JPS604012A - Mold - Google Patents

Mold

Info

Publication number
JPS604012A
JPS604012A JP11224583A JP11224583A JPS604012A JP S604012 A JPS604012 A JP S604012A JP 11224583 A JP11224583 A JP 11224583A JP 11224583 A JP11224583 A JP 11224583A JP S604012 A JPS604012 A JP S604012A
Authority
JP
Japan
Prior art keywords
cooling
materials
mold
forces
cooling device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11224583A
Other languages
Japanese (ja)
Inventor
Masakazu Watanabe
政和 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP11224583A priority Critical patent/JPS604012A/en
Publication of JPS604012A publication Critical patent/JPS604012A/en
Pending legal-status Critical Current

Links

Landscapes

  • Molds, Cores, And Manufacturing Methods Thereof (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PURPOSE:To improve the cooling effect of both forces to reduce molding time by placing materials with heat conductivity higher than force metal such as iron, special steel, etc. on one side of said materials and providing a cooling device such as a cooling pipe in said materials. CONSTITUTION:Materials 2 with conductivity higher than copper is provided on one side of each force 1 composed of iron, special steel, etc. and a cooling device 3 such as a cooling pipe is equipped in the materials 2 to enable the forces to be cooled. The cooling device 3 such as a cooling pipe, etc. is provided not only in the bottom force 4 but in the top force 5 of the same structure if necessary. The cooling device 3 such as a cooling pipe, etc. is provided in material 2 of copper, etc. with heat conductivity higher than the forces 1 that is incorporated in a unitary body with the forces 2 to improve cooling efficiency and to enable the forces to be cooled fully through surfaces of materials 2 high in cooling effect, and therfore it is made possible to perform uniform cooling, reduce molding time and improve productivity remarkably.

Description

【発明の詳細な説明】 本発明は鉄、特殊鋼等金型を形成する物質の一面に該物
質よりも、よシ熱伝導率の高い物質を設け、該物質中に
冷却管等の冷却装置を設けて形成した事を特徴とする金
型に関するものである。
Detailed Description of the Invention The present invention provides a material having a higher thermal conductivity than the material on one side of the material forming the mold, such as iron or special steel, and a cooling device such as a cooling pipe in the material. The present invention relates to a mold characterized in that it is formed by providing.

従来より金型を用いたグラスチックス等の成型品の生産
性を高める為種々なる方策が講じられてきたが、種々な
る方策が講じられた結果、現在ではその限界効率を超え
て更にそのショツト時間を短縮する事は極めて困難な状
態となシ、現在の限界的効率から更にそのショツト時間
を1秒短縮する事すら至難とさえ云れている。
Various measures have been taken to increase the productivity of molded products such as glasstics using molds, but as a result of these various measures, it is now possible to exceed the marginal efficiency and further shorten the shot time. It is extremely difficult to shorten the shot time, and it is even said that it is extremely difficult to shorten the shot time by even one second from the current marginal efficiency.

本発明の目的とする処は、斯る点に鑑み種々辛苦研究、
実験の結果鉄、特殊鋼等金型を形成する金属等の物質の
一面に該物質よp1熱伝導率の高い物質を設け、該物質
中に冷却管等の冷却装置を設けて金型の冷却効果を高め
て成型時間を短縮し、生産性を高め得ると共に均一な冷
却が出来且つ省エネルギーにもつながる極めて有効、適
切な金型を提供する事にある。
In view of this, the purpose of the present invention is to carry out various painstaking researches,
As a result of the experiment, a material with higher P1 thermal conductivity than the material was placed on one side of the metal material that forms the mold, such as iron, special steel, etc., and a cooling device such as a cooling pipe was installed in the material to cool the mold. The object of the present invention is to provide an extremely effective and appropriate mold that can improve effectiveness, shorten molding time, and increase productivity, as well as uniform cooling and energy savings.

更に之を図面に示す実施の一例に就いて説明すると鉄、
特殊鋼等で形成される金型1の一面に調停金型1を形成
する物質よシも、よシ熱伝導率の高い物質2を設け、該
物質2中に冷却管等の冷却装置3を設けて金型を冷却し
得るように構成せしめて成るものである。而して冷却管
等の冷却装置3は下型4のみならず、必要に応じて第2
図に示す如く同一構成の上型5にも設けるものである。
Further, to explain an example of implementation shown in the drawings, iron,
A material 2 having a higher thermal conductivity than the material forming the mediation mold 1 is provided on one surface of the mold 1 made of special steel, etc., and a cooling device 3 such as a cooling pipe is installed in the material 2. The mold is constructed such that it can be installed to cool the mold. Therefore, the cooling device 3 such as a cooling pipe is used not only for the lower mold 4 but also for the second mold as necessary.
As shown in the figure, it is also provided in the upper mold 5 having the same structure.

而して図中符号6は所望の成品の彫型、7は射出成型機
等の金型取付板である。
The reference numeral 6 in the figure is a mold of the desired product, and the reference numeral 7 is a mold mounting plate for an injection molding machine or the like.

本発明は叙上の如く金型に接合−堡的に形成された金型
1よシもよシ熱伝導率の高い銅等の物質2面中に冷却管
等の冷却装置3を設けて、冷却効果を高めると共に冷却
効果の高い物質2mを介して金型を全面的にて冷却し得
るので均一な冷却ができ且つ成型時間を短縮して生産性
を著るしく高め得上省エネルギともなる等その効果は大
なるものがある。
As described above, the present invention provides a cooling device 3 such as a cooling pipe in the 2 surfaces of a material such as copper which has a higher thermal conductivity than the mold 1 which is bonded to the mold and formed as a barrier. In addition to increasing the cooling effect, the mold can be cooled over the entire surface through 2 meters of material with high cooling effect, which allows for uniform cooling, shortens molding time, significantly increases productivity, and saves energy. The effects are great.

【図面の簡単な説明】[Brief explanation of the drawing]

図は本発明の一実施例を示すもので第1図は斜視図、第
2図は金型部ffi[面した説明図である。 1・・・金型、2−・・よシ熱゛伝導率の高い物質、3
−・冷却管等の冷却装置、4・・・下型、5・・・上型
、6・・・所望の成型品の彫型。
The drawings show one embodiment of the present invention, and FIG. 1 is a perspective view, and FIG. 2 is an explanatory view facing the mold part ffi. 1... Mold, 2-... Substance with higher thermal conductivity, 3
- Cooling device such as a cooling pipe, 4... Lower mold, 5... Upper mold, 6... Carving of desired molded product.

Claims (1)

【特許請求の範囲】[Claims] 鉄、特殊鋼等金型を形成する物質の一面に該物質よシも
、よシ熱伝導率の高い物質を設け、該物質中に冷却管等
の冷却装置を設けて形成した事を特徴とする金型。
The mold is formed by providing a material with a higher thermal conductivity than the material on one side of the material forming the mold, such as iron or special steel, and providing a cooling device such as a cooling pipe in the material. mold.
JP11224583A 1983-06-22 1983-06-22 Mold Pending JPS604012A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11224583A JPS604012A (en) 1983-06-22 1983-06-22 Mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11224583A JPS604012A (en) 1983-06-22 1983-06-22 Mold

Publications (1)

Publication Number Publication Date
JPS604012A true JPS604012A (en) 1985-01-10

Family

ID=14581870

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11224583A Pending JPS604012A (en) 1983-06-22 1983-06-22 Mold

Country Status (1)

Country Link
JP (1) JPS604012A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01143738A (en) * 1987-11-30 1989-06-06 Hitachi Metals Ltd High thermal conductivity complex die
JPH0310814A (en) * 1989-06-09 1991-01-18 Asahi Tec Corp Mold and its manufacture
JPH05115726A (en) * 1990-10-29 1993-05-14 Trw Vehicle Safety Syst Inc Filter
JPH06285937A (en) * 1993-03-31 1994-10-11 Seikosha Co Ltd Injection molding machine
EP1758721A1 (en) * 2004-06-11 2007-03-07 Samsung Electronics Co., Ltd. Mold apparatus
JP2008114235A (en) * 2006-11-01 2008-05-22 Aru Work Kk Die casting apparatus, sleeve, chill vent, and die casting method
US7445746B2 (en) * 2003-12-12 2008-11-04 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Temperable member

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51105359A (en) * 1975-03-13 1976-09-17 Nippon Soken Kk Kanagatanokanetsu mataha reikyakuhoho

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51105359A (en) * 1975-03-13 1976-09-17 Nippon Soken Kk Kanagatanokanetsu mataha reikyakuhoho

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01143738A (en) * 1987-11-30 1989-06-06 Hitachi Metals Ltd High thermal conductivity complex die
JPH0310814A (en) * 1989-06-09 1991-01-18 Asahi Tec Corp Mold and its manufacture
JPH05115726A (en) * 1990-10-29 1993-05-14 Trw Vehicle Safety Syst Inc Filter
JPH06285937A (en) * 1993-03-31 1994-10-11 Seikosha Co Ltd Injection molding machine
US7445746B2 (en) * 2003-12-12 2008-11-04 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Temperable member
EP1758721A1 (en) * 2004-06-11 2007-03-07 Samsung Electronics Co., Ltd. Mold apparatus
EP1758721A4 (en) * 2004-06-11 2009-04-29 Samsung Electronics Co Ltd Mold apparatus
JP2008114235A (en) * 2006-11-01 2008-05-22 Aru Work Kk Die casting apparatus, sleeve, chill vent, and die casting method

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