JPS6039984B2 - Inspection method for integrated circuit devices - Google Patents

Inspection method for integrated circuit devices

Info

Publication number
JPS6039984B2
JPS6039984B2 JP51156491A JP15649176A JPS6039984B2 JP S6039984 B2 JPS6039984 B2 JP S6039984B2 JP 51156491 A JP51156491 A JP 51156491A JP 15649176 A JP15649176 A JP 15649176A JP S6039984 B2 JPS6039984 B2 JP S6039984B2
Authority
JP
Japan
Prior art keywords
output
integrated circuit
test
expected
circuit devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP51156491A
Other languages
Japanese (ja)
Other versions
JPS5380975A (en
Inventor
英二 和田
陽一 浅野
芳和 鈴村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP51156491A priority Critical patent/JPS6039984B2/en
Publication of JPS5380975A publication Critical patent/JPS5380975A/en
Publication of JPS6039984B2 publication Critical patent/JPS6039984B2/en
Expired legal-status Critical Current

Links

Description

【発明の詳細な説明】 本発明は集積回路装置の検出方法に関するもある。[Detailed description of the invention] The present invention also relates to a method for detecting an integrated circuit device.

従来、ディジタルIC(LSI)を検査する場合、ディ
ジタルICの初期状態を設定したうえで所定の出力が得
られるか否かを判定する方法がとられた。
Conventionally, when testing a digital IC (LSI), a method has been used in which the initial state of the digital IC is set and then it is determined whether a predetermined output is obtained.

しかし、ディジタルICのなかには、外部から初期状態
を設定することのできないものがある。
However, some digital ICs cannot have their initial states set externally.

例えば、ICのうちの一つのフリップフロツプの初期状
態が、ある一つの状態がその反転状態かをとり、そのい
ずれの状態をとるかによって出力パターンが二種類予想
され、さらにその初期状態を外部から設定することが不
可能乃至困難である場合、一つの期待値とそのディジタ
ルICの出力とを比較しただけでは正しく検査すること
ができない。したがって本発明は内部状態が不確定で、
複数種類の出力パターンが予想される集積回路装置を最
少限のテスト工程で正しく検査できるよにすることを目
的とするものである。
For example, one of the initial states of a flip-flop in an IC is its inverse state, and depending on which state it takes, two types of output patterns are expected, and the initial state can be set externally. If it is impossible or difficult to do so, it is not possible to perform an accurate test simply by comparing one expected value with the output of the digital IC. Therefore, in the present invention, the internal state is uncertain,
The purpose of this invention is to enable an integrated circuit device in which a plurality of types of output patterns are expected to be correctly tested with a minimum number of test steps.

上記目的を達成するための本発明の一実施態様は、初期
状態を外部から設定することのできない回路を含み「そ
の初期状態の如何によって複数種類の出力パターンが生
じる半導体集積回路装置の検査方法において、検査回路
系に上記各出力パターンが得られる複数の基準用回路を
設け、被検査半導体集積回路装置の出力を上記各基準用
回路の出力と同時に比較し、いずれかの基準用回路の出
力と一致しているか杏かを検査することを特徴と0する
ものである。
One embodiment of the present invention to achieve the above object is to provide a method for testing a semiconductor integrated circuit device that includes a circuit whose initial state cannot be set externally and produces multiple types of output patterns depending on its initial state. , a plurality of reference circuits from which each of the above output patterns can be obtained is provided in the test circuit system, and the output of the semiconductor integrated circuit device under test is simultaneously compared with the output of each of the above reference circuits, and the output of any of the reference circuits is compared with the output of any of the reference circuits. The feature is to check whether it matches or not.

以下本発明を実施例により説明する。The present invention will be explained below with reference to Examples.

第1図は本発明の一実施例を示す回路図である。FIG. 1 is a circuit diagram showing one embodiment of the present invention.

1‘ま被検査ICに予想される一つの出力パタータンが
得られるパルスゼネレータPOI,2は被検査ICに予
想される他の出力パターンが得られるパルスゼネレータ
PG2である。
1' is a pulse generator POI which can obtain one output pattern expected from the IC to be tested, and 2 is a pulse generator PG2 which can obtain another output pattern expected from the IC to be tested.

3は検査の対象となる被検査ICである。3 is an IC to be inspected.

4,5は被検査ICの出力とパルスゼネレー夕PG1,
2の出力とを比較0するように接続した排他的論理和回
路6,7は特定の周期を有するストローブ信号によって
上記排他的論理和回路の出力をサンプルするためのAN
D回路、8,9は排他的論理和回路4,5の出力を一時
的に記憶するFail Memory(FM1、タFM
2)、10はFMIの出力とFM2の出力との論理債出
力を得るためのAND回路である。
4 and 5 are the output of the IC under test and the pulse generator PG1,
EXCLUSIVE OR circuits 6 and 7 connected so as to compare the outputs of EXCLUSIVE OR circuits 2 and 2 to 0 are connected to an AN for sampling the output of the EXCLUSIVE OR circuits using a strobe signal having a specific period.
D circuits 8 and 9 are Fail Memory (FM1,
2), 10 is an AND circuit for obtaining a logic bond output of the output of FMI and the output of FM2.

通常のファンクションテスタ(機能試験器)では一種類
の期待値しかないものしか対象としないのでパルスゼネ
レータ「比較回路はそれぞれ一個ずつしか有しないが、
本実施例においては二種類の期待値すなわち出力パター
ンが二種類予想されるIC3を検査するものであるから
「期待値パターンの種類に応じて2個のパルスゼネレー
タ「 2個の比較回路および2個のフィルメモリを設け
ることによって検査回路系を2個設けも被検査にの一つ
の出力を2個の検査回路系で同時に検査し、いずれか一
方の検査回路系による試験で合格すれば良品と判定しち
双方の検査回路系で不合格とされた場合のみ不良品と判
定するのである。
Since a normal function tester (function tester) only targets items that have only one type of expected value, the pulse generator "each has only one comparison circuit, but
In this embodiment, since two kinds of expected values, that is, two kinds of output patterns are expected to be tested, the IC 3 is tested, so "two pulse generators, two comparison circuits, and two pulse generators are used depending on the types of expected value patterns." Even if two test circuit systems are installed by providing a fill memory, one output of the test target can be simultaneously tested by the two test circuit systems, and if it passes the test with either test circuit system, it is judged as a good product. Only when both inspection circuit systems fail, the product is determined to be defective.

これによって〜内部状態が不確定で〜複数種類の出力パ
ターンが予想されもかつ、初期状態を設定できない半導
体集積回路装置を一回の試験工程で検査することができ
る。第2図におけるタイムチャートの一例を示す。
As a result, a semiconductor integrated circuit device whose internal state is uncertain, where multiple types of output patterns are expected, and whose initial state cannot be set can be tested in a single test process. An example of the time chart in FIG. 2 is shown.

PO亀の波形は一つの出力パターンに従って変化し、P
G2の波形は他の出力パターンに従って変化する。そし
て、被検査ICの出力パターンがPO竃とPG2のいず
れかの出力パターンに合致すれば良品といえるのである
。良品1の場合はPG2と合致し」良品2の場合はPG
Iと合致している。それに対して、不良品の場合はPG
軍ともPG2とも合致しないので、fail信号がAN
D回路6と ,7の双方から検出され「その結果として
AND回路亀0から不良品であることを表示する信号が
得られる。このような検査方法によれば、たとえば内部
の不確定な半導体集積回路装置に対して外部の同期回路
等を必要とすることなく一回の試験工程で検査できる。
The waveform of the PO turtle changes according to one output pattern, and the P
The waveform of G2 changes according to the other output patterns. If the output pattern of the IC to be inspected matches the output pattern of either PO or PG2, it can be said to be a good product. If it is a good product 1, it matches PG2.If it is a good product 2, it is PG.
It is consistent with I. On the other hand, in the case of defective products, PG
Since it does not match with the military or PG2, the fail signal is AN.
D circuits 6 and 7 are detected, and as a result, a signal is obtained from AND circuit 0 indicating that the product is defective. The circuit device can be tested in a single test process without requiring an external synchronous circuit or the like.

なおも上記実施例において予想される出力パターンの種
類が二種類のものを対象とするが、三種類以上の出力パ
ターンの予想されるものに対してもその穣類に応じた数
の検査回路系を用意することにより同様に検査できるも
のである。
Although the above embodiment deals with a case where two types of output patterns are expected, the number of test circuit systems corresponding to the types of test circuits that are expected to have three or more types of output patterns is also applied. The same test can be performed by preparing the following.

【図面の簡単な説明】[Brief explanation of drawings]

第亀図は本発明の一実施例に係る検査回路図、第蜜図は
タイムチャート図である。 軍亀 傘……パルスゼネレ叫夕(PG)「 3……被検
査IC「 鶴, 5・・・・・・排他的論理和回路「
6,7……AND回路、89 9 …・・・Fail
Memory(FM入 事瞳……不良信号tA……第1
の検査回路系、B・・・・・・第2の検査回路系。 髪〆図 努Z図
The first diagram is a test circuit diagram according to an embodiment of the present invention, and the second diagram is a time chart diagram. Military Turtle Umbrella...Pulse General Shout (PG) ``3...IC to be tested''Tsuru, 5...Exclusive OR circuit''
6, 7...AND circuit, 89 9...Fail
Memory (FM entry Hitomi...Failure signal tA...1st
test circuit system, B...second test circuit system. Hair end drawing Tsutomu Z drawing

Claims (1)

【特許請求の範囲】[Claims] 1 内部状態に対応して複数の出力パターンを生じる集
積回路装置の検査方法であつて、上記集積回路装置の出
力端子に上記複数の出力パターンのうち一つに対応する
信号が出力されるか否かを検査する集積回路装置の検査
方法。
1. A method for testing an integrated circuit device that generates a plurality of output patterns in response to an internal state, the method comprising: determining whether a signal corresponding to one of the plurality of output patterns is output to an output terminal of the integrated circuit device; A method for testing integrated circuit devices.
JP51156491A 1976-12-27 1976-12-27 Inspection method for integrated circuit devices Expired JPS6039984B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51156491A JPS6039984B2 (en) 1976-12-27 1976-12-27 Inspection method for integrated circuit devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51156491A JPS6039984B2 (en) 1976-12-27 1976-12-27 Inspection method for integrated circuit devices

Publications (2)

Publication Number Publication Date
JPS5380975A JPS5380975A (en) 1978-07-17
JPS6039984B2 true JPS6039984B2 (en) 1985-09-09

Family

ID=15628907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51156491A Expired JPS6039984B2 (en) 1976-12-27 1976-12-27 Inspection method for integrated circuit devices

Country Status (1)

Country Link
JP (1) JPS6039984B2 (en)

Also Published As

Publication number Publication date
JPS5380975A (en) 1978-07-17

Similar Documents

Publication Publication Date Title
US5592077A (en) Circuits, systems and methods for testing ASIC and RAM memory devices
US20010005143A1 (en) Configuration for measurement of internal voltages in an integrated semiconductor apparatus
US6931346B2 (en) Method and apparatus for reduced pin count package connection verification
JPS6039984B2 (en) Inspection method for integrated circuit devices
JP2002074986A (en) Dc test device and semiconductor memory
US4358847A (en) Electrical circuit test apparatus and method
US6738940B1 (en) Integrated circuit including a test signal generator
JPH10505683A (en) Method of testing an electronic circuit by logically combining clock signals and electronic circuit equipped with such a test mechanism
JP3934384B2 (en) Semiconductor device test equipment
JP3058130B2 (en) Test circuit for high-speed semiconductor integrated circuit devices
JP4129723B2 (en) Integrated circuit test apparatus and analog waveform measurement method
US5191281A (en) IC tester capable of changing strobe position in accordance with a predetermined reference signal
Li et al. IEEE standard 1500 compatible interconnect diagnosis for delay and crosstalk faults
JP2730504B2 (en) Test probe pin contact failure judgment method and in-circuit tester
US20030062917A1 (en) Semiconductor inspection device
JP4209561B2 (en) Semiconductor test program execution method for semiconductor test equipment
JPH0465684A (en) Test device for semiconductor integrated circuit
JP2833537B2 (en) Integrated circuit test equipment
JP2944307B2 (en) A / D converter non-linearity inspection method
SU809185A1 (en) Device for functional testing microelectronic assemblies
JPH03138579A (en) Testing device for digital ic
JPS59105570A (en) Apparatus for testing logical circuit
JPS6398576A (en) Waveform pattern generator
JP3340459B2 (en) Signal determination device and signal determination method
JPS5950944B2 (en) Digital integrated circuit function tester