JPS6040305Y2 - Deburring device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a burr removal device, and more particularly to a burr removal device for removing burrs generated when molding a sealing resin in the manufacturing process of semiconductor devices.

- Generally, in the manufacturing process of a semiconductor device, after molding an element with resin, a burr 3 is generated on the lead wire of the mold part 2 of the semiconductor device 1, as shown in FIG. 1, but this burr 3 is removed. There is a need to.

An example of a conventional scraping device of this type is shown in FIG.

In FIG. 2, molded semiconductor devices 1 are sequentially supplied onto a conveyor 4, supported at both ends by an upper conveyor 5, and conveyed at a constant pitch. The burrs are removed by spraying abrasive grains from six groups of nozzles provided above.

When carrying out this deburring process, the arm 7 moves over the mold part 2 to prevent the surface of the mold part 2 from being damaged by abrasive grains being sprayed not only on the part where the burrs 3 are generated but also on the mold part 2. Each mask is protected by eight groups of masks fixed together.

However, in the conventional scraping device, the mold part 2 of the semiconductor device is ejected from the mask 8 due to errors in the position of the elements during mold processing of the semiconductor device, movement and wear of the conveyors 4 and 5, etc. Sisters,
There is a drawback that the abrasive grains are sprayed from the nozzle 6 and are damaged.

SUMMARY OF THE INVENTION An object of the present invention is to provide a deburring device that can reliably remove only burrs without damaging areas that require protection, such as the mold portion of a semiconductor device.

Embodiments of the present invention will be described below with reference to the drawings.

3 to 5 showing an embodiment of the present invention, the deburring device includes a bed 11, a conveyor 12, a pair of upper and lower groove-shaped guides 13A and 13B, and a guide block 1.
4, a cylinder 15, and a pair of left and right sprockets 16A as a conveyance mechanism.

16B, a pair of front and rear mask wheels 17A and 17B as a mask group alignment body, a pair of front and rear nozzles 18A and 18B, and a conveyor 19.

The conveyor 12 is placed on the front left side of the bed 11.
They are laid in the lateral direction of the semiconductor devices 1, and the semiconductor devices 1 are transported at a constant pitch in an upright state.

Groove-shaped guides 13A and 13B are respectively cut in the longitudinal direction of the bed 11 at the rear end of the conveyor 12, and when the semiconductor devices 1 that are sequentially sent out from the conveyor 12 are placed in an upright position, the receivers are placed in a pair. This guides the sliding movement.

Further, the guide block 14 is adapted to slide into contact with one end surface of the semiconductor device guided by the guides 13A and 13B to assist in guiding.

The cylinder 15 is installed on the left end extension line of the guides 13A and 13B, and the semiconductor device 1 held by the guides 13A and 13B is pushed out and conveyed by a contact plate 15B attached to the tip of the piston rod 15A. .

The pair of sprockets 16A and 16B are mask wheels 18.
They are arranged symmetrically on the left and right sides of B and are rotatably supported on the bed 1, respectively.

As shown in FIG. 4, this sprocket 16A (16
Same goes for B.

) are adapted to engage small feeding holes 20 arranged in parallel at a constant pitch along the edges at both ends of the frame of the semiconductor device 1, and to transport the semiconductor device 1 as the holes rotate.

A pair of mask rings 17A, 17B are disposed symmetrically in front and back with the semiconductor device in between, and their axes 21A, 21B are supported rotatably on a horizontal plane on the bed 1, and
They are rotated in opposite directions by a drive motor 22 serving as a drive mechanism.

These mask wheels 17A, 17B are interlocked with the sprockets 16A, 16B via a gear group 23,
Therefore, the circumferential speed of the mask wheels 17A, 17B and the feed speed of the semiconductor device are synchronized.

Also, mask ring 17A. As shown in FIG. 5, a large number of window holes 24 are bored at equal intervals in the peripheral wall of 17B, and the peripheral wall between adjacent window holes 24 forms a mask portion 25. There is.

The window holes 24 in the pair of mask wheels 17A, 17B are opposed to each other due to the synchronous rotation of both wheels 17A, 17B.

A pair of nozzles 18A, 18B are a pair of mask rings 17A,
17B, and are oriented so that the injection ports face each other so that the abrasive grains 26 can be sprayed onto the semiconductor device through the window hole 24 of the mask ring.

The conveyor 19 is installed below the terminal ends of the guides 13A and 13B, and is adapted to receive the semiconductor devices of the guides 13A and 13B.

The operation of the scraping device having the above configuration will be explained.

The molded semiconductor devices are sequentially transported in an upright state by the transport conveyor 12 from the previous step, and both ends of the semiconductor devices are slidably fitted into the guides 13A and 13B at the rear end.

Both semiconductor devices are R13A. 13B, the cylinder 15 operates and pushes the semiconductor device 1 to the right.

Sprocket) 1 into the small hole 20 of the extruded Z semiconductor device 1
When the teeth 6A are engaged, the semiconductor device 1 will be transported by the rotation of the sprocket 16A.

When the semiconductor device 1 is transported and reaches between the mask wheels 17A and 17B, the mask wheels 17A and 17B, which rotate in conjunction with the sprocket 16A, rotate in synchronization with the movement of the semiconductor device 1, and the gap between the adjacent window holes 24 and 24 is The mask part 25 contacts each molding 1 part 2 and sequentially covers them.

When this mask part 25 covers the mold part 2,
As shown in FIG. 5, the window holes 24
.

After the burrs have been removed in this way, as the semiconductor device 1 advances, its small hole 20 engages with the other sprocket 16B, and the conveyance is interrupted by this sprocket 16B, and the burrs 3 in all mold parts 2 are removed. When it is done, it is placed on the conveyor 19 and transported to the next process.

As explained above, according to the present invention, since the semiconductor feeding is synchronized using the rotation of the mask ring,
The positioning accuracy between the mask portion and a portion that requires protection, such as a mold portion of a semiconductor device as a workpiece, is increased, and therefore damage to the portion that requires protection can be reliably prevented.

[Brief explanation of drawings]

FIG. 1 is a plan view showing an example of a semiconductor device, FIG. 2A,
B and C are a front view, side view, and plan view of a conventional deburring device; FIGS. 3A and B are a front view and a plan view showing an embodiment of the present invention; FIGS. 4A and B are enlarged views of main parts. A front view, a side view, and FIG. 5 are enlarged plan sectional views of main parts. 1... Semiconductor device (workpiece), 2...
・Mold part (points requiring protection), 3...burrs,
13A, 13B... Guide, 16A, 16B.
...Sprocket, 17A, 17B...
Mask ring (mask group array), 18A, 18B...
...Nozzle, 2o...Small hole.

Claims (1)

[Scope of utility model registration request] In a deburring device for deburring a workpiece that alternately has areas that require protection and areas that require deburring at a constant pitch, a conveyance mechanism that conveys the workpiece along a guide; A pair of masks that are provided facing the conveyance path of the workpiece, have a large number of window holes and mask parts arranged alternately at intervals equal to the pitch of the workpiece, and rotate in synchronization with the feed speed of the workpiece. a drive mechanism that rotates the mask wheel; and a nozzle that is provided opposite to the window holes in the pair of mask shafts and sprays abrasive grains through the window holes to the portions of the workpiece that need to be scraped. Debris removal device.