JPS6040970Y2 - integrated magnetic head - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to integrated magnetic heads made by thin film technology.

[Prior Art] Conventionally, an integrated magnetic head used in, for example, a fixed head type magnetic drum device, as shown in FIG. , a magnetic core consisting of a conductor layer 2 forming a coil and wiring, a lower magnetic layer 3 and an upper magnetic layer 4, and an insulating layer 5 forming a gap, and is batch-processed on a Si wafer. .

Since this batch processing is performed using a mask technique such as photoetching, the precision of each magnetic head in the wafer state can be very high.

On the other hand, the thickness of the substrate 1 used for these is generally 20
It is about 0 to 400μ and is weak in strength.

Therefore, chips or strips are cut from the wafer using a cutting tool, and ceramics such as alumina or steatite are used to supplement the strength of the magnetic head itself and to increase the number of floating blades when attached to a magnetic drum device and operated. It is embedded or sandwiched in a so-called slider.

The size of this l-chip or strip-shaped laminate is arbitrarily determined depending on the size of the polisher, etc., but for example, several meters of magnetic heads are arranged in a horizontal line in one chip. .

The slider surfaces and head gap surfaces of these several w magnetic heads embedded in the slider are polished simultaneously and in the same manner, and finally they are separated into individual magnetic heads.

However, during these processes, the distance from the head tip to the terminal on the head tip side of conductor layer 2, that is, the gap depth dimension, may be distorted due to variations during scribing, or the position of the head tip and slider surface may be adjusted before polishing. Since alignment cannot be performed correctly every time, each chip is different.

That is, it is difficult to suppress the gap depth after polishing with good reproducibility for all chips, and this causes large variations in writing and reading characteristics.

In addition, polishing often extends to the coil portion (conductor layer 2), which inevitably increases the gap width, lowers writing efficiency, and often causes defects.

In fact, the core dimensions at the tip of the head and the outermost end of the coil are several tens of microns.
Therefore, the yield decrease due to excessive polishing is large.
Although it is desired to check the dimensions of the core by sampling it during polishing, it is difficult to check because it is covered with an opaque ceramic slider.

In other words, while the gap depth is several tens of microns, when separating the integrated magnetic head with a guiding tool, an error of ±10 to 20 microns will occur due to misalignment in setting, etc., so correction by polishing is necessary. It becomes necessary.

In this case, in the prior art, it was considered to set the integrated magnetic head on an opaque slider, but it is difficult to confirm how much correction by polishing would be necessary to ensure the desired gap depth. There was a problem.

〔the purpose〕

The present invention provides an integrated magnetic head that allows accurate polishing amount at the end of the head to be confirmed by providing the integrated magnetic head with a shaft center and setting the integrated magnetic head on a transparent slider.

〔Example〕

FIG. 2 shows a schematic cross-sectional view taken along line 1-a' in FIG.

First, by repeating oxidation, photoetching, and diffusion, a first insulating layer 8 made of SiO2 of about 5000 A was formed on the surface of the Si substrate 1 on which the diode peripheral circuit 6 was formed by thermal oxidation.

Next, 3.5 μm of permalloy was deposited by vapor deposition and plating, and this was selectively etched to form the lower magnetic layer 3.

Subsequently, 100OOA of vapor phase growth 5in2 was deposited to form the second insulating layer 10, and a hole for taking out the diode electrode was formed. Then, approximately 1.5μ of A1 was deposited, and conductors necessary for the coil and wiring were selectively etched. Layer 2 remained.

2a is a diode lead line, which is formed simultaneously with the conductor layer 2.

Vapor-phase grown SiO2 was deposited again to form the third insulating layer 12, but the vapor-phase grown SiO2 in the region 13 was removed by selective etching to expose a part of the lower magnetic layer 3, and then the same process as above was performed. If permalloy is deposited to form the upper magnetic layer 4, this will be directly connected to the lower magnetic layer 3 at the region 13.

Next, as shown in FIG.
5 was sandwiched between transparent inorganic glass 16 and sealed with glass, and then the slider surface and head gap surface were diamond polished.

In this polishing, three integrated magnetic heads were assembled into one chip and sandwiched between a transparent glass slider.
These 3 o @ integrated magnetic heads were simultaneously polished and the polished amount was confirmed using a microscope.

In the present invention, as shown in FIG. 4, when manufacturing the diode, photo-etching is applied to the vicinity of the magnetic core formed by the upper magnetic layer 4 and the lower magnetic layer (not shown) on the surface of the substrate 1. An axis 17 indicating an appropriate gap depth is formed along the gap depth direction so that the optimum gap depth can be determined at a glance.

Therefore, by performing the polishing process based on the center of the shaft, the problem of over-polishing can be solved and variations in the gap depth can be kept constant.

Therefore, a high-performance magnetic head could be provided at low cost.

Furthermore, in this case, the center shaft 17 is formed during photoetching for diode production, but the subsequent patterning of the core and magnetic material is a repeating pattern based on alignment marks, etc. used during normal semiconductor fabrication. Therefore, the mask alignment error is within the range of 0.5 to 1 μ at most.

That is, even if the mask used to form the inside of the shaft is different from the mask used to form the magnetic material or the core, this does not affect the role played by the inside of the shaft.

〔effect〕

As described above, the present invention provides an integrated magnetic head formed by photo-etching and having a structure embedded or sandwiched in a slider, in which a part of the slider overlapping at least the core forming side of the integrated magnetic head is formed of a transparent material, An axial center formed by photo-etching is provided on the surface of the substrate of the integrated magnetic head near the magnetic core, and the axial center is set to a length that indicates an appropriate gap depth, so that the magnetic head has a standard gap. It is possible to easily confirm that the magnetic head has a certain depth, and a highly accurate magnetic head can be provided.

Furthermore, the distance between the axes formed by photo-etching has high positional accuracy, and since it is formed as part of the photo-etching process of the magnetic head, special work such as gluing is not required for marking, reducing costs. This contributes to miniaturization.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram of the collecting head. FIG. 2, FIG. 3, and FIG. 4 are schematic diagrams according to the present invention. 1...Substrate, 2...Conductor layer, 3...
...Lower magnetic body, 4...Top magnetic body, 5...
...Insulating layer, 6...Circuit, 8...
First insulating layer, 10... Second insulating layer, 12.
...Third insulating layer, 15... Integrated magnetic head chip, 16... Slider, 17...
...Between axes.

Claims (1)

[Scope of utility model registration request] a strip-shaped lower magnetic layer extending perpendicularly from the edge of the substrate;
A conductor layer that intersects with the lower magnetic layer and forms a coil, and an upper magnetic layer formed over the lower magnetic layer with the conductor layer in between are sequentially laminated on the substrate by photoetching. The lower magnetic layer and the upper magnetic layer are directly bonded to each other at one end, and an insulating layer is sandwiched at the other end to form a gap. In an integrated magnetic head having a structure in which the body is embedded or sandwiched in a slider, a part of the slider on the laminated surface side of the chess board is formed of a transparent material, and the photoetching is performed on the surface of the laminated surface of the substrate. 1. An integrated magnetic head, characterized in that a shaft is formed by machining, the shaft extends along the depth direction of the gap, and is set to a length that indicates an appropriate gap depth.