JPS603990A - Laser working device - Google Patents

Abstract

PURPOSE:To maintain a specified focal length of laser light and to enable laser working at a uniform working width by irradiating the laser light to a material to be worked under the tension kept exerted thereto thereby working the material. CONSTITUTION:The laser light 2 oscillated from a CO2 laser oscillator 1 is focused onto a metallic plate 5 to be cut by a bend mirror 3, a condenser head 4, etc. The corrugated plate 5 is fixed with the tension exerted on both sides thereof by metallic plate fixing devices 7A, 7B attached to NC table heads 6A, 6B. The plate 5 is corrected to the plane shape removed of the corrugation by such tension from the right and left, by which the distance between the plane plate 5 and the head 4 is made constant. The laser light 2 from the hear 4 is thus uniformly irradiated to the plate 5 and the plate 5 is cut approximately at a specified width.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention particularly relates to a laser processing method for cutting plate materials such as metal plates, non-metal plates such as acrylic plates, etc. using laser light.

[Background of the invention]

Conventionally, when cutting a deformed workpiece, such as a metal plate, using a laser beam, the metal plate is placed on a mounting table, and the space between one end of the metal plate and the mounting table is fixed 4! Fixed by position. In this fixing device, the laser beam from the laser generator is bent in a right angle direction by a bending mirror. A focusing lens is placed between the bending mirror and the metal plate. The laser beam that has passed through the focusing lens irradiates the part of the metal plate to be cut.

However, deformed metal plates such as unevenness, bends, etc.
Alternatively, if a long metal plate, metal foil, etc. is irradiated with laser light,
The disadvantage is that the focal length between the focusing lens and the deformed metal plate varies, resulting in the cutting width being narrow, wide, or uneven.

[Purpose of the invention]

An object of the present invention is to provide a laser processing method in which the cutting width of the cutting portion is approximately uniform.

[Summary of the invention]

The processing method of the present invention applies tension to the workpiece from the left and right sides to correct deformation of the workpiece, and then irradiates the workpiece with laser light to process, for example, cut the workpiece.

By hardening, etc., the focal length becomes approximately constant, and the processing width can be made uniform.

[Embodiments of the invention]

Embodiments of the present invention will now be described with reference to FIGS. 1 and 2.

A laser beam 2 oscillated by a carbon dioxide laser oscillator 1 is bent by a bending mirror 3, condensed by a condensing head 4 having a condensing lens, and is cut into a wavy shape approximately at its focal point. A metal plate 5 is arranged. On the other hand, the metal plate 5 is fixed by applying tension from both sides by metal plate fixing devices 7A and 7B attached to NC table heads 6A and 6BK, which are moved arbitrarily by an NC control device (not shown).

Next, to explain the cutting method of the present invention, before irradiating the metal plate 5 with the laser beam 2, the corrugated metal plate 5 is cut by the fixing device ff.
, 7A, and 7B, tension is applied to the left and right sides to correct the flat metal plate 5 from which the corrugations have been removed. As a result, the distance between the planar metal plate 5 and the focusing head 4 becomes a constant distance, so that the laser beam 2 from the focusing head 4 uniformly irradiates the planar metal plate 5. Therefore, the cutting width when cutting the metal plate 5 can be cut to a constant width, so
Good appearance.

Furthermore, when cutting the elongated member 8 as shown in FIG.
If deformation of the material cannot be prevented only by tension from both ends of the elongated member 8, deformation correction devices 9A and 9B are placed only around the focusing head 4, and the cut surfaces of the focusing head 4 and the elongated member 8 are An even better effect can be achieved by keeping the interval within the acceptable value.

[Effects of the Invention] As described above, in the laser processing method of the present invention, the workpiece is pulled from side to side before being irradiated with the laser beam, and the deformation of the workpiece is removed before the laser beam is irradiated. , processing width such as cutting width, welding width, hardening width, etc. can be made uniform.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram of a laser processing device shown as the present invention,
FIG. 2 is a side sectional view of the vicinity of a condensing head according to another embodiment of the present invention. 1 2... Laser light, 4... Focusing head, 5 Kawa pot metal plate,
7A, 7B... Solid-state equipment.

Claims (1)

[Claims] 16. In a device that processes a workpiece by irradiating the workpiece with a laser beam, tension is applied to the workpiece and the workpiece is processed by irradiating the workpiece with a laser beam. A laser processing method characterized by: 2. A laser processing method characterized by arranging fixing devices on both ends of the workpiece to pull both ends outward.