JPH0747914Y2 - Printed circuit board mounting structure for electrical components - Google Patents
Printed circuit board mounting structure for electrical componentsInfo
- Publication number
- JPH0747914Y2 JPH0747914Y2 JP1989152216U JP15221689U JPH0747914Y2 JP H0747914 Y2 JPH0747914 Y2 JP H0747914Y2 JP 1989152216 U JP1989152216 U JP 1989152216U JP 15221689 U JP15221689 U JP 15221689U JP H0747914 Y2 JPH0747914 Y2 JP H0747914Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- electric component
- adhesive
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Adhesive Tapes (AREA)
Description
【考案の詳細な説明】 （産業上の利用分野） この考案は、ロータリートランス等の電気部品へのプリ
ント基板の取付構造に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to a structure for mounting a printed circuit board on an electric component such as a rotary transformer.
（従来の技術） 従来、電気部品にプリント基板を取付けるには、電気部
品における基板取付部分に合成ゴム系接着剤を塗布し
て、この部分にプリント基板を取付けて固定していた。(Prior Art) Conventionally, in order to attach a printed circuit board to an electric component, a synthetic rubber adhesive is applied to a substrate mounting portion of the electric component, and the printed circuit board is attached and fixed to this portion.
（考案が解決しようとする課題） ところが、上記の従来の電気部品へのプリント基板の取
付方法においては、接着剤が乾燥するのに時間がかかる
といった問題点があった。(Problems to be Solved by the Invention) However, the conventional method of mounting a printed circuit board on an electric component has a problem that it takes time for the adhesive to dry.
更に、電気部品への接着剤の塗布厚が一様にならず、こ
の作業に熟練を要し、しかも接着の信頼性が乏しいとい
った問題点があった。Further, there is a problem that the coating thickness of the adhesive on the electric parts is not uniform, skill is required for this work, and the adhesion reliability is poor.
この考案の課題は、上記従来の問題点を解決することで
ある。An object of this invention is to solve the above-mentioned conventional problems.
すなわち、電気部品へのプリント基板の取付け時間を短
縮することができ、しかも確実な取付けが行われ、取付
け状態の信頼性を向上させることができる電気部品への
プリント基板の取付構造を提供することである。That is, it is possible to provide a structure for mounting a printed circuit board on an electric component, which can shorten the mounting time of the printed circuit board on the electric component, can be surely mounted, and can improve the reliability of the mounting state. Is.
（課題を解決するための手段） この考案は、上記課題を解決するために、不織布からな
る基材の中間層を除く部分に熱活性型の接着剤を含浸さ
せることによって両面に接着剤層が形成された両面接着
テープを介して、電気部品にプリント基板が取付けられ
たものとした。(Means for Solving the Problem) In order to solve the above-mentioned problems, the present invention has a method in which a heat-activatable adhesive is impregnated in a portion of a base material made of a non-woven fabric excluding an intermediate layer to form an adhesive layer The printed board was attached to the electric component through the formed double-sided adhesive tape.
（作用） 両面接着テープを用いて電気部品にプリント基板を取付
けるようにしたから、従来のもののように溶剤の乾燥時
間を必要とせず、取付け時間の短縮を図ることができ
る。(Operation) Since the printed circuit board is attached to the electric component by using the double-sided adhesive tape, it is possible to shorten the attaching time without requiring the drying time of the solvent unlike the conventional one.
また、両面接着テープにおける不織布からなる基材に接
着剤が含浸していない部分があるので、電気部品にこの
両面接着テープを介して取付けられたプリント基板に外
力がかかったときに、応力が集中しにくく、したがって
プリント基板が剥がれにくい。In addition, since there is a part of the double-sided adhesive tape that is not made of non-woven fabric that is not impregnated with adhesive, stress concentrates when external force is applied to the printed circuit board that is attached to the electrical parts via this double-sided adhesive tape. It is difficult to do so that the printed circuit board does not come off easily.
更に、両面接着テープにおける不織布からなる基材の中
間層に接着剤が含浸されていないことによって、この部
分がクッション性を有し、電気部品における基板取付け
部分が粗面であっても接着性がよくなる。Furthermore, since the intermediate layer of the non-woven fabric base material in the double-sided adhesive tape is not impregnated with an adhesive, this part has cushioning properties, and even if the board mounting part of the electrical component is a rough surface, the adhesiveness is high. Get better.
（実施例） 以下、この考案に係る電気部品へのプリント基板の取付
構造の実施例について、図面に基づいて説明する。(Embodiment) An embodiment of a structure for mounting a printed circuit board on an electric component according to the present invention will be described below with reference to the drawings.
第１図はこの考案に係る電気部品へのプリント基板の取
付構造を示す斜視図であって、ロータリートランスの配
線ターミナル部分にプリント配線基板を取付ける一例を
示すものである。第２図はその一部の正面図、第３図は
その平面図、第４図はその取付構造に使用される両面接
着テープの断面図、第４図乃至第７図は両面接着テープ
による電気部品へのプリント基板の取付構造における取
付工程を示す説明図である。FIG. 1 is a perspective view showing a mounting structure of a printed circuit board on an electric component according to the present invention, showing an example of mounting the printed circuit board on a wiring terminal portion of a rotary transformer. 2 is a front view of a part thereof, FIG. 3 is a plan view thereof, FIG. 4 is a cross-sectional view of a double-sided adhesive tape used for its mounting structure, and FIGS. It is explanatory drawing which shows the attachment process in the attachment structure of the printed circuit board to a component.
この考案に係る電気部品へのプリント基板の取付構造
は、第４図に示すような、不織布からなる基材11の中間
層を除く部分に熱活性型の接着剤を含浸させることによ
って両面に接着剤層12,12を形成し、前記中間層に熱活
性型の接着剤が含浸されていない部分11aを有する両面
接着テープ１を介して、電気部品２にプリント基板３を
取付けるようにしたものである。The structure for mounting a printed circuit board on an electric component according to the present invention has a structure in which a base material 11 made of a non-woven fabric is bonded to both surfaces by impregnating a portion other than the intermediate layer with a heat-activatable adhesive as shown in FIG. The printed circuit board 3 is attached to the electric component 2 through the double-sided adhesive tape 1 having the agent layers 12 and 12 and the intermediate layer having the portion 11a not impregnated with the heat-activatable adhesive. is there.
接着剤層12は、アクリル酸ブチルを主体として、官能基
にアクリル酸を共重合した固型分20％、粘度4000cps、
溶剤が酢酸エチルであるアクリル酸エステル共重合体が
100重量部に対し、ポリビニルピロリドが30重量部と酢
酸ビニルが70重量部の共重合体（固型分50％、エタノー
ル溶剤を使用したもの）を13重量部混合したものを、シ
リコン離型処理した離型紙14上に乾燥後の厚さが45μに
なるように塗布して乾燥したものである。The adhesive layer 12 is composed mainly of butyl acrylate and has a solid content of 20% obtained by copolymerizing acrylic acid with a functional group and a viscosity of 4000 cps.
Acrylic ester copolymer whose solvent is ethyl acetate
A mixture of 13 parts by weight of a copolymer of polyvinyl pyrrolide (30 parts by weight) and vinyl acetate (70 parts by weight) (solid content: 50%, using an ethanol solvent) was mixed with 100 parts by weight of silicone. It is applied to the treated release paper 14 so as to have a thickness after drying of 45 μm and dried.
ここで使用される熱活性型の接着剤層12としては、アク
リル酸エステル系の他にエチレン−酢酸ビニル共重合体
系、エチレン−アクリレート共重合体系、エチレン−イ
ソブチルアクリレート共重合体系、スチレン−ブタジエ
ン共重合体系、スチレン−イソプレン共重合体系、ポリ
ブタジエン系、ポリイソブチレン系等があり、必要に応
じて粘着付与剤等を添加してもよい。このような熱活性
型の接着剤層を使用することにより、常温では接着性を
もたないので所定の形状に打ち抜く作業や取扱いが非常
に容易となる。Examples of the heat-activatable adhesive layer 12 used here include ethylene-vinyl acetate copolymers, ethylene-acrylate copolymers, ethylene-isobutyl acrylate copolymers, and styrene-butadiene copolymers in addition to acrylic ester-based adhesives. There are a polymer system, a styrene-isoprene copolymer system, a polybutadiene system, a polyisobutylene system, and the like, and a tackifier or the like may be added if necessary. By using such a heat-activatable adhesive layer, since it does not have adhesiveness at room temperature, the work of punching into a predetermined shape and the handling are very easy.
本実施例においては、第４図に示すように離型紙14に塗
布された接着剤層12の面を重量13g/m2で厚さが40μの不
織布からなる基材11に表裏両面から貼り合わせて、約10
0℃に加熱した２個の熱ロール間で両側の離型紙14,14の
表面から加熱圧着しながら熱ロールを通過させることに
より、熱活性型の接着剤を溶融させて、基材11の中間層
11aを除く部分に接着剤が含浸するように圧着して得ら
れる両面接着テープ１を使用した。In this embodiment, as shown in FIG. 4, the surface of the adhesive layer 12 applied to the release paper 14 was attached to the base material 11 made of a nonwoven fabric having a weight of 13 g / m 2 and a thickness of 40 μ from both front and back surfaces. About 10
The heat-activatable adhesive is melted by passing through the heat rolls from the surfaces of the release papers 14 and 14 on both sides between the two heat rolls heated to 0 ° C. while heating and pressure bonding, and the intermediate of the base material 11 is melted. layer
The double-sided adhesive tape 1 obtained by press-bonding so that the portion excluding 11a was impregnated with the adhesive was used.
この両面接着テープ１の厚みは110μとなった。尚、接
着剤が含浸されていない部分11aは厚み10μである。基
材11の中間層11aを除く部分にのみ接着剤を含浸させる
には、上記のように離型紙14上に接着剤層12が形成され
てなる接着シートと基材11とを加熱圧着する際、熱ロー
ルの間隙を接着シート２枚の厚みより若干広げて圧着力
を低めることにより行われる。尚、第４図において、符
号14,14は両面接着テープ１の表裏両面に貼着され接着
剤層12を保護するための離型紙であって、この両面接着
テープ１をプリント基板３と電気部品２との間に介する
前に、この離型紙14,14は取り除かれるものである。The thickness of this double-sided adhesive tape 1 was 110 μm. The portion 11a not impregnated with the adhesive has a thickness of 10μ. In order to impregnate the base material 11 with the adhesive only in the part excluding the intermediate layer 11a, the adhesive sheet having the adhesive layer 12 formed on the release paper 14 and the base material 11 are heated and pressure bonded as described above. This is performed by slightly expanding the gap between the heat rolls from the thickness of the two adhesive sheets to reduce the pressure bonding force. In FIG. 4, reference numerals 14 and 14 denote release papers which are attached to both front and back surfaces of the double-sided adhesive tape 1 to protect the adhesive layer 12. The double-sided adhesive tape 1 is used for the printed circuit board 3 and electrical parts. The release paper 14, 14 is to be removed before it is inserted between the two.
そして、この両面接着テープ１を電気部品２であるフェ
ライト製のロータリートランスとポリイミド製のプリン
ト基板３の間に挟んで140℃、30秒、2kg/cm2の条件で熱
圧着して固定した。Then, the double-sided adhesive tape 1 was sandwiched between a rotary transformer made of ferrite, which is an electric component 2, and a printed circuit board 3 made of polyimide, and thermocompression bonded under the conditions of 140 ° C., 30 seconds and 2 kg / cm 2 to be fixed.
また、プリント基板３に両面接着テープ１を取付け、更
に、これを電気部品２に取付ける方法としては、第５図
乃至第７図に示すようにして行う方法をとる。As a method of attaching the double-sided adhesive tape 1 to the printed circuit board 3 and further attaching it to the electric component 2, the method shown in FIGS. 5 to 7 is used.
すなわち、まず、プリント基板３に一方の離型紙14を取
り除いた状態で、熱ロールR,Rによって熱ラミネートし
ておく（第５図参照）。その後に、他方の離型紙14を残
して、プリント基板３と両面接着テープ１のみをハーフ
カットする（第６図参照）。そして、このようにしてハ
ーフカットしたプリント基板３と両面接着テープ１から
離型紙14を取り除き、電気部品２にプレスＰによって熱
プレスして取付ける（第７図参照）。That is, first, one release paper 14 is removed from the printed circuit board 3 and heat laminated by the heat rolls R and R (see FIG. 5). After that, only the printed board 3 and the double-sided adhesive tape 1 are half-cut while leaving the other release paper 14 (see FIG. 6). Then, the release paper 14 is removed from the printed circuit board 3 and the double-sided adhesive tape 1 half-cut in this way, and is attached to the electric component 2 by hot pressing with the press P (see FIG. 7).
次に、この考案における上記実施例の取付構造における
効果を明確にするために実施した２つの比較例について
述べる。Next, two comparative examples carried out in order to clarify the effect of the mounting structure of the above embodiment of the present invention will be described.
第１の比較例としては、アクリル酸ブチルを主体とし
て、官能基にアクリル酸を共重合した固型分20％、粘度
4000cps、溶剤が酢酸エチルであるアクリル酸エステル
共重合体が100重量部に対し、ポリビニルピロリドンが3
0重量部と酢酸ビニルが70重量部の共重合体（固型分50
％、エタノール溶剤を使用したもの）を13重量部混合
し、シリコン離型処理した離型紙上に、乾燥後の厚さが
45μになるように塗布して乾燥、剥離して支持体無しの
接着シートを作成した。As a first comparative example, butyl acrylate was the main component, and acrylic acid was copolymerized with the functional group to give a solid content of 20% and a viscosity.
4000 cps, 100 parts by weight of acrylic acid ester copolymer whose solvent is ethyl acetate, polyvinylpyrrolidone 3
Copolymer of 0 parts by weight and 70 parts by weight of vinyl acetate (solid content 50
%, Using an ethanol solvent), and the thickness after drying is
It was applied so as to have a thickness of 45 μm, dried, and peeled off to prepare an adhesive sheet without a support.
そして、この接着シートを電気部品２であるフェライト
製のロータリートランスとポリイミド製のプリント基板
３の間に挟んで140℃、30秒、2kg/cm2の条件で熱圧着し
て固定した。Then, this adhesive sheet was sandwiched between a rotary transformer made of ferrite, which is an electric component 2, and a printed circuit board 3 made of polyimide, and thermocompression bonded under the conditions of 140 ° C., 30 seconds and 2 kg / cm 2 to be fixed.
また、第２の比較例として、従来行われていたように、
市販の合成ゴム系接着剤（固型分30％、粘度2000cps、
溶剤としてトルエンを使用したもの）を、電気部品２で
あるフェライト製のロータリートランスに刷毛で塗布し
て３分間乾燥した後、この部分にプリント基板３を貼り
合わせて、1kgの重りを２分間乗せて圧着固定した。Further, as a second comparative example, as has been conventionally performed,
Commercially available synthetic rubber adhesive (solid content 30%, viscosity 2000 cps,
After applying toluene as a solvent) to a ferrite rotary transformer that is an electric component 2 with a brush and drying for 3 minutes, the printed circuit board 3 is stuck to this portion and a 1 kg weight is placed for 2 minutes. It was crimped and fixed.
そして、次に、上記したこの考案における実施例のも
の、及びこの考案に対する第１の比較例のものと第２の
比較例のものそれぞそれについて接着強度を測定した。Then, the adhesive strength was measured for each of the example of the present invention described above, and the first comparative example and the second comparative example for the present invention.
その結果を、次の表に示す。The results are shown in the table below.
上記の表で明らかなように、従来熟練者が３分〜５分か
かっていた電気部品２へのプリント基板３の取付け固定
が、この考案におけるものでは熱プレス機を使用して30
秒〜１分以内に取付け固定できるようになった。 As is clear from the above table, the mounting and fixing of the printed circuit board 3 to the electric component 2, which has conventionally required 3 to 5 minutes by a skilled person, can be performed by using a heat press machine in this invention.
It can be installed and fixed within seconds to 1 minute.
更に、この考案における実施例のものは、第１の比較例
のものと第２の比較例のものとに対して、接着強度のば
らつきが少なくなり、不織布からなる基材11の中間部に
接着剤が含浸していない部分11aを設けているために、
外力が作用したときに接着界面に応力が集中しないの
で、すぐには剥がれないといった特徴があり、接着の信
頼性が大幅に向上されるといった効果が発揮される。Further, the embodiment of the present invention has less variation in adhesive strength than the first comparative example and the second comparative example, and adheres to the intermediate portion of the base material 11 made of nonwoven fabric. Since the portion 11a not impregnated with the agent is provided,
Since stress does not concentrate on the adhesive interface when an external force is applied, it has the characteristic that it does not peel off immediately, and the effect of greatly improving the reliability of the adhesive is exhibited.
しかも、不織布からなる基材11の中間部に接着剤が含浸
していない部分11aが設けられているために、この部分
がクッション性を有し、電気部品２の粗面への接着力が
向上されるものである。In addition, since the portion 11a which is not impregnated with the adhesive is provided in the intermediate portion of the base material 11 made of non-woven fabric, this portion has a cushioning property, and the adhesive force to the rough surface of the electric component 2 is improved. It is what is done.
（考案の効果） 以上説明したように、この考案によれば、電気部品への
プリント基板の取付け時間を短縮することができ、しか
も確実な取付けが行われ、取付け状態の信頼性を向上さ
せることができる効果を奏する。(Effects of the Invention) As described above, according to the present invention, it is possible to shorten the mounting time of the printed circuit board to the electric component, and moreover, the reliable mounting is performed and the reliability of the mounting state is improved. There is an effect that can.
また、両面接着テープにおける不織布からなる基材に接
着剤が含浸していない部分があるので、電気部品にこの
両面接着テープを介して取付けられたプリント基板に外
力がかかったときに、応力が集中しにくく、したがって
プリント基板が剥がれにくく、しかもクッション性を有
するので、電気部品の粗面への接着力が向上されるとい
った効果を奏する。In addition, since there is a part of the double-sided adhesive tape that is not made of non-woven fabric that is not impregnated with adhesive, stress concentrates when external force is applied to the printed circuit board that is attached to the electrical parts via this double-sided adhesive tape. Since the printed circuit board is difficult to peel off and has a cushioning property, the adhesive strength to the rough surface of the electric component is improved.
第１図はこの考案に係る電気部品へのプリント基板の取
付構造の一実施例を示す斜視図、第２図はその一部の正
面図、第３図はその一部の平面図、第４図はその取付構
造に使用される両面接着テープの断面図、第５図乃至第
７図は両面接着テープによる電気部品へのプリント基板
の取付構造における取付工程を示す説明図である。 １……両面接着テープ 11……基材 11a……接着剤が含浸していない部分 12……接着剤層 ２……電気部品 ３……プリント基板FIG. 1 is a perspective view showing an embodiment of a structure for mounting a printed circuit board on an electric component according to the present invention, FIG. 2 is a front view of a part thereof, FIG. 3 is a plan view of a part thereof, and FIG. FIG. 5 is a cross-sectional view of a double-sided adhesive tape used for the mounting structure, and FIGS. 5 to 7 are explanatory views showing a mounting process in a structure for mounting a printed circuit board on an electric component by the double-sided adhesive tape. 1 …… Double-sided adhesive tape 11 …… Base material 11a …… Part not impregnated with adhesive 12 …… Adhesive layer 2 …… Electrical component 3 …… Printed circuit board
フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 7/12 Ｍ 7301−4Ｅ Continuation of front page (51) Int.Cl. 6 Identification number Office reference number FI technical display location H05K 7/12 M 7301-4E
Claims (1)
熱活性型の接着剤を含浸させることによって両面に接着
剤層が形成された両面接着テープを介して、電気部品に
プリント基板が取付けられたことを特徴とする電気部品
へのプリント基板の取付構造。1. A printed circuit board is attached to an electric component through a double-sided adhesive tape having an adhesive layer formed on both sides by impregnating a portion of a non-woven fabric substrate excluding an intermediate layer with a heat-activatable adhesive. A structure for mounting a printed circuit board on an electric component, which is characterized by being mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989152216U JPH0747914Y2 (en) | 1989-12-28 | 1989-12-28 | Printed circuit board mounting structure for electrical components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989152216U JPH0747914Y2 (en) | 1989-12-28 | 1989-12-28 | Printed circuit board mounting structure for electrical components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0390490U JPH0390490U (en) | 1991-09-13 |
| JPH0747914Y2 true JPH0747914Y2 (en) | 1995-11-01 |
Family
ID=31698488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989152216U Expired - Lifetime JPH0747914Y2 (en) | 1989-12-28 | 1989-12-28 | Printed circuit board mounting structure for electrical components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0747914Y2 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61177419U (en) * | 1985-04-25 | 1986-11-05 | ||
| JPH0356071Y2 (en) * | 1987-02-27 | 1991-12-16 | ||
| JPS6452247U (en) * | 1987-09-26 | 1989-03-31 |
-
1989
- 1989-12-28 JP JP1989152216U patent/JPH0747914Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0390490U (en) | 1991-09-13 |
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Legal Events
| Date | Code | Title | Description |
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| EXPY | Cancellation because of completion of term |