JPS604235A - Processing method of semiconductor wafer - Google Patents

Abstract

PURPOSE:To facilitate the automation of transfer operation of a carrier for semiconductor wafer by using a carrier which a semiconductor wafer freely passes through along the grooves having plural V-shaped cross sections formed facing to each other and a jig enabling to carry said carrier and a semiconductor wafer contained in it at a time. CONSTITUTION:Said method uses a semiconductor wafer carrier 11 through which the grooves 5 penetrating with plural V-shaped cross sections formed facing to each other so as to contain plural semiconductor wafers 2 in parallel and with constant intervals, and in which the semiconductor wafers 2 can pass through freely along the grooves 5, and a jig enabling to carry said semiconductor wafer carrier 11 and the semiconductor wafers 2 contained in it at a time. For example, a carrier 10 containing a wafer is put together with an empty carrier 11 by use of the jig. Next, clicks 6 of the jig are opened by operating a handle 7. The wafer 2 is contained in the empty carrier 11 under its own weight, thereby finishing transfer of the wafer.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a processing method for semiconductors, and in particular to an IC processing method.
This invention relates to a semiconductor wafer carrier (hereinafter simply referred to as a carrier) that is widely and generally used in a semiconductor wafer processing process in a transistor manufacturing process and a jig used therein.

In the process of processing semiconductor wafers (hereinafter simply referred to as wafers), usually a plurality of wafers are housed in one carrier and undergo various chemical treatments.

In each chemical treatment, a dedicated carrier is used to prevent cross-contamination of processing chemicals. In other words, every time one chemical treatment is completed, it is necessary to take out the wafer from the gear carrier and transfer it to a dedicated gear carrier for the next chemical treatment.

In advancing the automation of handling in the manufacturing process, improving the work of changing carriers has traditionally been a major problem.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for easily automating the replacement of carriers.

A feature of the present invention is that in order to store a plurality of semiconductor wafers in parallel and equally spaced, a plurality of
A carrier for semiconductor wafers having grooves each having a letter-shaped cross section and allowing the semiconductor wafer to pass freely along the grooves, and a semiconductor wafer stored in the carrier for semiconductor wafers can be carried at the same time. This is a semiconductor wafer processing method that consists of a jig.

An embodiment of the present invention will be described in detail below with reference to the drawings. FIG. 1 is an external view of a conventionally used carrier. 1 is a gear rear body, 2 is a wafer stored therein, and 3 is a groove having a V-shaped cross section. FIG. 2 shows a cross section of the groove of the carrier of FIG.

FIG. 3 represents a groove cross-section of a carrier according to an embodiment of the invention. 4 is a carrier body, and 5 is a groove having a V-shaped cross section. Since the wafer 2 is only held by the penetrating groove 5, the structure is such that if only the carrier body 4 is lifted, the wafer 2 remains below.

FIG. 4 represents a carrier transport jig according to the invention. 6 is a hook part, and 7 is a handle. The hook parts 6 can be mutually opened and closed by operating the handle 7.

FIG. 5 is an explanatory diagram of how to use the jig. The hook part 6 of the jig lifts the carrier 4 and prevents the wafer 2 from being pulled out from the carrier 4 and falling, thereby separating the carrier 4 and the wafer 2.
It becomes possible to transport both at the same time.

FIG. 6 shows a wafer changing operation using a conventional milling plate. 8 is a carrier that already contains a wafer, and 9 is an empty carrier. 6th
As shown in Figure (a), first, an empty carrier 9 is symmetrically stacked on top of the wafer storage carrier 8. Next, as shown in FIG. 6(b), the wafer storage carrier 8 and the empty carrier 9 are turned upside down while being overlapped.

The wafer 2 in the wafer storage carrier 8 falls from the top and is completely stored in the empty carrier 9, and the wafer removal operation is completed.

FIG. 7 shows a wafer transfer process using a carrier and a jig using an actual foil example of the present invention.

io is a carrier that has already received a wafer (41) (=t
rb, 11 is an empty carrier.

As shown in FIG. 7(a), first place the carrier 10 containing the wafer on top of the empty carrier 11 using a jig. The hook part 6 is opened by operating the handle 7. - The wafer 2 is stored in the empty carrier IIK by its own weight, and the wafer replacement work is completed.

The advantage of using the wafer processing method constituted by the carrier and the jig according to the present invention is that, firstly, the posture of the carrier is the same before and after the wafer changing operation, and there is no movement of the position. The wafer reloading operation can be performed simply by grasping and releasing the wafer.

[Brief explanation of drawings]

Figure 2 is a cross-sectional view of the groove of the carrier shown in Figure 1, and Figure 3 shows the structure of the present invention. FIG. 4 is an external view of a carrier conveying jig according to an embodiment of the present invention, and FIG. 5 is an explanatory diagram of how to use the carrier conveying jig shown in FIGS. 3 and 4. , FIG. 6 is an explanatory diagram of a wafer transfer operation using a conventionally used carrier, and FIG. 7 is an explanatory diagram of a wafer transfer operation according to an embodiment of the present invention. In the figure, l...Carrier body, 2...-Stored wafer, 3...-Groove with a V-shaped cross section, 4...Carrier body , 5 --... Kani (7:
11 V-shaped? , ~;, 6...Hook part, 7...--JIX hand, 8...-Wafer collection (carrier, 9...--Nitrogen carrier, lo...・
. . . wafer storage carrier, 11 . . . empty carrier. Agent Patent Attorney Uchi Hara Oto Figure 2 Figure 3 (A) 4 Figure 2 A5 / (of) (b) Figure 6 c death) ■ (b) District 7

Claims (1)

[Claims] In order to store a number of semiconductor wafers on a flat surface with a space between them, a plurality of grooves each having a V-shaped cross section are formed facing each other, and the semiconductor wafers can freely pass through the grooves. A semiconductor wafer processing method comprising a semiconductor wafer carrier and a jig that allows the semiconductor wafer carrier and the stored semiconductor wafer to be carried at the same time.