JPS6037070U - electrolytic plating equipment - Google Patents
electrolytic plating equipmentInfo
- Publication number
- JPS6037070U JPS6037070U JP12700683U JP12700683U JPS6037070U JP S6037070 U JPS6037070 U JP S6037070U JP 12700683 U JP12700683 U JP 12700683U JP 12700683 U JP12700683 U JP 12700683U JP S6037070 U JPS6037070 U JP S6037070U
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic plating
- plating equipment
- electrolytic
- electrolytic solution
- sludge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の電解メッキ装置の側面図で、第２図は本
考案による電解メッキ装置の一実施例１こよる側面図、
第３図は本考案の実施例である。
図に於いて、２は電解液、３はアノード、４はアノード
パック、５はスラッジ、９は排出パイプ、１０はフィル
ターをそれぞれ示す。FIG. 1 is a side view of a conventional electrolytic plating apparatus, and FIG. 2 is a side view of an embodiment 1 of an electrolytic plating apparatus according to the present invention.
FIG. 3 shows an embodiment of the present invention. In the figure, 2 is an electrolytic solution, 3 is an anode, 4 is an anode pack, 5 is a sludge, 9 is a discharge pipe, and 10 is a filter.
Claims (1)
含む電解液を排出するパイプを接続し、フィルターでス
ラッジを除去した電解液をメッキ槽中に還流せしめるこ
とを特徴とする電解メッキ装置。An electrolytic plating apparatus characterized in that a pipe for discharging an electrolytic solution containing sludge is connected to the bottom of an anode bag that performs electrolytic plating, and the electrolytic solution from which sludge has been removed by a filter is made to flow back into a plating tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12700683U JPS6037070U (en) | 1983-08-17 | 1983-08-17 | electrolytic plating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12700683U JPS6037070U (en) | 1983-08-17 | 1983-08-17 | electrolytic plating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6037070U true JPS6037070U (en) | 1985-03-14 |
Family
ID=30288604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12700683U Pending JPS6037070U (en) | 1983-08-17 | 1983-08-17 | electrolytic plating equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6037070U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03277794A (en) * | 1990-03-28 | 1991-12-09 | Nec Corp | Electrocasting device |
| WO1999032689A1 (en) * | 1997-12-19 | 1999-07-01 | Hideyuki Kobayashi | Anode device in electroplating |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5730920A (en) * | 1980-08-02 | 1982-02-19 | Dainippon Printing Co Ltd | Device for computing tension |
-
1983
- 1983-08-17 JP JP12700683U patent/JPS6037070U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5730920A (en) * | 1980-08-02 | 1982-02-19 | Dainippon Printing Co Ltd | Device for computing tension |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03277794A (en) * | 1990-03-28 | 1991-12-09 | Nec Corp | Electrocasting device |
| WO1999032689A1 (en) * | 1997-12-19 | 1999-07-01 | Hideyuki Kobayashi | Anode device in electroplating |
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