む硫酸ニッケル(NiS04)からなるめつき液
3が入れてあり、該分散槽の底部4aの下側には、超音
波発振装置5が取り付けてあり、該超音波発振装置から
発生する2皿HZ以上の超音波振動がめつさ液3及びセ
ラミック(SIC)の微粒子1に伝わるようになってい
る。In FIG. 2, a dispersion tank 4 contains additives such as oxides, carbides, metals, etc., mainly ceramic (SIC) fine particles 1, and subdust sodium phosphate (Na ratio P02) as a reducing agent.
A plating solution 3 made of nickel sulfate (NiS04) containing Ultrasonic vibrations higher than the dish HZ are transmitted to the liquid 3 and the fine particles 1 of ceramic (SIC).
次に分散槽4の具体的な配置について説明すると、第3
図において、めつき槽6の底部6aにパイプ7を蓮通接
続し、ポンプ8を介して該パイプを超音波発振装置5を
備えた分散槽4に蓮通接続し、ホース9を該分散槽の吐
出口4Mこ接続して、該ホースの一端9aをめつき楢6
の上部6bに臨ませておく。即ち、基本的には、めつき
液3をめつき糟6の底部6aからポンプ8により吸引し
て取り出し、分散槽4に送って、ここでめつき液3に超
音波発振装置5により超音波振動を与えて微粒子1を分
散させ、しかる後に該めつき液をめつき槽6の上部6b
にホース9で戻すようにしたものである。しかし本発明
装置を実施に供する場合には、分散槽4とめつき槽6と
の間に、他の糟等を配設してもよく、以下本発明装置を
組み込んだ複合めつきのめつき液調整システム11につ
いて第4図から第7図により説明する。Next, the specific arrangement of the dispersion tank 4 will be explained.
In the figure, a pipe 7 is connected to the bottom 6a of the plating tank 6, the pipe is connected to the dispersion tank 4 equipped with an ultrasonic oscillator 5 via a pump 8, and a hose 9 is connected to the dispersion tank. Connect the discharge port 4M of the hose, and connect one end 9a of the hose to the plated oak 6.
6b. That is, basically, the plating liquid 3 is sucked out from the bottom 6a of the plating pot 6 by the pump 8, and sent to the dispersion tank 4, where the plating liquid 3 is subjected to ultrasonic waves by the ultrasonic oscillator 5. The fine particles 1 are dispersed by applying vibration, and then the plating liquid is poured into the upper part 6b of the plating tank 6.
It is designed so that it can be returned by hose 9. However, when the device of the present invention is put into practice, other sieves or the like may be provided between the dispersion tank 4 and the plating tank 6. The system 11 will be explained with reference to FIGS. 4 to 7.
第4図において、めつき液調整システム11は、めつき
糟6、該めつき槽の底部6aに蓮通接続されたパイプ7
、ポンプ8、パイプ7の一端が蓮運接続され、微粒子添
加物の分散液槽13aと沈澱液槽12bとを備えためつ
き液回収槽12、該沈澱槽12bに運通接続されると共
に一端が別の沈澱液槽13に運通接続されたパイプ14
、該パイプの途中に設けられたポンプ15、沈澱槽13
に隣接連通する分散槽4、該分散槽に蓮通接続されたパ
イプ16、該パイプが蓮通接続された調整めつき液槽1
7、該調整めつき液槽からめつき檀6にめつき液を戻す
ためのホース9、該ホースの途中に設けられたポンプ1
8とを主要部とし、これらの他に被めつき物に付着した
微粒子添加物を洗浄して回収するための超音波洗浄槽1
9、該洗浄槽に設けられた分散液槽19a、沈澱液槽1
9b、該沈澱液槽19bと沈澱液槽13とに蓬通接続さ
れたパイプ20、核パイプの途中に設けられたポンプ2
1、分散液槽12a、19aと純水補給槽22とに運通
接続されたパイプ23、該純水補給槽と調整めつき液槽
17とに蓮通するめつき液補給槽24,25が備えてあ
る。なお26は水洗槽、27は湯洗槽、28は乾燥室、
29は防錆油槽であり、また30はめつき液予備槽、3
1はパシベート液(HN03)槽である。In FIG. 4, the plating liquid adjustment system 11 includes a plating pot 6 and a pipe 7 connected to the bottom 6a of the plating tank.
, the pump 8, one end of the pipe 7 is connected to the flask, and the one end is connected to the flask liquid recovery tank 12, which includes a fine particle additive dispersion liquid tank 13a and a sedimentation liquid tank 12b, and the sedimentation tank 12b, and one end is connected separately. The pipe 14 is connected to the precipitation tank 13 of
, a pump 15 provided in the middle of the pipe, and a settling tank 13
a dispersion tank 4 adjacent to and in communication with the dispersion tank, a pipe 16 connected to the dispersion tank through a connection, and an adjustment plating liquid tank 1 to which the pipe is connected through the connection.
7. A hose 9 for returning the plating liquid from the adjusted plating liquid tank to the plating tank 6, and a pump 1 installed in the middle of the hose.
8 is the main part, and in addition to these, there is an ultrasonic cleaning tank 1 for cleaning and recovering particulate additives attached to the coated object.
9. Dispersion liquid tank 19a and precipitation liquid tank 1 provided in the cleaning tank
9b, a pipe 20 connected to the precipitation liquid tank 19b and the precipitation liquid tank 13, and a pump 2 provided in the middle of the core pipe.
1. A pipe 23 is connected to the dispersion liquid tanks 12a and 19a and the pure water supply tank 22, and plating liquid supply tanks 24 and 25 are connected to the pure water supply tank and the adjustment plating liquid tank 17. be. In addition, 26 is a water washing tank, 27 is a hot water washing tank, 28 is a drying room,
29 is a rust prevention oil tank, and 30 is a plating liquid preliminary tank;
1 is a passivate liquid (HN03) tank.
次に第5図から第7図によりめつき槽6の構造について
説明すると、該めつき糟6の側面6c,6dには第5図
及び第6図に破線で示す隔膜32,33が設けてあり、
ホース9からのめつき液3は矢印34,35,36で示
すようにめつき檀6の上部6bから側面6c,6dと夫
々の隔膜32,33との間から下向きに入り、暖められ
てから少しずつめつき糟6内のめつき液3に混入される
ようになっている。Next, the structure of the plating bath 6 will be explained with reference to FIGS. 5 to 7. The side surfaces 6c and 6d of the plating bath 6 are provided with diaphragms 32 and 33 shown by broken lines in FIGS. 5 and 6. can be,
The plating liquid 3 from the hose 9 enters downward from the upper part 6b of the plating plate 6 between the side surfaces 6c, 6d and the respective diaphragms 32, 33 as shown by arrows 34, 35, and 36, and is heated. It is mixed into the plating liquid 3 in the plating pot 6 little by little.
まためつき糟6の底部6aは、第6図及び第7図に示す
ように、V字形の溝6e,6e,6eが設けられ、各溝
の底部にはェアパィプ37,38,39が配設され、該
ェアパィプには下向きに45度間隔でェアの吹出し穴3
7a,38a,39aが夫々長手方向に多数あげられて
いて、ェアは矢印40で示すように下向きに吹き出し、
各溝6e,6e,6eの底に沈澱する微粒子添加物を上
方に吹き上げるようになっている。本発明は、上記のよ
うに構成されており、以下その作用について説明する。
第3図において、めつき糟6のめつき液3には、従来方
法と異なり、界面活性剤等の分散剤は混入されていない
ので、セラミック(SIC)の微粒子1は凝集してめつ
き糟6の底部6aに沈澱しようとするが、ポンプ8によ
り該底部からめつき液3が吸引されて取り出され、分散
槽4に送られ、超音波発振送暦5から超音波振動を与え
られて該分散槽で微粒子1は分散し、それ以後は容易に
微粒子1が凝集しない乳白色のめつき液3となってホー
ス9によりめつき槽6の上部6bに戻される。従って、
この循環作用を繰り返していることによって、めつき液
3のすべてが微粒子1がきれいに分散した乳白色のめつ
き液3となり、該めつき液中に浸潰される被めつき物1
0}こは、セラミック(SIC)の微粒子1が均一に分
散した複合めつき層を形成することができる。一例とし
て「
硫酸ニッケル(NiS04)に、還元剤としての媒介物
質として次亜リン酸ソーダ(Na比P02)を混合し、
これに直径1山程度のセラミック(SIC)の微粒子を
添加して複合めつき用のめつき液を作り、これを容器に
入れてその底部から超音波発振装置により4弦HZの超
音波振動を1分間与えたところ、ベージュ色に容器底部
に凝集沈澱していた微粒子が完全に分散し、めつき液は
乳白色となり、従来の複合めつき用のめつき液と全く異
なり、これを3日乃至4日間放置しても微粒子の凝集や
沈澱は生ぜず、めつき液は乳白色のままであつた。Further, the bottom part 6a of the plating pot 6 is provided with V-shaped grooves 6e, 6e, 6e, as shown in FIGS. 6 and 7, and air pipes 37, 38, 39 are provided at the bottom of each groove. The air pipe has air outlet holes 3 facing downward at 45 degree intervals.
7a, 38a, and 39a are raised in large numbers in the longitudinal direction, and the air blows out downward as shown by arrow 40.
The particulate additive that settles at the bottom of each groove 6e, 6e, 6e is blown upward. The present invention is configured as described above, and its operation will be explained below.
In FIG. 3, unlike the conventional method, a dispersant such as a surfactant is not mixed in the plating solution 3 of the plating pot 6, so the ceramic (SIC) fine particles 1 aggregate and form the plating pot. However, the plating liquid 3 is sucked out from the bottom by the pump 8, sent to the dispersion tank 4, and ultrasonic vibration is applied from the ultrasonic oscillation feeder 5 to disperse the plating liquid 3. The fine particles 1 are dispersed in the tank, and after that, the fine particles 1 become a milky white plating liquid 3 in which the fine particles 1 do not easily aggregate, and are returned to the upper part 6b of the plating tank 6 by the hose 9. Therefore,
By repeating this circulation action, all of the plating liquid 3 becomes a milky white plating liquid 3 in which fine particles 1 are neatly dispersed, and the object to be plated 1 is immersed in the plating liquid.
0} This makes it possible to form a composite plated layer in which the ceramic (SIC) fine particles 1 are uniformly dispersed. For example, ``nickel sulfate (NiS04) is mixed with sodium hypophosphite (Na ratio P02) as a mediating substance as a reducing agent,
A plating solution for composite plating is made by adding fine particles of ceramic (SIC) with a diameter of about one peak, and this is placed in a container, and an ultrasonic oscillation device generates 4-string Hz ultrasonic vibrations from the bottom of the container. When applied for 1 minute, the fine particles that had coagulated and settled at the bottom of the container were completely dispersed and the plating solution became a milky white color, which was completely different from the plating solution for conventional composite plating. Even after being left for 4 days, no aggregation or precipitation of fine particles occurred, and the plating solution remained milky white.
次に第4図により、めつき液の調整システム11におけ
る作用を説明すると、めつき槽6の底部6aに沈澱した
微粒子添加物の多いめつき液3はパイプ7を通ってポン
プ8により吸引されて取り出され、めつき液回収槽12
に送られ、ここで、よく分散しためつき液3は分散液槽
12aに入り、パイプ23を通って純水補給槽22に送
られ、一方微粒子添加物の沈澱した沈澱液は、沈澱液槽
12bに入り、パイプ14を介してパイプ15により沈
澱液槽13に送られ、分散槽4に入って、超音波振動を
受けて微粒子添加物が分散し、パイプ16を介して調整
めつき液槽17に送られる。Next, the operation of the plating liquid adjustment system 11 will be explained with reference to FIG. The plating liquid is removed from the plating liquid collection tank 12.
Here, the well-dispersed plating liquid 3 enters the dispersion liquid tank 12a and is sent through the pipe 23 to the pure water replenishment tank 22, while the precipitating liquid containing the particulate additives is sent to the precipitation liquid tank 12a. 12b, is sent to the settling liquid tank 13 via the pipe 14 and the pipe 15, enters the dispersion tank 4, receives ultrasonic vibration, disperses the particulate additive, and is sent to the adjustment plating liquid tank via the pipe 16. Sent to 17th.
また純水補給槽22から、めつき液はめつき液補給槽2
4,25に順次送られ、調整めつき液槽17に合流する
。一方複合めつきが終了した被めつき物は超音波洗浄槽
19に入れられ、ここで付着していた微粒子添加物が振
り落され、沈澱液槽19bに溜まり、ここからポンプ2
1によりパイプ20を介して沈澱槽13に送られて同様
に分散作用を受けて次へ送られる。In addition, the plating liquid is supplied from the pure water supply tank 22 to the plating liquid supply tank 2.
4 and 25, and joins the adjustment plating liquid tank 17. On the other hand, the plated material after the composite plating is placed in the ultrasonic cleaning tank 19, where the adhering particulate additives are shaken off and collected in the sedimentation tank 19b, from which the pump 2
1, it is sent to the settling tank 13 via the pipe 20, similarly subjected to a dispersion effect, and sent to the next step.
また分散液は分散液槽19aへ入ってパイプ23により
純水補給槽22へ送られる。調整めつき液槽17には完
全に調整されためつき液が溜まり、ホース9を介してポ
ンプ18によりめつき槽6に戻される。Further, the dispersion liquid enters the dispersion liquid tank 19a and is sent to the pure water supply tank 22 through the pipe 23. A completely adjusted plating liquid is stored in the adjusted plating liquid tank 17 and is returned to the plating tank 6 by a pump 18 via a hose 9.
めつき糟6においては、第5図から第7図に示すように
、ェアパイプ37,38,39のェア吹出し穴37a,
38a,39aから下向きにェアが吹き出し、V字形の
溝6eに沈澱しようとした微粒子添加物を吹き上げ、蝿
拝している。In the plating pot 6, as shown in FIGS. 5 to 7, the air blowing holes 37a,
Air blows out downward from 38a and 39a, blowing up the particulate additives that were about to settle in the V-shaped groove 6e.
ホース9からめつき糟6の上部Sbに戻されるめつき液
はかなり温度が下がっているので、隔膜32,303と
各側面6c,6dとの間に注入され、側面6c,6dに
設けられた図示しない蒸気加熱器により暖められながら
該隔膜を通ってめつき液3内に少しずつ混入され、従っ
てめつき液3は常に適温に保たれ、微粒子添加物はきれ
いに分散し、理想的な状態で複合めつきをすることがで
きる。本発明は、上記のように構成され、作用するもの
であるから、複合めつき用のめつき液に添加される微粒
子添加物を、界面活性剤等の分散剤を−切用いることな
く完全に均一に分散させることができる効果が得られる
。またこれによって、被めつき物表面に形成されるめつ
き層内に均一に分散した微粒子添加物が析出存在するこ
とになるので、自己潤滑性、耐摩耗性共に優れた複合め
つき層を得ることができる効果が得られる。更には、界
面活性剤等の分散剤が一切不要となるので、めつきの付
着性を良好に保つことができ、かつめつき液の温度を高
くすることができるので、生産能率の向上を図ることが
できる効果が得られる。まためつき液をめつき糟の底部
から取り出してめつき槽の外部で微粒子添加物を分散さ
せて後めつき液槽の上部に戻すようにしたので、微粒子
添加物の沈澱を防止し、最も効率的に微粒子添加物を分
散させることができる効果が得られる。Since the temperature of the plating liquid returned from the hose 9 to the upper part Sb of the plating pot 6 has dropped considerably, it is injected between the diaphragms 32, 303 and each side surface 6c, 6d, and The plating solution 3 is gradually mixed into the plating solution 3 through the diaphragm while being warmed by a steam heater that does not heat the diaphragm. Therefore, the plating solution 3 is always kept at an appropriate temperature, and the particulate additives are neatly dispersed and composited in an ideal state. You can do plating. Since the present invention is constructed and operates as described above, the fine particle additives added to the plating solution for composite plating can be completely removed without using a dispersant such as a surfactant. The effect of uniform dispersion can be obtained. In addition, this allows uniformly dispersed fine particle additives to be precipitated in the plating layer formed on the surface of the object to be plated, resulting in a composite plating layer with excellent self-lubricating properties and wear resistance. You can get the desired effect. Furthermore, since dispersants such as surfactants are not required at all, it is possible to maintain good plating adhesion, and the temperature of the plating liquid can be raised, improving production efficiency. The effect that can be obtained is obtained. In addition, the plating solution is taken out from the bottom of the plating pot, the particulate additives are dispersed outside the plating tank, and then returned to the top of the plating tank, which prevents the particulate additives from settling and makes it possible to The effect of efficiently dispersing the particulate additive can be obtained.
第1図は微粒子添加物が凝集した状態を示すめつき糟の
縦断面図、第2図は本発明装置を用いて微粒子添加物を
分散させた状態を示す分散槽の縦断面図、第3図は本発
明を実施するための装置の概略縦断面図、第4図はめつ
き液調整システムを示すブロック図、第5図はめつき糟
の平面図、第6図は第5図のの−の矢視縦断面図、第7
図はめつき槽の底部の第6図と同様の拡大縦断面図であ
る。
1は微粒子、3はめつき液、4は分散槽、5は超音波発
振装置、6はめつき糟、6aは底部、7,8,9はめつ
き液搬送手段を構成する夫々パイプ、ポンプ及びホース
である。
第1図
第2図
第3図
第4図
第5図
第6図
第7図Fig. 1 is a longitudinal cross-sectional view of a plating pot showing a state in which particulate additives are aggregated; Fig. 2 is a longitudinal cross-sectional view of a dispersion tank showing a state in which particulate additives are dispersed using the apparatus of the present invention; The figures are a schematic vertical sectional view of an apparatus for carrying out the present invention, FIG. 4 is a block diagram showing a plating liquid adjustment system, FIG. Vertical cross-sectional view in the direction of arrows, No. 7
The figure is an enlarged vertical sectional view similar to FIG. 6 of the bottom of the plating bath. 1 is a fine particle, 3 is a plating liquid, 4 is a dispersion tank, 5 is an ultrasonic oscillator, 6 is a plating pot, 6a is a bottom part, 7, 8, and 9 are pipes, pumps, and hoses constituting a plating liquid conveying means, respectively. be. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7
Claims (1)
き液を用いる複合めつき装置ににおいて、該めつき装置
のめつき槽の底部に、超音波発振装置を備えた前記微粒
子添加物の分散槽を連通接続し、該分散槽で前記微粒子
添加物に超音波振動を与えて前記めつき液中に分散させ
、該めつき液を前読めつき槽に戻すようにしためつき液
搬送手段を備えたことを特徴とする微粒子添加物の分散
装置。1. In a composite plating device using a plating solution containing a particulate additive such as an oxide, a carbide, or a metal, an ultrasonic oscillator is installed at the bottom of the plating tank of the plating device. A plating liquid conveying means is configured to connect a dispersion tank in communication, apply ultrasonic vibration to the fine particle additive in the dispersion tank to disperse it in the plating liquid, and return the plating liquid to the pre-read plating tank. A dispersion device for particulate additives, characterized by comprising:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12840980A JPS604267B2 (en) | 1980-09-17 | 1980-09-17 | Particulate additive dispersion equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12840980A JPS604267B2 (en) | 1980-09-17 | 1980-09-17 | Particulate additive dispersion equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5754263A JPS5754263A (en) | 1982-03-31 |
JPS604267B2 true JPS604267B2 (en) | 1985-02-02 |
Family
ID=14984060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12840980A Expired JPS604267B2 (en) | 1980-09-17 | 1980-09-17 | Particulate additive dispersion equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS604267B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6446708B2 (en) * | 2015-03-30 | 2019-01-09 | 株式会社 コーア | Plating tank equipment |
-
1980
- 1980-09-17 JP JP12840980A patent/JPS604267B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5754263A (en) | 1982-03-31 |
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