JPS6034831A - Fixing structure of plate cover - Google Patents

Abstract

PURPOSE:To reduce the depth of an electonic component accommodating hole made in a resin molding, by sealing the part corresponding to said hole of a bonding-agent layer interposed between an insulating film and the resin molding, so as to form an electronic component accommodating space by the sealed part and the accommodating hole. CONSTITUTION:A resin molding 5 employed as the body of a thin-type household electric appliance is provided with electronic component accommodating holes 51..., in which electronic components 6 ... are set. The fixing structure of a plate cover 7 is formed by the following method. A sheet-shaped bonding agent, which is rolled up beforehand, is rolled out by a prescribed length and cut away in accorcamce with the shape of the plate cover 7, and a sealing proces is apllied to a non-adherent or weak-adherent bonding agent layer 2. Then, the plate cover 7 is connected by caulking to the resin molding 5 through the intermediary of the sheet-shaped bonding agent processed as described abobe, while the nonadherent bonding or weak-adherent agent layer 2 is welded to the resin molding 5 by heating or by using a solvent.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a fixing structure for a plate cover in a thin home appliance, such as a calculator.

In the case of thin home appliances, as shown in Fig. 1, a plate cover (made of metal) 3' is adhered to a resin molded body 2' having electronic component storage holes 1', . . . with a sheet adhesive 4''. The purpose of using this sheet adhesive 4° is to ensure complete electrical insulation between the electronic component 5' and the plate cover 3' and to fix the plate cover. Adhesive layer 42' on both sides of
, 42" is used.

By the way, in the fixing structure of the plate cover described above, when the plate cover is elastically bent for some reason, the adhesive layer contacts and sticks to the electronic components, and when the cover is released from the bending and returns to its original state. , the electronic components will be subjected to tension. In addition, since electrical insulation is guaranteed by the insulating film, the adhesive layer has little contribution to electrical insulation, and the adhesive layer on human blood is useful not only for electrical insulation but also for adhesive fixation. On the contrary, it is disadvantageous in making the product thinner (it and the thickness of the adhesive layer also become a problem in making the product ultra-thin).

The fixing structure of the plate cover according to the present invention has a configuration that can eliminate the above-mentioned disadvantages, and the plate cover is attached to a resin molded body having an electronic component storage hole, and a sheet-like adhesive is provided with an adhesive layer on both sides of an insulating film. In the structure in which adhesive is used for adhesion, the adhesive layer of the sheet-like adhesive that adheres to the resin molded body side is weakly adhesive or non-adhesive at room temperature, and
The adhesive layer is characterized in that a portion of the adhesive layer that faces the hole is removed.

The present invention will be explained below with reference to the drawings.

FIG. 2 shows the sheet adhesive A used in the present invention.

In Fig. 2, 1 is an insulating film, 2 is a non-adhesive or weakly adhesive (Jr,
3 is a release paper, and 4 is an adhesive layer provided on the other side of the insulating film 1. The purpose of using the release paper 3 is to prevent blocking of the adhesives 2 and 4 when the sheet adhesive is rolled. It can also be made non-adhesive or weakly adhesive at room temperature, in which case the release paper 3 can be omitted.

The insulating film 1 is made of plastyrene film made of polyester, polypropylene, polyethylene, polyvinyl chloride, etc., or a woven or non-woven fabric made of rayon, Japanese paper, polypropylene, polyester, nylon, etc., coated with an electrically insulating resin (e.g., epoxy resin). Impregnated and hardened products can be used, and the thickness is usually: tolzm to 0.
．． 1, and the volume resistivity is 1012 Ωm or more.

The above-mentioned adhesive 2 that is non-tacky or weakly sticky at room temperature includes ■ethylene-vinyl acetate copolymer, ionomer,
Blends of thermoplastic resins such as polyamides and polyesters with resins such as hydrocarbons, rosins, ester rosins, xylene, terpenes, phenols, terpene-phenols, etc., as required; Styrene-butadiene Block copolymer with coumaron resin, styrene resin,
A blend of xylene resin, phenol modified resin, etc. can be used. The softening point of these resins is 80° to 16
It is desirable to adjust the temperature to 0°C. If it is lower than 80'C, it will become sticky at room temperature, and 1
This is because if the temperature is higher than 60°C, a high temperature is required to develop adhesiveness, making it difficult to bond. In the case of (1) above, the blending ratio should be 100 parts by weight or less per 100 parts by weight of the thermoplastic resin, and in the case of (2) above, the blending ratio should be 10 to 60 parts by weight per 100 parts by weight of the styrene-butadiene block copolymer. It is preferable to use parts by weight. This is because if the amount is more than this, it becomes sticky at room temperature and the adhesive properties at high temperatures are also deteriorated, and in the case of (2), if it is less than 10 parts by weight, the adhesive strength is significantly reduced. In order to improve non-stick properties at room temperature, an anti-blocking agent such as wax or fatty acid amide may be added in an amount of 10 parts by weight or less. If more than 10 parts by weight is added, the adhesive strength will be significantly reduced. others,
Anti-aging agents, fillers, stabilizers, pigments, cross-linking agents, etc. can be added as necessary.

The adhesive layer 2, which is non-adhesive or weakly adhesive at room temperature, has unnecessary parts removed by sealing, as described below.
At this time, a nonwoven fabric may be used as a base material and embedded in the adhesive layer to facilitate removal. For the adhesive layer 4, an acrylic-based, rubber-based, or silicone-based adhesive, or a nitrile-based, neoprene-based, ethylene-vinyl acetate-based, or nylon-based adhesive can be used.

The thickness of the adhesive layer 2.4 is 0.02 to 0.2
It's a fin.

The sheet adhesive of the present invention can be produced, for example, as follows.

A non-tacky or weakly sticky adhesive at room temperature is extruded into a film with a thickness of, for example, 50μ, using an extruder, and this is placed on release paper (for example, Daracin paper whose surface has been treated with silicone on both sides). is applied to one side of an insulating film (for example, a polyester film with a thickness of 50 μm) in an adhesive layer, and this combined surface is heated and fused using a hot roll, and then a pressure-sensitive adhesive or heat-activated adhesive is applied to the other side of the insulating film. Simply apply the solution and let it dry. The adhesive layer on the other side of the insulating film can also be provided by transferring an adhesive layer separately formed on a release paper to the other side of the insulating film.

FIG. 3 shows a plate cover fixing structure according to the present invention.

In FIG. 3, reference numeral 5 denotes a resin molded body as a body of a thin home appliance, and has holes 51, . . . for storing electronic components. The electronic components 6, . . . are set in . 7 is a plate cover. A indicates a sheet-like adhesive, 1 is an insulating film, and 4 is an adhesive layer to be adhered to the plate cover 7, for example, a pressure-sensitive adhesive layer. 2 is an adhesive layer that is non-adhesive or weakly adhesive at room temperature, and is adhered to the resin molded body 5 to form the electronic component storage hole 51°...
・The part facing the is removed.

The plate cover fixing structure according to the present invention can be manufactured by any of the following methods.

<Method 1> Roll a sheet of adhesive, unroll it to a predetermined length, cut it to match the shape of the plate cover 7, and seal the non-adhesive or weakly adhesive layer 2. conduct. Afterwards, the plate cover 7 is caulked and bonded to the resin molded body 5 through this processed sheet adhesive, and the non-adhesive or weakly adhesive adhesive layer 2 and the resin molded body 5 are bonded by heating or This is done by fusion using a solvent.

<Method 2> A sheet-like adhesive is adhered to the plate cover original plate in the adhesive layer 4, and then a plate cover is punched out from this original plate (leaving the release paper 3 attached at this stage), Next, the release paper is removed, and the non-adhesive or weakly adhesive layer 2 is sealed. After this processing, the plate cover is caulked to the resin molding, and the non-adhesive or weakly adhesive layer is applied. It is fused to a resin molded body.

The fixing structure of the plate cover according to the present invention has the configuration as described above, and the part of the adhesive layer interposed between the insulating film and the resin molding that corresponds to the electronic component storage hole of the resin molding is Since it is removed (sealed), the electronic component storage space can be formed by the removed portion and the storage hole, and the depth of the storage hole can be made shallow. Therefore, the thickness of the resin molded body can be reduced. Further, even if the electronic component comes into contact with the insulating film surface, which is the surface from which the adhesive is removed, since this insulating film surface is non-adhesive, the aforementioned adhesive tension in the electronic component can be avoided.

Furthermore, in the case of sealing the adhesive layer, since the adhesive layer is non-adhesive or weakly adhesive, the cut piece after making the incision can be easily removed from the insulating film, and the sealing process can be performed easily. is also easy.

[Brief explanation of drawings]

Fig. 1 is an explanatory diagram showing a conventional fixing structure for a plate cover; Fig. 2 is an explanatory diagram showing a sheet adhesive used in the present invention; Fig. 3 is an explanatory diagram showing a fixing structure for a plate cover according to the present invention. It is a diagram. In the figure, 1 is an insulating film, 2 is a non-adhesive or weakly adhesive layer, 4 is an adhesive layer, 5 is a resin molded body, 51.
. . . is a hole for storing electronic components, and 7 is a plate cover. r2fJ γ3fJ

Claims (1)

[Claims] (1) In a structure in which a plate cover is bonded to a resin molded body having an electronic component storage hole using a sheet adhesive with an adhesive layer provided on both sides of an insulating film, the sheet adhesive is bonded to the resin molded body side of the sheet adhesive. A fixing structure for a plate cover, characterized in that the adhesive layer is weakly adhesive or non-adhesive at room temperature, and a portion of the adhesive layer facing the hole is removed.