JP6446708B2 - Plating tank equipment - Google Patents

Description

  The present invention relates to a plating tank apparatus that accommodates a plating solution and performs electroless plating or electrolytic plating on an object to be plated.

  Conventionally, as this type of plating tank apparatus, for example, one disclosed in JP-A-6-179976 is known. As shown in FIG. 9, this plating tank apparatus Sa has a bottom wall 101 and a side wall 102 and is formed in a container shape to accommodate a plating solution, and a circulation for circulating the plating solution in the plating tank 100. A portion 103 and an air blowing portion 104 that blows air into the plating tank 100 are provided, and plating is performed by immersing the object to be plated W in a plating solution in the plating tank 100. The bottom wall 101 of the plating tank 100 is inclined downward from the left and right, a plating solution outlet 105 is formed at the apex of the bottom wall 101, and the circulation unit 103 has a suction port for sucking the plating solution and a sucked plating solution. A pump 106 having a discharge port for discharging gas, a suction side pipe 107 connected between the outlet of the bottom wall 101 and the suction port of the pump 106, and one end connected to the discharge port of the pump 106, the other end The liquid supply port 109 for supplying the plating solution into the plating tank 100 is provided with a discharge side pipe 108 that opens into the plating tank 100. The air blowing unit 104 is configured as a blower 110 that sucks air and blows out from the blower outlet, and a spout unit 111 that has one end connected to the blower 110 and the other end that blows air into the plating tank 100. And a jet pipe 112 formed. As a result, the plating solution is circulated and agitated by the circulation part 103, and also agitated by the air ejected from the ejection port part 111 of the air blowing part 104. Occurrence of plating defects such as uneven plating is suppressed.

JP-A-6-179976

  By the way, in general, surface treatment such as electroless nickel plating is performed in order to improve the durability of sliding parts and the like mounted on digital cameras and medical devices, but in recent years, inorganic materials having hardness and lubricity. Some so-called electroless composite nickel plating techniques for eutecting fine particles together with metal have been developed and put into practical use. In this type of electroless composite plating technology, for example, as an electroless plating solution, a metal salt of nickel and tungsten is used as a metal ion source, hypophosphite as a reducing agent, citrates as a complexing agent, etc. In addition, silicon carbide (SiC) fine particles added as inorganic fine particles are used. In this electroless composite plating, using the above-described conventional plating tank apparatus Sa, an electroless plating solution can be placed in the plating tank 100 and an object to be plated can be immersed in the plating.

However, the fine particles of silicon carbide precipitate on the bottom wall 101 of the plating tank 100 or easily aggregate in the plating tank 100, and the plating solution is being stirred by the circulation part 103 and the air blowing part 104. However, there is a problem that the mixture is not always sufficiently stirred, resulting in poor dispersibility and unevenness.
The present invention has been made in view of the above problems, and even in a plating solution in which fine particles to be co-deposited are mixed, the fine particles can be uniformly co-deposited on the object to be plated without agglomerating the fine particles. An object of the present invention is to provide a plating bath apparatus that improves the dispersibility of fine particles.

  In order to achieve such an object, the plating tank apparatus of the present invention includes a plating tank having a bottom wall and a side wall, which is formed in a container shape and contains a plating solution, and a circulation for circulating the plating solution in the plating tank. A plating tank apparatus for performing plating by immersing an object to be plated in a plating solution in the plating tank, and lowering the bottom wall of the plating tank A plurality of valleys that are recessed to form a plating solution, and an outlet for the plating solution is formed at the apex of each of the valleys, and a suction port that sucks the plating solution and a discharge port that discharges the sucked plating solution through the circulating portion A suction side pipe connected between the outlet of the trough and the suction port of the pump, one end connected to the discharge port of the pump, and the other end containing the plating solution in the plating tank Discharge side pipe that opens into the plating tank as a liquid supply port for supplying liquid It has been configured to include a door.

  With this plating tank apparatus, for example, an electroless plating solution containing a metal ion source of the plating metal and adding fine particles such as silicon carbide is used, and the surface of the object to be plated is coated with the plated metal by electroless plating to share the fine particles. In the case of depositing, the plating solution is put in the plating tank, the pump of the circulating unit is driven to circulate the plating solution, and the air is blown out from the air blowing unit, and this state is maintained for a required time. Thereby, the plated metal is deposited on the object to be plated, and fine particles such as silicon carbide are co-deposited. In this case, even if fine particles settle on the bottom wall of the plating tank or agglomerate in the plating tank, the plating solution is circulated and stirred by the circulation part, and is also stirred by the air from the air blowing part. Therefore, precipitation at the bottom or agglomeration is suppressed, so that the fine particles frequently come into contact with the object to be plated and deposit uniformly on the object to be plated.

  In particular, since the bottom wall of the plating tank is formed by connecting a plurality of valleys, the fine particles are sucked and circulated in each valley, so that the dispersibility is extremely improved. In addition, since the valley is recessed downward and the outlet is formed at the apex of the valley, compared with the case where the outlet of the plating solution is provided on a flat surface, the aggregation is good, and the entire fine particles are uniformly distributed. It can be made to circulate, and dispersibility can also be improved in this respect. Therefore, fine particles can be co-deposited uniformly on the object to be plated without agglomeration.

  And it is set as the structure which formed the said trough part in the shape of a spindle as needed. Since the trough has a spindle-shaped inner surface, the fine particles are more easily collected at the apex.

  Moreover, it is set as the structure which provided the group of the said pump, the suction side pipe line, and the discharge side pipe line independently for each said trough part as needed. Since the pump, the suction side pipe line and the discharge side pipe line are independently driven, the circulation speed and the like can be individually adjusted, the agitation can be further improved, and the dispersibility can be improved. It will be very good.

  Further, if necessary, the blower for sucking air and blowing it out from the blower outlet, and a jet outlet part for connecting one end to the blower outlet and blowing the air into the plating tank. And a jet pipe configured as described above. Air can be reliably ejected.

  Furthermore, if necessary, the side wall of the plating tank can be ejected so that the air ejected from the ejection pipe part does not directly contact the object to be plated in the plating tank. The structure is provided on the side. When fine particles try to eutect, it is possible to prevent an adverse effect caused by the direct contact of air with the object to be plated, and to perform eutectoid uniformly. As a result, highly accurate film thickness control and thinning are possible.

  Moreover, it is set as the structure which provided the said jet nozzle part with two or more as needed. Since a plurality of air outlet portions of the air blowing portion are provided, agitation with air is performed uniformly, and also in this respect, the dispersion efficiency is improved.

  According to the present invention, since the bottom wall of the plating tank is formed by connecting a plurality of valleys, the fine particles are sucked and circulated for each valley, so that the dispersibility is extremely improved. In addition, the valley portion has an inner surface that is recessed downward, and the outlet is formed at the apex of the valley portion. In this respect, the dispersibility can be improved. Therefore, the fine particles can be uniformly co-deposited on the object to be plated without agglomeration.

It is a partial cross section perspective view which shows the plating tank apparatus which concerns on embodiment of this invention. It is a front view which shows the plating tank apparatus which concerns on embodiment of this invention. It is a top view which shows the plating tank apparatus which concerns on embodiment of this invention. It is a side view which shows the plating tank apparatus which concerns on embodiment of this invention. It is a figure which shows the structural example of the electroless-plating liquid used with the plating tank apparatus which concerns on embodiment of this invention. It is a table | surface figure which concerns on the experiment example of the plating tank apparatus which concerns on embodiment of this invention, and shows the component of the electroless-plating liquid used for this. It is an electron micrograph (100,000 times) which concerns on the experiment example of the plating tank apparatus which concerns on embodiment of this invention, and shows the solid content of the electroless-plating liquid used for this. It relates to the experiment example of the plating tank apparatus which concerns on embodiment of this invention, (a) is an electron micrograph (2000 times) which shows the surface of the plated sample, (b) is an electron micrograph which shows the surface of the plated sample. (100,000 times). It is a figure which shows an example of the conventional plating tank apparatus.

Hereinafter, based on an accompanying drawing, the plating tank device concerning an embodiment of the invention is explained in detail.
As shown in FIGS. 1 to 4, the plating tank apparatus S according to the embodiment includes a plating tank 1 having a bottom wall 2 and a side wall 3 that is formed in a container shape and contains a plating solution; A plating part in the plating tank 1, a circulation part 10 that circulates the plating solution, an air blowing part 20 that blows air into the plating tank 1, and a heating part 30 that heats the plating solution in the plating tank 1. Plating is performed by immersing the workpiece W in the liquid.

  The plating tank 1 is formed of a stainless steel plate, and the bottom wall 2 is formed by a pair of container-shaped trough portions 4 having a quadrangular pyramid-shaped inner surface recessed downward. That is, one side of the opening 5 of the pair of valleys 4 is connected to each other, and the valleys 4 are formed in parallel. The side wall 3 is connected to the outer peripheral edge forming the opening 5 of the pair of valleys 4 and is erected, and is formed in a rectangular cylindrical shape. A cover plate 6 that covers a pair of valleys 4 that form the bottom wall 2 is connected to the lower edge of the side wall 3. The cover plate 6 is provided with legs 7 for supporting the plating tank 1. A plating solution outlet 8 is formed at the apex of the lower end of each valley 4.

  The circulation unit 10 includes a first circulation unit 10A and a second circulation unit 10B, and includes a pump 11 having a suction port 12 for sucking a plating solution and a discharge port 13 for discharging the sucked plating solution, and a trough portion. 4 is connected to the suction side pipe 14 connected between the outlet 8 of the pump 4 and the suction port 12 of the pump 11, and one end is connected to the discharge port 13 of the pump 11, and the other end feeds the plating solution into the plating tank 1. The liquid supply port 16 includes a discharge side pipe 15 that opens into the plating tank 1. That is, the first circulation part 10A and the second circulation part 10B are each composed of a set of the pump 11, the suction side pipe line 14, and the discharge side pipe line 15, and each set is provided independently for each valley part 4. Will be. The discharge side pipe line 15 of the second circulation unit 10B branches into a main pipe 15a and a sub pipe 15b via a two-way switching valve 18, and a filter 17 is interposed in the sub pipe 15b. By switching the two-way switching valve 18, a plating solution can be passed through the follower pipe 15b of the discharge side pipe line 15 to remove relatively large foreign matters such as dust.

  The air blowing section 20 is configured as a blower 21 that sucks air and blows out from the blowout opening 22, and a blowout section 24 that has one end connected to the blowout opening 22 of the blower 21 and the other end blowing out air into the plating tank 1. It comprises a jet pipe 23 constructed. A plurality (four in the embodiment) of the jet outlets 24 are provided. That is, the ejection pipe line 23 is branched into four branch pipes (25a, 25b, 25c, 25d), and a jet outlet 24 is provided at the tip of each branch pipe (25a, 25b, 25c, 25d). It has been. The spout 24 is provided on the side of the side wall 3 of the plating tank 1 so as to be able to be blown out so that the air to be blown out does not directly contact the workpiece W in the plating tank 1. Reference numeral 27 denotes an air filter interposed in the ejection pipe line 23.

  Of the branch pipes (25a, 25b, 25c, 25d), two branch pipes (25a, 25b) are formed in a straight shape, and the spout port 24 is a downward opening of the branch pipes (25a, 25b). It consists of The other two branch pipes (25c, 25d) are provided with a protruding pipe 26 whose tip of the straight portion protrudes in the horizontal direction along the side wall 3, and the spout portion 24 is directed downward of the tip of the protruding pipe 26. It consists of an open mouth.

  The heating unit 30 includes an electric heater 31 and is provided in a pair in the plating tank 1. The heater 31 sets the temperature of the electroless plating solution to 80 ° C. to 90 ° C.

  Therefore, when the plating object W is plated using this plating tank apparatus S, it is as follows. Here, the case where electroless plating is performed on the workpiece W using an electroless plating solution will be described. As shown in FIG. 5, the electroless plating solution is for plating nickel as a plating metal on the surface of an object to be plated W. The metal ion source, reducing agent, complexing agent, pH adjustment of the plating metal In addition to the agent and stabilizer, silicon carbide and carbon nanotubes (CNT) are added. The object to be plated W may be any metal, resin, etc., and may be conductive or non-conductive. For example, iron, copper, aluminum and their alloy materials, stainless steel, plastic, glass, ceramic, etc. can be mentioned. In the embodiment, an iron plate, a copper plate, or a stainless steel plate is used.

  Examples of the metal ion source of the plating metal include nickel sulfate, nickel chloride, nickel hypophosphite, nickel carbonate, and the like. In the embodiment, nickel sulfate hexahydrate was used.

  The reducing agent has a redox potential lower than that of metal ions and has a low oxidation rate in solution. For example, hypophosphite, formaldehyde, paraformaldehyde, ammonium boron hydroxide, dimethylamine Examples include borane. In the embodiment, sodium hypophosphite, which is a hypophosphite, was used.

  Examples of the complexing agent include acetic acid, lactic acid, glycine, citric acid, malonic acid, malic acid, oxalic acid, succinic acid, tartaric acid, thioglycolic acid, ammonia, alanine, glutamic acid, ethylenediamine, and the like. In the embodiment, glycine was used.

  The pH adjuster is not particularly limited as long as it is alkali or acid. As the alkali, a hydroxide solution of an alkali metal or alkaline earth metal such as sodium hydroxide, potassium hydroxide, sodium carbonate, or aqueous ammonia can be used. As the acid, hydrochloric acid, sulfuric acid, nitric acid and the like can be used. In the embodiment, sodium hydroxide and dilute sulfuric acid were used.

  The stabilizer can be selected from, for example, nitrates such as lead, bismuth, thallium, and predetermined sulfur compounds. In the embodiment, lead nitrate or bismuth nitrate is used.

Silicon carbide having an average particle diameter of 0.1 μm to 10.0 μm was selected.
The average particle size is desirably 0.25 μm to 5.0 μm, more desirably 0.5 μm to 2.0 μm.

  Carbon nanotubes having an average diameter of 1.0 nm to 300 nm and a maximum length of 50 μm or less were selected. Preferably, the average diameter is 1.0 nm to 200 nm and the maximum length is 30 μm or less, and more preferably the average diameter is 50 nm to 150 nm and the maximum length is 10 μm or less.

  In addition, as the carbon nanotube, there are a single wall type (SWCNT), a multi wall type (MWCNT), a cup stack type (CSCNT), and the like. In the embodiment, a multi wall type or a cup stack type is selected. The carbon nanotubes are aggregated in a tangled state and exist as a blocky black powder, but are generally dispersed in a dispersion liquid in order to exhibit excellent characteristics. Examples of the dispersion solvent include water, ethanol, methanol, isopropyl alcohol, ethyl hexanol, acetone, butanol, ethyl acetate, butyl acetate, toluene, cyclohexane, and the like.

Specifically, nickel sulfate hexahydrate is 0.05 mol / L to 0.2 mol / L, sodium hypophosphite is 0.1 mol / L to 0.4 mol / L, and glycine is 0.1 mol / L. L-0.6 mol / L, 0.1 ppm to 3.0 ppm of stabilizer was added.
Desirably, nickel sulfate hexahydrate is 0.05 mol / L to 0.15 mol / L, sodium hypophosphite is 0.15 mol / L to 0.25 mol / L, and glycine is 0.25 mol / L to 0.35 mol / L, and the stabilizer is 0.2 ppm to 2.0 ppm. When the stabilizer is bismuth nitrate, it is 0.5 ppm to 1.5 ppm.
More desirably, nickel sulfate hexahydrate is 0.075 mol / L to 0.125 mol / L, sodium hypophosphite is 0.175 mol / L to 0.225 mol / L, and glycine is 0.275 mol / L. ˜0.325 mol / L, and the stabilizer is 0.2 ppm to 1.5 ppm. When the stabilizer is bismuth nitrate, it is 0.75 ppm to 1.25 ppm.
For example, nickel sulfate hexahydrate is 0.1 mol / L, sodium hypophosphite is 0.2 mol / L, glycine is 0.3 mol / L, and bismuth nitrate is 1.0 ppm.

Moreover, 0.5 g / L to 10 g / L of silicon carbide was added. Desirably, it is 1.0 g / L to 5.0 g / L, and more desirably 1.5 g / L to 2.5 g / L.
Furthermore, 10 ppm to 3000 ppm of carbon nanotubes were added. Desirably, it is 2000 ppm or less, More desirably, it is 50 ppm-1000 ppm.

  And when plating to the to-be-plated object W using this plating tank apparatus S, first, plating solutions other than a silicon carbide and a carbon nanotube are put into the plating tank 1 of the plating tank apparatus S, and in this state, two By switching the direction switching valve 18, the follower pipe 15b of the discharge side pipe line 15 is made effective, the pump 11 of the second circulation unit 10B is driven to circulate the plating solution, and the plating solution is passed through the filter 17 to compare dust and the like. Remove large foreign objects. Next, the main pipe 15a of the discharge side pipe line 15 is made effective by switching the two-way switching valve 18, and silicon carbide and carbon nanotubes are added to obtain a plating solution. Then, the heater 31 is operated to set the temperature of the plating solution to 80 ° C. to 90 ° C. And in the plating tank 1, the to-be-plated object W is suspended, for example in the center of the plating tank 1 so that the air from the jet part 24 of the air blowing part 20 may not contact | abut directly to the to-be-plated object W. Immerse. In this state, the pumps 11 of the first circulation part 10A and the second circulation part 10B are driven to circulate the plating solution, and the blower 21 of the air blowing part 20 is driven to blow out air from the outlet part 24. And keep this state for the required time. Thereby, nickel as a plating metal is deposited and deposited on the workpiece W, and silicon carbide and carbon nanotubes are co-deposited.

  In this case, even if silicon carbide or carbon nanotubes precipitate on the bottom wall 2 of the plating tank 1 or try to aggregate in the plating tank 1, the plating solution is circulated by the first circulation part 10A and the second circulation part 10B. And agitated by the air ejected from the ejection port 24 of the air blowing unit 20, so that precipitation at the bottom or agglomeration is suppressed, so that silicon carbide and carbon nanotubes The fine particles frequently come into contact with the workpiece W, and eutectoid is promoted as the nickel is deposited on the workpiece W.

  In particular, since the bottom wall 2 of the plating tank 1 is formed by connecting a plurality of valley portions 4, fine particles of silicon carbide and carbon nanotubes are sucked into each valley portion 4 and circulated. Dispersibility is extremely improved. Moreover, since the trough part 4 has the weight-shaped inner surface dented below and the exit is formed in the vertex of the trough part 4, compared with the case where the exit of a plating solution is provided in a plane, it is more intensive. The entire fine particles of silicon carbide and carbon nanotubes can be circulated evenly, and the dispersibility can also be improved in this respect. Further, since the first circulation unit 10A and the second circulation unit 10B are driven independently, the stirrability is improved and the dispersibility is extremely good. Therefore, the fine particles of silicon carbide and carbon nanotubes can be uniformly deposited on the workpiece W without agglomeration.

  Furthermore, since a plurality of the jet outlets 24 of the air blowing part 20 are provided, agitation with air is performed evenly, and also in this respect, the dispersion efficiency is improved. In this case, the jet port portion 24 of the jet pipe line 23 is disposed on the side of the side wall 3 of the plating tank 1 so that the air jetted from the jet port portion 24 does not directly contact the workpiece W in the plating tank 1. Since they are arranged, it is possible to prevent the fine particles of silicon carbide and carbon nanotubes that are to be eutected by air from being adversely affected, so that eutectoid can be uniformly performed. As a result, highly accurate film thickness control and thinning are possible.

  When the required time has elapsed, the workpiece W is taken out from the plating tank 1. The object to be plated W is coated with nickel as a plating metal, and silicon carbide and carbon nanotubes are scattered and formed on the surface thereof. Therefore, in the obtained product, the carbon nanotube is a high conductor, and has high hardness and flexible elasticity and corrosion resistance. Therefore, the function can be improved by the synergistic action of silicon carbide and the carbon nanotube. it can. In particular, it is possible to improve wear resistance and slidability.

<Experimental example>
Next, an experimental example is shown. An electroless plating solution having the components shown in FIG. 6 was prepared. As the carbon nanotube, a cup-stacked carbon nanotube (manufactured by Sankei Giken Kogyo Co., Ltd.) having an average diameter of 50 nm and a maximum length of 1 to 2 μm was used. The electroless plating solution was centrifuged, and the separated product was observed with a scanning electron microscope (SU6600 manufactured by Hitachi High-Technologies Corporation). The results are shown in FIG. It can be seen that carbon nanotubes are mixed between the silicon carbide fine particles.

  And it plated by said plating tank apparatus S using this electroless-plating liquid. A Hull Cell iron plate (100 mm × 67 mm × 0.3 mm) was used as an object to be plated W (sample), and as a pretreatment, alkaline degreasing was performed, washed with water, immersed in 10% sulfuric acid, and then washed with water. Then, the plating was performed at a temperature condition of 80 ° C., pH 5.5, and a processing time of 60 minutes. The plating conditions were determined so that the film thickness was 8 μm. In advance, an electroless plating solution shown in FIG. 6 was used to test for an appropriate film pressure. Under the conditions of a temperature of 80 ° C. and a pH of 5.5, the processing time was changed and the film thicknesses of 1 μm, 3 μm, 5 μm, 10 μm, and 20 μm were prepared, and the eutectoid state of silicon carbide was observed. As a result, no eutectoid was observed at 1 μm. Therefore, the film thickness was considered to be 3 μm or more. Moreover, the film thickness of each part was measured about the sample of 3 micrometers. As for the film thickness, the film thickness was measured for 5 points on the front and 10 points on the back of the sample. Each point was within the range of 3 μm ± 0.5 μm, and it was confirmed that a uniform film thickness of 3 μm ± 0.5 μm was stably obtained. Furthermore, the surface roughness was measured for a total of 10 points on the front 5 points and 5 points on the back using a 3D measurement laser microscope (OLYMPUS: EXT OLS4000). The arithmetic average surface roughness of the front surface and the back surface was 0.123 μm.

  And about the sample plated using this electroless-plating liquid, the surface state was observed with the scanning electron microscope (Hitachi High-Technologies SU6600). The results are shown in FIG. In the electron micrograph of 2000 times magnification of FIG. 8A, silicon carbide fine particles (white particles) are seen, and it can be seen that they are well dispersed and precipitated. Although the carbon nanotubes cannot be recognized in this photograph, it can be seen that carbon nanotubes are co-deposited between the silicon carbide fine particles in the electron micrograph of 100,000 times in FIG. 8B.

  In the above embodiment, the pump 11, the suction side pipe 14, and the discharge side pipe 15 are provided independently for each valley 4. However, the present invention is not necessarily limited to this. The pump 11 and each trough 4 may be connected by the suction side pipe line 14 and the discharge side pipe line 15 may be connected to the pump 11 and may be appropriately changed. . Moreover, in the said embodiment, although the trough part 4 was provided with one pair, it is not necessarily limited to this, Three or more may be provided and it may change suitably. Furthermore, in the above embodiment, the trough 4 is formed in the shape of a weight, but this is not necessarily limited to this, and it may be a V-shaped cross section with a vertex continuing for a predetermined length. There is no problem. Moreover, in the said embodiment, although this plating tank apparatus S demonstrated in the example used for electroless plating of nickel, it is not necessarily limited to this, You may use for other electroless plating or electrolytic plating. Of course.

DESCRIPTION OF SYMBOLS S Plated tank apparatus W To-be-plated object 1 Plating tank 2 Bottom wall 3 Side wall 4 Valley part 8 Outlet 10 Circulation part 10A 1st circulation part 10B 2nd circulation part 11 Pump 14 Suction side pipeline 15 Discharge side pipeline 16 Supply port 17 Filter 20 Air blow-in part 21 Blower 23 Jet pipe 24 Jet-out part 30 Heating part 31 Heater

Claims (6)

A plating tank having a bottom wall and a side wall and formed in a container shape and containing a plating solution, a circulation part for circulating the plating solution in the plating tank, and an air blowing part for blowing air into the plating tank In a plating tank apparatus that performs plating by immersing an object to be plated in the plating solution in the plating tank,
The bottom wall of the plating tank is formed by connecting a plurality of valleys recessed downward, forming an outlet for the plating solution at the apex of the valleys, and the circulation part with a suction port for sucking the plating solution and A pump having a discharge port for discharging the sucked plating solution, a suction side pipe connected between the outlet of the valley and the suction port of the pump, and one end connected to the discharge port of the pump A plating tank apparatus characterized in that the end is provided with a discharge side pipe opening into the plating tank as a liquid supply port for supplying the plating liquid into the plating tank.   The plating tank apparatus according to claim 1, wherein the valley is formed in a spindle shape.   The plating tank apparatus according to claim 1 or 2, wherein a set of the pump, the suction side pipe, and the discharge side pipe is provided independently for each valley.   A blower that sucks air and blows it out from the blower outlet, and a blowout pipe configured as a blowout part that has one end connected to the blower outlet and the other end jets air into the plating tank. The plating tank apparatus according to claim 1, comprising a path.   The ejection port portion of the ejection pipeline is provided on the side wall side of the plating tank so that air ejected from the ejection port portion can be ejected so as not to directly contact the object to be plated in the plating tank. The plating tank apparatus according to claim 4.   6. The plating tank apparatus according to claim 4 or 5, wherein a plurality of the jet outlets are provided.