JPS6039833A - Ｔａ↓２Ｏ↓５薄膜のエツチング方法 - Google Patents

Ｔａ↓２Ｏ↓５薄膜のエツチング方法

Info

Publication number
JPS6039833A
JPS6039833A JP14660583A JP14660583A JPS6039833A JP S6039833 A JPS6039833 A JP S6039833A JP 14660583 A JP14660583 A JP 14660583A JP 14660583 A JP14660583 A JP 14660583A JP S6039833 A JPS6039833 A JP S6039833A
Authority
JP
Japan
Prior art keywords
thin film
etching
gas
plasma
ta2o5
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14660583A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0218577B2 (de
Inventor
Shunji Seki
関　俊司
Takashi Umigami
海上　隆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP14660583A priority Critical patent/JPS6039833A/ja
Publication of JPS6039833A publication Critical patent/JPS6039833A/ja
Publication of JPH0218577B2 publication Critical patent/JPH0218577B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Insulating Materials (AREA)
  • Drying Of Semiconductors (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP14660583A 1983-08-12 1983-08-12 Ｔａ↓２Ｏ↓５薄膜のエツチング方法 Granted JPS6039833A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14660583A JPS6039833A (ja) 1983-08-12 1983-08-12 Ｔａ↓２Ｏ↓５薄膜のエツチング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14660583A JPS6039833A (ja) 1983-08-12 1983-08-12 Ｔａ↓２Ｏ↓５薄膜のエツチング方法

Publications (2)

Publication Number Publication Date
JPS6039833A true JPS6039833A (ja) 1985-03-01
JPH0218577B2 JPH0218577B2 (de) 1990-04-26

Family

ID=15411505

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14660583A Granted JPS6039833A (ja) 1983-08-12 1983-08-12 Ｔａ↓２Ｏ↓５薄膜のエツチング方法

Country Status (1)

Country Link
JP (1) JPS6039833A (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6260634U (de) * 1985-09-30 1987-04-15
JPH0656144U (ja) * 1993-01-08 1994-08-05 株式会社大林組 コンクリート打設用トレミー管

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6260634U (de) * 1985-09-30 1987-04-15
JPH0656144U (ja) * 1993-01-08 1994-08-05 株式会社大林組 コンクリート打設用トレミー管

Also Published As

Publication number Publication date
JPH0218577B2 (de) 1990-04-26

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